Mounting aids permanently on device arrangements for alignment

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CPC
H01L2225/06593

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06593Mounting aids permanently on device arrangements for alignment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of package
- Patent number 12,166,014
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated decoupling and alignment features
- Patent number 12,113,028
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including supporter
- Patent number 12,107,077
- Issue date Oct 1, 2024
- SK hynix Inc.
- Tae Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,009,346
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 11,908,836
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via interconnection structure and methods for fabri...
- Patent number 11,876,078
- Issue date Jan 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chihwei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 11,862,599
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number RE49773
- Issue date Jan 2, 2024
- NANOPAREIL, LLC
- Todd J. Menkhaus
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,855,065
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,842,983
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,837,579
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,824,044
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with integrated decoupl...
- Patent number 11,791,328
- Issue date Oct 17, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,791,311
- Issue date Oct 17, 2023
- Nagase & Co., Ltd.
- Yoichiro Kurita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 11,784,163
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 11,756,844
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring for hybrid-bond
- Patent number 11,756,901
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via (TSV) key for overlay measurement, and semicond...
- Patent number 11,749,614
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Yongyeop Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 11,710,691
- Issue date Jul 25, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,705,435
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace interconnect
- Patent number 11,682,651
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical overlay measurement methods and structures for wafer-to-...
- Patent number 11,621,202
- Issue date Apr 4, 2023
- Western Digital Technologies, Inc.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 11,616,008
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Correction die for wafer/die stack
- Patent number 11,605,614
- Issue date Mar 14, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including supporter
- Patent number 11,600,599
- Issue date Mar 7, 2023
- SK hynix Inc.
- Tae Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor mounted on an integrated circuit die, and meth...
- Patent number 11,562,978
- Issue date Jan 24, 2023
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated mechanical aids for high accuracy alignable-electrical c...
- Patent number 11,562,984
- Issue date Jan 24, 2023
- HRL Laboratories, LLC
- Peter Brewer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240387447
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240387467
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240304602
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Tomoya SANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20240128254
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
- Publication number 20240113055
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, BASE-SIDE SEMICONDUCTOR CHIP, AND BONDING-SID...
- Publication number 20240113035
- Publication date Apr 4, 2024
- LAPIS Technology Co., Ltd.
- JUNICHI IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING DIE SLIP DURING GROUP BONDING
- Publication number 20240079358
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Siva Sai Kishore Palli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20240055379
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- HASEOB SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240038728
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP
- Publication number 20240038675
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Jimin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE
- Publication number 20240038719
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ting LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING
- Publication number 20240030168
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING FOR HYBRID-BOND
- Publication number 20240021544
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE INCLUDING SEMICONDUCTOR DIES AND ENCAPSULANT
- Publication number 20240014175
- Publication date Jan 11, 2024
- SK HYNIX INC.
- Kyung Beom SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240014144
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Hyun Su KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411328
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Shinya ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK
- Publication number 20230395446
- Publication date Dec 7, 2023
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SELECT DIES OF KNOWN THICKNESSES
- Publication number 20230395438
- Publication date Dec 7, 2023
- Western Digital Technologies, Inc.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20230395573
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding to Alignment Marks with Dummy Alignment Marks
- Publication number 20230378122
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP DIE ALIGNMENT
- Publication number 20230378081
- Publication date Nov 23, 2023
- International Business Machines Corporation
- Effendi Leobandung
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE...
- Publication number 20230361086
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230307423
- Publication date Sep 28, 2023
- Samsung Electronics Co., Ltd.
- Sung Min KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRECTION DIE FOR WAFER/DIE STACK
- Publication number 20230268320
- Publication date Aug 24, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE
- Publication number 20230215828
- Publication date Jul 6, 2023
- Micron Technology, Inc.
- Andreas Kuesel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED DECOUPLING AND ALIGNMENT FEATURES
- Publication number 20230197625
- Publication date Jun 22, 2023
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH INTEGRATED DECOUPL...
- Publication number 20230197706
- Publication date Jun 22, 2023
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING SUPPORTER
- Publication number 20230170332
- Publication date Jun 1, 2023
- SK HYNIX INC.
- Tae Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS

Mounting aids permanently on device arrangements for alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of package

Bonding apparatus and bonding method

Through-substrate via structure and method of manufacture

Semiconductor device with integrated decoupling and alignment features

Stack packages including supporter

Semiconductor device assembly with surface-mount die support struct...

Semiconductor device and method of fabricating the same

Semiconductor package and method of manufacturing semiconductor pac...

Through-silicon via interconnection structure and methods for fabri...

Bonding to alignment marks with dummy alignment marks

Hybrid felts of electrospun nanofibers

Stacked semiconductor die assemblies with support members and assoc...

Semiconductor structure

Semiconductor structure

Stacked semiconductor die assemblies with die support members and a...

Method for fabricating semiconductor device with integrated decoupl...

Electronic device

Stacking structure, package structure and method of fabricating the...

Semiconductor device with a protection mechanism and associated sys...

Seal ring for hybrid-bond

Through-silicon via (TSV) key for overlay measurement, and semicond...

Semiconductor device and method of forming micro interconnect struc...

Semiconductor device and method of fabricating the same

Bump-on-trace interconnect

Electrical overlay measurement methods and structures for wafer-to-...

Through-substrate via structure and method of manufacture

Correction die for wafer/die stack

Stack packages including supporter

Decoupling capacitor mounted on an integrated circuit die, and meth...

Integrated mechanical aids for high accuracy alignable-electrical c...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR MEMORY DEVICE

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS

SEMICONDUCTOR DEVICE, BASE-SIDE SEMICONDUCTOR CHIP, AND BONDING-SID...

SYSTEMS AND METHODS FOR REDUCING DIE SLIP DURING GROUP BONDING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP

NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE

WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING

SEAL RING FOR HYBRID-BOND

STACK PACKAGE INCLUDING SEMICONDUCTOR DIES AND ENCAPSULANT

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK

SEMICONDUCTOR DEVICE INCLUDING SELECT DIES OF KNOWN THICKNESSES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

Bonding to Alignment Marks with Dummy Alignment Marks

MULTI-CHIP DIE ALIGNMENT

STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

CORRECTION DIE FOR WAFER/DIE STACK

LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE WITH INTEGRATED DECOUPLING AND ALIGNMENT FEATURES

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH INTEGRATED DECOUPL...

STACK PACKAGES INCLUDING SUPPORTER