Moulding a cap over the MEMS device

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B81C2203/0154

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/0154Moulding a cap over the MEMS device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a sensor device and moulding support structure
- Patent number 12,024,418
- Issue date Jul 2, 2024
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and method for manufacturing sensing device
- Patent number 12,024,420
- Issue date Jul 2, 2024
- Mitsumi Electric Co., Ltd.
- Etsuji Hayakawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 12,017,910
- Issue date Jun 25, 2024
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS resonator system
- Patent number 11,987,495
- Issue date May 21, 2024
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hollow package and method for manufacturing same
- Patent number 11,955,394
- Issue date Apr 9, 2024
- Nippon Kayaku Kabushiki Kaisha
- Tadashi Naito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) sensor packages and methods fo...
- Patent number 11,851,322
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional features formed in molded panel
- Patent number 11,807,523
- Issue date Nov 7, 2023
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,708,264
- Issue date Jul 25, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a sensor device and moulding support structure
- Patent number 11,655,142
- Issue date May 23, 2023
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,524,890
- Issue date Dec 13, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 11,524,892
- Issue date Dec 13, 2022
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 11,498,831
- Issue date Nov 15, 2022
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged pressure sensor device
- Patent number 11,427,464
- Issue date Aug 30, 2022
- NXP USA, INC.
- Weng Foong Yap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,370,656
- Issue date Jun 28, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulation of sensing device
- Patent number 11,358,861
- Issue date Jun 14, 2022
- INDIGO DIABETES NV
- Juan Sebastian Ordonez Orellana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor package systems and methods
- Patent number 11,192,777
- Issue date Dec 7, 2021
- Infineon Technologies AG
- Bernhard Winkler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated MEMS cavity seal
- Patent number 11,174,151
- Issue date Nov 16, 2021
- Invensense, Inc.
- Ian Flader
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional features formed in molded panel
- Patent number 11,148,942
- Issue date Oct 19, 2021
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 11,117,796
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D-printed protective shell structures with support columns for str...
- Patent number 11,082,028
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- James Cooper Wainerdi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level fan-out package with enhanced performance
- Patent number 11,069,590
- Issue date Jul 20, 2021
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical pressure sensor and method for producing said micro...
- Patent number 11,059,717
- Issue date Jul 13, 2021
- Robert Bosch GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level fan-out package with enhanced performance
- Patent number 10,964,554
- Issue date Mar 30, 2021
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level fan-out package with enhanced performance
- Patent number 10,950,518
- Issue date Mar 16, 2021
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,950,563
- Issue date Mar 16, 2021
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing of integrated circuit resonator
- Patent number 10,913,655
- Issue date Feb 9, 2021
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin-film type package
- Patent number 10,903,816
- Issue date Jan 26, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level fan-out package with enhanced performance
- Patent number 10,903,132
- Issue date Jan 26, 2021
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package for a mems sensor device and corresponding manu...
- Patent number 10,882,738
- Issue date Jan 5, 2021
- STMicroelectronics (Malta) Ltd.
- Conrad Cachia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,867,942
- Issue date Dec 15, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS ACOUSTIC ELEMENT
- Publication number 20250039611
- Publication date Jan 30, 2025
- Murata Manufacturing Co., Ltd.
- Ryosuke NIWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20250019229
- Publication date Jan 16, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS
- Publication number 20240043265
- Publication date Feb 8, 2024
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20230391611
- Publication date Dec 7, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE
- Publication number 20230249962
- Publication date Aug 10, 2023
- MELEXIS TECHNOLOGIES NV
- Appolonius Jacobus VAN DER WIEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...
- Publication number 20230110259
- Publication date Apr 13, 2023
- STMicroelectronics (Malta) Ltd.
- Kevin FORMOSA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER
- Publication number 20220396474
- Publication date Dec 15, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20220356059
- Publication date Nov 10, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING DEVICE AND METHOD FOR MANUFACTURING SENSING DEVICE
- Publication number 20220315413
- Publication date Oct 6, 2022
- MITSUMI ELECTRIC CO., LTD.
- Etsuji HAYAKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Hollow Package And Method For Manufacturing Same
- Publication number 20220068737
- Publication date Mar 3, 2022
- SUMITOMO BAKELITE CO., LTD.
- Tadashi Naito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL FEATURES FORMED IN MOLDED PANEL
- Publication number 20220002149
- Publication date Jan 6, 2022
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGES AND METHODS FOR PRODUCING SENSOR PACKAGES
- Publication number 20210300749
- Publication date Sep 30, 2021
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20210179421
- Publication date Jun 17, 2021
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210130165
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED PRESSURE SENSOR DEVICE
- Publication number 20210009405
- Publication date Jan 14, 2021
- NXP USA, Inc.
- Weng Foong YAP
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200388585
- Publication date Dec 10, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20200385261
- Publication date Dec 10, 2020
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
- Publication number 20200354214
- Publication date Nov 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200335462
- Publication date Oct 22, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...
- Publication number 20200307994
- Publication date Oct 1, 2020
- STMicroelectronics (Malta) Ltd.
- Kevin FORMOSA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE
- Publication number 20200231432
- Publication date Jul 23, 2020
- MELEXIS TECHNOLOGIES NV
- Appolonius Jacobus VAN DER WIEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATION OF SENSING DEVICE
- Publication number 20200207612
- Publication date Jul 2, 2020
- INDIGO DIABETES NV
- Juan Sebastian ORDONEZ ORELLANA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOLDED LEAD FRAME SENSOR PACKAGE
- Publication number 20200189908
- Publication date Jun 18, 2020
- INFINEON TECHNOLOGIES AG
- Jochen DANGELMAIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THIN-FILM TYPE PACKAGE
- Publication number 20200144986
- Publication date May 7, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE WITH FLIP-CHIP DIE AND INTERPOSER
- Publication number 20200131026
- Publication date Apr 30, 2020
- NXP USA, Inc.
- Stanley Job Doraisamy
- B60 - VEHICLES IN GENERAL
Information Patent Application
SHIELDED SEMICONDUCTOR DEVICE AND LEAD FRAME THEREFOR
- Publication number 20200131030
- Publication date Apr 30, 2020
- NXP USA, Inc.
- Lee Fee Ngion
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL FAN-OUT PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20200118838
- Publication date Apr 16, 2020
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL FAN-OUT PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20200115220
- Publication date Apr 16, 2020
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL PRESSURE SENSOR AND METHOD FOR PRODUCING SAID MICRO...
- Publication number 20200010317
- Publication date Jan 9, 2020
- ROBERT BOSCH GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OVERMOLDED LEAD FRAME ASSEMBLY FOR PRESSURE SENSING APPLICATIONS
- Publication number 20190368958
- Publication date Dec 5, 2019
- Sensata Technologies, Inc.
- JUN H. BAE
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Moulding a cap over the MEMS device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a sensor device and moulding support structure

Sensing device and method for manufacturing sensing device

Method of manufacturing electronic devices and corresponding electr...

MEMS resonator system

Hollow package and method for manufacturing same

Microelectromechanical system (MEMS) sensor packages and methods fo...

Three-dimensional features formed in molded panel

Stacked-die MEMS resonator

Method of manufacturing a sensor device and moulding support structure

Semiconductor device packages and methods of manufacturing the same

Method of manufacturing electronic devices and corresponding electr...

Structures for packaging stress-sensitive micro-electro-mechanical...

Packaged pressure sensor device

Stacked-die MEMS resonator

Encapsulation of sensing device

MEMS sensor package systems and methods

Integrated MEMS cavity seal

Three-dimensional features formed in molded panel

MEMS devices including MEMS dies and connectors thereto

3D-printed protective shell structures with support columns for str...

Wafer-level fan-out package with enhanced performance

Micromechanical pressure sensor and method for producing said micro...

Wafer-level fan-out package with enhanced performance

Wafer-level fan-out package with enhanced performance

Chip packages and methods for forming the same

Manufacturing of integrated circuit resonator

Thin-film type package

Wafer-level fan-out package with enhanced performance

Wafer level package for a mems sensor device and corresponding manu...

Chip packages and methods for forming the same

Patents Applicationslast 30 patents

MEMS ACOUSTIC ELEMENT

STACKED-DIE MEMS RESONATOR

MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS

STACKED-DIE MEMS RESONATOR

METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE

METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...

SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER

STACKED-DIE MEMS RESONATOR

SENSING DEVICE AND METHOD FOR MANUFACTURING SENSING DEVICE

Hollow Package And Method For Manufacturing Same

THREE-DIMENSIONAL FEATURES FORMED IN MOLDED PANEL

SENSOR PACKAGES AND METHODS FOR PRODUCING SENSOR PACKAGES

STACKED-DIE MEMS RESONATOR

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

PACKAGED PRESSURE SENSOR DEVICE

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM

STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...

METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE

ENCAPSULATION OF SENSING DEVICE

MOLDED LEAD FRAME SENSOR PACKAGE

THIN-FILM TYPE PACKAGE

SENSOR DEVICE WITH FLIP-CHIP DIE AND INTERPOSER

SHIELDED SEMICONDUCTOR DEVICE AND LEAD FRAME THEREFOR

WAFER-LEVEL FAN-OUT PACKAGE WITH ENHANCED PERFORMANCE

WAFER-LEVEL FAN-OUT PACKAGE WITH ENHANCED PERFORMANCE

MICROMECHANICAL PRESSURE SENSOR AND METHOD FOR PRODUCING SAID MICRO...

OVERMOLDED LEAD FRAME ASSEMBLY FOR PRESSURE SENSING APPLICATIONS