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H01L2224/02141

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/02141Multilayer auxiliary member

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,072,588
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Yoo Jeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, method for fabricating the same, and semiconductor pack...
- Patent number 11,984,415
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,935,871
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide profile control
- Patent number 11,855,015
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,664,343
- Issue date May 30, 2023
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a semiconductor device with spacer over sidewa...
- Patent number 11,552,032
- Issue date Jan 10, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,410,946
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Daisuke Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over sidewall of bonding pad and m...
- Patent number 11,024,592
- Issue date Jun 1, 2021
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,867,944
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and integrated circuit wafer with guard ring
- Patent number 10,026,699
- Issue date Jul 17, 2018
- Synaptics Japan GK
- Atsushi Obuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures having a tapering curved profile and methods of making same
- Patent number 10,008,459
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of forming same
- Patent number 9,966,346
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Company
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contacts having varying widths and method of manufacturi...
- Patent number 9,953,939
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a structure for microelectronic device assembly
- Patent number 9,241,403
- Issue date Jan 19, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Gabriel Pares
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Buffer pad in solder bump connections and methods of manufacture
- Patent number 8,513,814
- Issue date Aug 20, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20240369888
- Publication date Nov 7, 2024
- SAMSUNG DISPLAY CO., LTD.
- YOO JEONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
- Publication number 20240274553
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240234375
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE PROFILE CONTROL
- Publication number 20230387050
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Chi HUANG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20230378140
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230275051
- Publication date Aug 31, 2023
- RENESAS ELECTRONICS CORPORATION
- Teruhiro KUWAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20230253360
- Publication date Aug 10, 2023
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230180556
- Publication date Jun 8, 2023
- SAMSUNG DISPLAY CO., LTD.
- BYOUNGYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20230119548
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230060720
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
- Publication number 20230036317
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE PROFILE CONTROL
- Publication number 20220344290
- Publication date Oct 27, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chen-Chi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220328439
- Publication date Oct 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- Myong Soo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220189906
- Publication date Jun 16, 2022
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210384281
- Publication date Dec 9, 2021
- SAMSUNG DISPLAY CO., LTD.
- YOO JEONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWA...
- Publication number 20210202416
- Publication date Jul 1, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWALL OF BONDING PAD AND M...
- Publication number 20210118830
- Publication date Apr 22, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200312800
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE SCALE INTEGRATED CIRCUIT CHIP AND LARGE SCALE INTEGRATED CIRC...
- Publication number 20170278805
- Publication date Sep 28, 2017
- Synaptics Japan GK
- Atsushi OBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...
- Publication number 20170069587
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPOSITE LAYER STRUCTURE AND SEMICONDUCTOR PACKAGING...
- Publication number 20140264855
- Publication date Sep 18, 2014
- Macronix International Co., Ltd.
- Ming-Tung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY
- Publication number 20140144690
- Publication date May 29, 2014
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Gabriel Pares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER PAD IN SOLDER BUMP CONNECTIONS AND METHODS OF MANUFACTURE
- Publication number 20120280399
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Multilayer auxiliary member

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including stacked semiconductor chips

Display device

Interposer, method for fabricating the same, and semiconductor pack...

Solderless interconnection structure and method of forming same

Semiconductor package and method of fabricating the same

Polyimide profile control

Semiconductor package including stacked semiconductor chips

Method for preparing a semiconductor device with spacer over sidewa...

Semiconductor apparatus

Solderless interconnection structure and method of forming same

Semiconductor device with spacer over sidewall of bonding pad and m...

Semiconductor structure and manufacturing method thereof

Solderless interconnection structure and method of forming same

Integrated circuit chip and integrated circuit wafer with guard ring

Structures having a tapering curved profile and methods of making same

Bump structure and method of forming same

Conductive contacts having varying widths and method of manufacturi...

Method for producing a structure for microelectronic device assembly

Buffer pad in solder bump connections and methods of manufacture

Patents Applicationslast 30 patents

DISPLAY DEVICE

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

POLYIMIDE PROFILE CONTROL

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...

POLYIMIDE PROFILE CONTROL

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

DISPLAY DEVICE

METHOD FOR PREPARING A SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWA...

SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWALL OF BONDING PAD AND M...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

LARGE SCALE INTEGRATED CIRCUIT CHIP AND LARGE SCALE INTEGRATED CIRC...

CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...

SEMICONDUCTOR COMPOSITE LAYER STRUCTURE AND SEMICONDUCTOR PACKAGING...

METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY

BUFFER PAD IN SOLDER BUMP CONNECTIONS AND METHODS OF MANUFACTURE