Modulation-Doped Field Effect Transistor [MODFET]

Industry

CPC
H01L2924/1309

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1309Modulation-Doped Field Effect Transistor [MODFET]

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Multi-typed integrated passive device (IPD) components and devices...
- Patent number 12,230,614
- Issue date Feb 18, 2025
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 12,218,098
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved performance in operation and imp...
- Patent number 12,218,029
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 12,211,817
- Issue date Jan 28, 2025
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient liquid phase bonding compositions and power electronics a...
- Patent number 12,208,448
- Issue date Jan 28, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Packaging structure of power semiconductor module
- Patent number 12,205,872
- Issue date Jan 21, 2025
- STARPOWER SEMICONDUCTOR LTD.
- Danting Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,205,851
- Issue date Jan 21, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride circuit board and electronic component module
- Patent number 12,199,005
- Issue date Jan 14, 2025
- DENKA COMPANY LIMITED
- Seiji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated power switching device heat sink
- Patent number 12,199,020
- Issue date Jan 14, 2025
- American Axle & Manufacturing, Inc.
- James P. Downs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,199,022
- Issue date Jan 14, 2025
- Fuji Electric Co., Ltd.
- Masayoshi Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact power module
- Patent number 12,199,071
- Issue date Jan 14, 2025
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including surface pressure absorbing member fo...
- Patent number 12,191,218
- Issue date Jan 7, 2025
- Mitsubishi Electric Corporation
- Arata Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,191,266
- Issue date Jan 7, 2025
- Kabushiki Kaisha Toshiba
- Emiko Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance improvement and stress reduction in semiconduct...
- Patent number 12,191,264
- Issue date Jan 7, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a multi-chip assembly
- Patent number 12,191,296
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ling Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,663
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on standard commodity FPGA IC Chips using non-vol...
- Patent number 12,176,901
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Half-bridge module for an inverter of an electric drive of an elect...
- Patent number 12,176,316
- Issue date Dec 24, 2024
- ZF Friedrichshafen AG
- Manuel Raimann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 12,165,989
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices including backside power rails and m...
- Patent number 12,166,016
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,737
- Issue date Nov 19, 2024
- Mitsubishi Electric Corporation
- Kazuto Mikami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND PREPARATION METHOD THEREOF, THREE-DIMENSIONA...
- Publication number 20250054888
- Publication date Feb 13, 2025
- Huawei Technologies Co., Ltd
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...
- Publication number 20250056880
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...
- Publication number 20250046685
- Publication date Feb 6, 2025
- Siliconix Incorporated
- Barry LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046758
- Publication date Feb 6, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takashi OHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20250048687
- Publication date Feb 6, 2025
- Kabushiki Kaisha Toshiba
- Hiroki OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046759
- Publication date Feb 6, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takeshi IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package and Manufacturing Method Thereof
- Publication number 20250038096
- Publication date Jan 30, 2025
- DIODES INCORPORATED
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038056
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY
- Publication number 20250040231
- Publication date Jan 30, 2025
- Intel Corporation
- Han Wui THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038055
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...
- Publication number 20250022840
- Publication date Jan 16, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Lasse Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Manufacturing Thereof
- Publication number 20250022780
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Package With Galvanic Isolation
- Publication number 20250014971
- Publication date Jan 9, 2025
- Infineon Technologies Austria AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...
- Publication number 20250014987
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION...
- Publication number 20250014972
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Tomasz NAEVE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF PRODUCING A POWER SEMICOND...
- Publication number 20250006601
- Publication date Jan 2, 2025
- INFINEON TECHNOLOGIES AG
- Achim Althaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES INCLUDING BACKSIDE POWER RAILS AND M...
- Publication number 20250006705
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES
- Publication number 20250006603
- Publication date Jan 2, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429206
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Yuichiro HINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH TOP CHIP INCLUDING SCHOTT...
- Publication number 20240429208
- Publication date Dec 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Anupam Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...
- Publication number 20240429140
- Publication date Dec 26, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240429147
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429154
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRU...
- Publication number 20240429164
- Publication date Dec 26, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421022
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Hirokatsu UMEGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240421049
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Takeshi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Modulation-Doped Field Effect Transistor [MODFET]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-typed integrated passive device (IPD) components and devices...

Semiconductor device and method of forming micro interconnect struc...

Chip assembling on adhesion layer or dielectric layer, extending be...

Semiconductor device with improved performance in operation and imp...

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method for semiconductor device

Transient liquid phase bonding compositions and power electronics a...

Packaging structure of power semiconductor module

Radio-frequency switching devices having improved voltage handling...

3D semiconductor devices and structures with metal layers

Silicon nitride circuit board and electronic component module

Integrated power switching device heat sink

Semiconductor module

Compact power module

Semiconductor device including surface pressure absorbing member fo...

Semiconductor device and manufacturing method of semiconductor device

Thermal performance improvement and stress reduction in semiconduct...

Method of producing a multi-chip assembly

Semiconductor device

Logic drive based on standard commodity FPGA IC Chips using non-vol...

Half-bridge module for an inverter of an electric drive of an elect...

Semiconductor device

Semiconductor package with electromagnetic interference shielding

Single-shot encapsulation

Packaged semiconductor devices including backside power rails and m...

Semiconductor device with lead between a plurality of encapsulated...

Methods for producing a 3D semiconductor memory device and structure

Semiconductor device

Gallium nitride (GAN) three-dimensional integrated circuit technology

Semiconductor device and method of forming ultra high density embed...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT AND PREPARATION METHOD THEREOF, THREE-DIMENSIONA...

METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...

METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor Chip Package and Manufacturing Method Thereof

Submounts with Stud Protrusions for Semiconductor Packages

GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY

Submounts with Stud Protrusions for Semiconductor Packages

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...

Semiconductor Devices and Methods for Manufacturing Thereof

Power Package With Galvanic Isolation

INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...

PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION...

POWER SEMICONDUCTOR MODULE AND METHOD OF PRODUCING A POWER SEMICOND...

PACKAGED SEMICONDUCTOR DEVICES INCLUDING BACKSIDE POWER RAILS AND M...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH TOP CHIP INCLUDING SCHOTT...

SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRU...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE