Molybdenum (Mo) as principal constituent

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H01L2224/8548

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8548Molybdenum (Mo) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit packages including modules that include at least one integr...
- Patent number 10,178,786
- Issue date Jan 8, 2019
- Honeywell International Inc.
- James L. Tucker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic wireless transmission device
- Patent number 9,768,518
- Issue date Sep 19, 2017
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Charles Souriau
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stacking arrangement for integration of multiple integrated circuits
- Patent number 9,741,644
- Issue date Aug 22, 2017
- Honeywell International Inc.
- Romney R. Katti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded antenna and semiconductor die on a substrate in a laminate...
- Patent number 6,818,985
- Issue date Nov 16, 2004
- Skyworks Solutions, Inc.
- Roberto Coccioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming custom planar metal bonding pad connectors for s...
- Patent number 5,445,994
- Issue date Aug 29, 1995
- Micron Technology, Inc.
- Terry L. Gilton
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230178518
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Raehyung DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...
- Publication number 20140252640
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Min-Keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC WIRELESS TRANSMISSION DEVICE
- Publication number 20130293428
- Publication date Nov 7, 2013
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Jean-Charles SOURIAU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS
- Publication number 20130001761
- Publication date Jan 3, 2013
- Philip E. Rogren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090215259
- Publication date Aug 27, 2009
- PETARI INCORPORATION
- Kye Nam LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070296081
- Publication date Dec 27, 2007
- Kye Nam Lee
- H01 - BASIC ELECTRIC ELEMENTS