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molding

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Industry

  • CPC
  • B41J2/1637
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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B41Printing, stamps B41JTYPEWRITERS SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed

Current Industry

B41J2/1637molding
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Inkjet recording head and method for producing same
    • Patent number 12,059,897
    • Issue date Aug 13, 2024
    • Canon Kabushiki Kaisha
    • Isao Imamura
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Coplanar modular printbars
    • Patent number 11,975,468
    • Issue date May 7, 2024
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Liquid discharge cartridge manufacturing method
    • Patent number 11,833,822
    • Issue date Dec 5, 2023
    • Canon Kabushiki Kaisha
    • Shuichi Hasegawa
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Applying mold chase structure to end portion of fluid ejection die
    • Patent number 11,827,021
    • Issue date Nov 28, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Three-dimensional features formed in molded panel
    • Patent number 11,807,523
    • Issue date Nov 7, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Molded substrates
    • Patent number 11,784,072
    • Issue date Oct 10, 2023
    • Hewlett-Packard Development Company, L.P.
    • Michael Wayne Cumbie
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Printing element and method for manufacturing same
    • Patent number 11,772,378
    • Issue date Oct 3, 2023
    • Canon Kabushiki Kaisha
    • Atsushi Omura
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection device with break(s) in cover layer
    • Patent number 11,745,507
    • Issue date Sep 5, 2023
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection polymeric recirculation channel
    • Patent number 11,597,204
    • Issue date Mar 7, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluidic die assemblies with rigid bent substrates
    • Patent number 11,548,287
    • Issue date Jan 10, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Molded printhead
    • Patent number 11,541,659
    • Issue date Jan 3, 2023
    • Hewlett-Packard Development Company, L.P.
    • Silam J. Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Molding a fluid flow structure
    • Patent number 11,426,900
    • Issue date Aug 30, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection device with a carrier having a slot
    • Patent number 11,390,081
    • Issue date Jul 19, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Monolithic carrier structure for digital dispensing
    • Patent number 11,364,492
    • Issue date Jun 21, 2022
    • Hewlett-Packard Development Company, L.P.
    • Jeffrey A. Nielsen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Curved fluid ejection devices
    • Patent number 11,351,787
    • Issue date Jun 7, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Print head interposers
    • Patent number 11,325,378
    • Issue date May 10, 2022
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Molded die slivers with exposed front and back surfaces
    • Patent number 11,292,257
    • Issue date Apr 5, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection die interlocked with molded body
    • Patent number 11,214,065
    • Issue date Jan 4, 2022
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Conductive elements electrically coupled to fluidic dies
    • Patent number 11,186,082
    • Issue date Nov 30, 2021
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection device
    • Patent number 11,186,090
    • Issue date Nov 30, 2021
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Liquid ejection head, liquid ejection module, and method of manufac...
    • Patent number 11,179,935
    • Issue date Nov 23, 2021
    • Canon Kabushiki Kaisha
    • Yoshiyuki Nakagawa
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Three-dimensional features formed in molded panel
    • Patent number 11,148,942
    • Issue date Oct 19, 2021
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Die contact formations
    • Patent number 11,135,839
    • Issue date Oct 5, 2021
    • Hewlett-Packard Development Company, L.P.
    • Michael W Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Molded fluid flow structure
    • Patent number 11,130,339
    • Issue date Sep 28, 2021
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Printhead assembly
    • Patent number 11,117,376
    • Issue date Sep 14, 2021
    • Hewlett-Packard Development Company, L.P.
    • Si-lam J. Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection die molded into molded body
    • Patent number 11,097,537
    • Issue date Aug 24, 2021
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Method of manufacturing a liquid ejection head
    • Patent number 11,065,874
    • Issue date Jul 20, 2021
    • Canon Kabushiki Kaisha
    • Naoko Shimizu
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Fluid ejection die heat exchangers
    • Patent number 11,046,073
    • Issue date Jun 29, 2021
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Printhead
    • Patent number 11,020,967
    • Issue date Jun 1, 2021
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Manufacturing method of liquid supply component
    • Patent number 11,014,361
    • Issue date May 25, 2021
    • Canon Kabushiki Kaisha
    • Yasuaki Kitayama
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents