Molybdenum (Mo) as principal constituent

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CPC
H01L2224/4518

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4518Molybdenum (Mo) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,342,299
- Issue date May 24, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Nanostructure barrier for copper wire bonding
- Patent number 11,127,515
- Issue date Sep 21, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of packaging structure
- Patent number 10,950,525
- Issue date Mar 16, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Zhong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanostructure barrier for copper wire bonding
- Patent number 10,629,334
- Issue date Apr 21, 2020
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and fabrication method thereof
- Patent number 10,446,474
- Issue date Oct 15, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Zhong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus
- Patent number 10,374,136
- Issue date Aug 6, 2019
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint recognition chip packaging structure and packaging method
- Patent number 10,133,907
- Issue date Nov 20, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting device mount, leadframe, and light emitting apparatus
- Patent number 10,115,876
- Issue date Oct 30, 2018
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint recognition chip packaging structure and packaging method
- Patent number 10,108,837
- Issue date Oct 23, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device and method of fabricating an electronic device
- Patent number 9,756,726
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device mount, leadframe, and light emitting apparatus
- Patent number 9,583,688
- Issue date Feb 28, 2017
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented bond pads and methods of fabrication thereof
- Patent number 9,543,260
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire structure and semiconductor device having the same, and method...
- Patent number 9,373,602
- Issue date Jun 21, 2016
- Samsung Electronics Co., Ltd.
- Eun-kyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire method
- Patent number 9,245,670
- Issue date Jan 26, 2016
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device
- Patent number 8,901,569
- Issue date Dec 2, 2014
- Nippon Steel & Sumitomo Metal Corporation
- Hosei Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire structure and method
- Patent number 8,692,118
- Issue date Apr 8, 2014
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 8,558,383
- Issue date Oct 15, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stacked body and method of manufacturing the same
- Patent number 8,394,678
- Issue date Mar 12, 2013
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 8,217,269
- Issue date Jul 10, 2012
- Raytheon Company
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for composite bond wires
- Patent number 8,134,073
- Issue date Mar 13, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chris Wyland
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Printed circuit board for harsh environments
- Patent number 8,076,587
- Issue date Dec 13, 2011
- SIEMENS ENERGY, INC.
- David J. Mitchell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated body of semiconductor chips including pads mutually conne...
- Patent number 8,058,717
- Issue date Nov 15, 2011
- Shinko Electric Industries Co., Ltd.
- Akihito Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 8,026,447
- Issue date Sep 27, 2011
- Raytheon Sarcos, LLC
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level integrated circuit package with top and bottom side ele...
- Patent number 8,018,065
- Issue date Sep 13, 2011
- Atmel Corporation
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 7,956,469
- Issue date Jun 7, 2011
- Nichia Corporation
- Masaki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond method for angularly disposed conductive pads and a devic...
- Patent number 7,772,045
- Issue date Aug 10, 2010
- Randy Wayne Bindrup
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 7,626,123
- Issue date Dec 1, 2009
- Raytheon Sarcos, LLC
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitry component and method for forming the same
- Patent number 7,582,556
- Issue date Sep 1, 2009
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR MODULE
- Publication number 20240363655
- Publication date Oct 31, 2024
- Reco BioTek Co., Ltd
- Chang Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240023346
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Younghun CHEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR RADIO FREQUENCY OPTIMIZED INTERCONNECTS FOR A QUAN...
- Publication number 20230210023
- Publication date Jun 29, 2023
- Intel Corporation
- Hubert C. George
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COPPER BONDING WIRE
- Publication number 20230105851
- Publication date Apr 6, 2023
- NIPPON MICROMETAL CORPORATION
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20220108971
- Publication date Apr 7, 2022
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...
- Publication number 20200373272
- Publication date Nov 26, 2020
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Bin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSTRUCTURE BARRIER FOR COPPER WIRE BONDING
- Publication number 20200251257
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSTRUCTURE BARRIER FOR COPPER WIRE BONDING
- Publication number 20190088389
- Publication date Mar 21, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS
- Publication number 20190027667
- Publication date Jan 24, 2019
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20180374816
- Publication date Dec 27, 2018
- Nippon Micrometal Corporation
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
FINGERPRINT RECOGNITION CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20170140195
- Publication date May 18, 2017
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Array Formed From A Multiplicity Of Electric Integrated Circuits, a...
- Publication number 20160254202
- Publication date Sep 1, 2016
- MICRO SYSTEMS ENGINEERING GMBH
- Michael Krenkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD...
- Publication number 20150061161
- Publication date Mar 5, 2015
- SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION
- Eun-kyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...
- Publication number 20140264426
- Publication date Sep 18, 2014
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM PRECURSOR COMPOSITION
- Publication number 20140079954
- Publication date Mar 20, 2014
- Xerox Corporation
- Yiliang Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20120325517
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20120305945
- Publication date Dec 6, 2012
- Hosei Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE
- Publication number 20110310577
- Publication date Dec 22, 2011
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus with a Multi-Layer Coating and Method of Forming the Same
- Publication number 20110253429
- Publication date Oct 20, 2011
- Semblant Global Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME
- Publication number 20110062596
- Publication date Mar 17, 2011
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP LAMINATED BODY
- Publication number 20100320584
- Publication date Dec 23, 2010
- Shinko Electric Industries Co., Ltd.
- Akihito TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACKED BODY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100133677
- Publication date Jun 3, 2010
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Microfilament to Circuit Interface
- Publication number 20100116869
- Publication date May 13, 2010
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed Circuit Board for Harsh Environments
- Publication number 20100078202
- Publication date Apr 1, 2010
- SIEMENS ENERGY, INC.
- David J. Mitchell
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUITRY COMPONENT AND METHOD FOR FORMING THE SAME
- Publication number 20090309224
- Publication date Dec 17, 2009
- MEGICA CORPPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR COMPOSITE BOND WIRES
- Publication number 20090301757
- Publication date Dec 10, 2009
- Chris Wyland
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Wafer-Level Integrated Circuit Package with Top and Bottom Side Ele...
- Publication number 20090218698
- Publication date Sep 3, 2009
- ATMEL CORPORATION
- Ken LAM
- H01 - BASIC ELECTRIC ELEMENTS

Molybdenum (Mo) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Bonding wire for semiconductor devices

Nanostructure barrier for copper wire bonding

Fabrication method of packaging structure

Nanostructure barrier for copper wire bonding

Packaging structure and fabrication method thereof

Light emitting apparatus

Fingerprint recognition chip packaging structure and packaging method

Light emitting device mount, leadframe, and light emitting apparatus

Fingerprint recognition chip packaging structure and packaging method

Electronic device and method of fabricating an electronic device

Light emitting device mount, leadframe, and light emitting apparatus

Segmented bond pads and methods of fabrication thereof

Wire structure and semiconductor device having the same, and method...

Reliable wire method

Apparatus with a multi-layer coating and method of forming the same

Power semiconductor device

Reliable wire structure and method

Post passivation structure for a semiconductor device and packaging...

Semiconductor chip stacked body and method of manufacturing the same

Electrical microfilament to circuit interface

Method and system for composite bond wires

Printed circuit board for harsh environments

Laminated body of semiconductor chips including pads mutually conne...

Electrical microfilament to circuit interface

Wafer-level integrated circuit package with top and bottom side ele...

Light emitting device and method of manufacturing the same

Wire bond method for angularly disposed conductive pads and a devic...

Electrical microfilament to circuit interface

Circuitry component and method for forming the same

Patents Applicationslast 30 patents

IMAGE SENSOR MODULE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

TECHNOLOGIES FOR RADIO FREQUENCY OPTIMIZED INTERCONNECTS FOR A QUAN...

COPPER BONDING WIRE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...

NANOSTRUCTURE BARRIER FOR COPPER WIRE BONDING

NANOSTRUCTURE BARRIER FOR COPPER WIRE BONDING

LIGHT EMITTING APPARATUS

BONDING WIRE FOR SEMICONDUCTOR DEVICES

FINGERPRINT RECOGNITION CHIP PACKAGING STRUCTURE AND PACKAGING METHOD

Array Formed From A Multiplicity Of Electric Integrated Circuits, a...

WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD...

LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...

RELIABLE WIRE STRUCTURE AND METHOD

PALLADIUM PRECURSOR COMPOSITION

RELIABLE WIRE STRUCTURE AND METHOD

POWER SEMICONDUCTOR DEVICE

ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE

Apparatus with a Multi-Layer Coating and Method of Forming the Same

SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR CHIP LAMINATED BODY

SEMICONDUCTOR CHIP STACKED BODY AND METHOD OF MANUFACTURING THE SAME

Electrical Microfilament to Circuit Interface

Printed Circuit Board for Harsh Environments

CIRCUITRY COMPONENT AND METHOD FOR FORMING THE SAME

METHOD AND SYSTEM FOR COMPOSITE BOND WIRES

Wafer-Level Integrated Circuit Package with Top and Bottom Side Ele...