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Molybdenum (Mo) as principal constituent
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CPC
H01L2224/8548
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/8548
Molybdenum (Mo) as principal constituent
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last 30 patents
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Patent Grant
Light emitting device and light emitting module
Patent number
10,297,716
Issue date
May 21, 2019
LG Innotek Co., Ltd
Shuhei Matsuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit packages including modules that include at least one integr...
Patent number
10,178,786
Issue date
Jan 8, 2019
Honeywell International Inc.
James L. Tucker
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Microelectronic wireless transmission device
Patent number
9,768,518
Issue date
Sep 19, 2017
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Jean-Charles Souriau
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Stacking arrangement for integration of multiple integrated circuits
Patent number
9,741,644
Issue date
Aug 22, 2017
Honeywell International Inc.
Romney R. Katti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded antenna and semiconductor die on a substrate in a laminate...
Patent number
6,818,985
Issue date
Nov 16, 2004
Skyworks Solutions, Inc.
Roberto Coccioli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming custom planar metal bonding pad connectors for s...
Patent number
5,445,994
Issue date
Aug 29, 1995
Micron Technology, Inc.
Terry L. Gilton
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230178518
Publication date
Jun 8, 2023
Samsung Electronics Co., Ltd.
Raehyung DO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...
Publication number
20140252640
Publication date
Sep 11, 2014
Samsung Electronics Co., Ltd.
Min-Keun Kwak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC WIRELESS TRANSMISSION DEVICE
Publication number
20130293428
Publication date
Nov 7, 2013
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
Jean-Charles SOURIAU
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS
Publication number
20130001761
Publication date
Jan 3, 2013
Philip E. Rogren
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20090215259
Publication date
Aug 27, 2009
PETARI INCORPORATION
Kye Nam LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20070296081
Publication date
Dec 27, 2007
Kye Nam Lee
H01 - BASIC ELECTRIC ELEMENTS