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H01L2224/02181

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02181Multilayer auxiliary member

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film on surface between passivation...
- Patent number 12,057,416
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 12,027,479
- Issue date Jul 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,990,434
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Kazuki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 11,961,880
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 11,894,328
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip including a passivation nitride layer in co...
- Patent number 11,887,948
- Issue date Jan 30, 2024
- STMicroelectronics S.r.l.
- Simone Dario Mariani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including stress-resistant bonding structures and...
- Patent number 11,887,955
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,764,174
- Issue date Sep 19, 2023
- United Microelectronics Corp.
- Chun-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moat coverage with dielectric film for device passivation and singu...
- Patent number 11,764,110
- Issue date Sep 19, 2023
- Semiconductor Components Industries, LLC
- Mark Anand Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,559
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over bonding pad
- Patent number 11,605,606
- Issue date Mar 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlocked redistribution layer interface for flip-chip integrated...
- Patent number 11,545,450
- Issue date Jan 3, 2023
- NVIDIA Corporation
- Yuanjing Jane Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over bonding pad
- Patent number 11,521,945
- Issue date Dec 6, 2022
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact structure having stress buffer layer formed b...
- Patent number 11,476,212
- Issue date Oct 18, 2022
- United Microelectronics Corporation
- Yu-Jie Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device load terminal
- Patent number 11,315,892
- Issue date Apr 26, 2022
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,309,258
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and wafer having multi-layered pad
- Patent number 11,063,011
- Issue date Jul 13, 2021
- NANYA TECHNOLOGY CORPORATION
- Chia-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing same
- Patent number 10,964,656
- Issue date Mar 30, 2021
- Nepes Co., Ltd.
- Yong Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact structure having stress buffer layer formed b...
- Patent number 10,903,179
- Issue date Jan 26, 2021
- United Microelectronics Corporation
- Yu-Jie Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 10,707,179
- Issue date Jul 7, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor backmetal (BM) and over pad metallization (OPM) struc...
- Patent number 10,600,736
- Issue date Mar 24, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding device
- Patent number 10,483,220
- Issue date Nov 19, 2019
- STIMICROELECTRONICS S.R.L.
- Andrea Paleari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,319,692
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding process and structure
- Patent number 10,128,209
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,109,608
- Issue date Oct 23, 2018
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,090,375
- Issue date Oct 2, 2018
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,083,924
- Issue date Sep 25, 2018
- Renesas Electronics Corporation
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device load terminal
- Patent number 10,079,217
- Issue date Sep 18, 2018
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and integrated circuit wafer with guard ring
- Patent number 10,026,699
- Issue date Jul 17, 2018
- Synaptics Japan GK
- Atsushi Obuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL-INSULATOR-METAL STRUCTURE
- Publication number 20240274653
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
- Publication number 20240128219
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...
- Publication number 20240120301
- Publication date Apr 11, 2024
- STMicroelectronics S.r.l
- Simone Dario MARIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOAT COVERAGE WITH DIELECTRIC FILM FOR DEVICE PASSIVATION AND SINGU...
- Publication number 20230377974
- Publication date Nov 23, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Anand THOMAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230103655
- Publication date Apr 6, 2023
- Rohm Co., Ltd.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
- Publication number 20230065797
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Structure for Metal Pattern
- Publication number 20230052604
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...
- Publication number 20230032635
- Publication date Feb 2, 2023
- STMicroelectronics S.r.l
- Simone Dario MARIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE
- Publication number 20220359644
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220328437
- Publication date Oct 13, 2022
- Rohm Co., Ltd.
- Kazuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220181279
- Publication date Jun 9, 2022
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLOCKED REDISTRIBUTION LAYER INTERFACE FOR FLIP-CHIP INTEGRATED...
- Publication number 20220020709
- Publication date Jan 20, 2022
- NVIDIA Corporation
- Yuanjing Jane Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220013481
- Publication date Jan 13, 2022
- RENESAS ELECTRONICS CORPORATION
- Tatsuya USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210375804
- Publication date Dec 2, 2021
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONTACT STRUCTURE HAVING STRESS BUFFER LAYER FORMED B...
- Publication number 20210104478
- Publication date Apr 8, 2021
- UNITED MICROELECTRONICS CORPORATION
- YU-JIE LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20200402924
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20200251432
- Publication date Aug 6, 2020
- UNITED MICROELECTRONICS CORPORATION
- YU-JIE LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20190378807
- Publication date Dec 12, 2019
- NEPES CO., LTD.
- Yong Tae KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND R...
- Publication number 20190148306
- Publication date May 16, 2019
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE LOAD TERMINAL
- Publication number 20180366428
- Publication date Dec 20, 2018
- INFINEON TECHNOLOGIES AG
- Roman ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET MOLDING PROCESS FOR WAFER LEVEL PACKAGING
- Publication number 20170372998
- Publication date Dec 28, 2017
- Yenhao Benjamin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE SCALE INTEGRATED CIRCUIT CHIP AND LARGE SCALE INTEGRATED CIRC...
- Publication number 20170278805
- Publication date Sep 28, 2017
- Synaptics Japan GK
- Atsushi OBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE LOAD TERMINAL
- Publication number 20170221842
- Publication date Aug 3, 2017
- INFINEON TECHNOLOGIES AG
- Roman ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE
- Publication number 20170221840
- Publication date Aug 3, 2017
- STMicroelectronics S.r.l.
- Andrea Paleari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20170179055
- Publication date Jun 22, 2017
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP-SCALE PACKAGE WITH REDISTRIBUTION LAYER
- Publication number 20170162540
- Publication date Jun 8, 2017
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170103955
- Publication date Apr 13, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-PING CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160379946
- Publication date Dec 29, 2016
- RENESAS ELECTRONICS CORPORATION
- Kazuyoshi MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Metal Structure Electrically Connected to...
- Publication number 20160379947
- Publication date Dec 29, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Process and Structure
- Publication number 20160358882
- Publication date Dec 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS

Multilayer auxiliary member

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method of manufacturing the same

Semiconductor device with metal film on surface between passivation...

Semiconductor device with edge-protecting spacers over bonding pad

Semiconductor device and method of manufacturing semiconductor device

Metal-insulator-metal structure

Semiconductor device with edge-protecting spacers over bonding pad

Integrated circuit chip including a passivation nitride layer in co...

Semiconductor die including stress-resistant bonding structures and...

Semiconductor structure

Moat coverage with dielectric film for device passivation and singu...

Semiconductor device

Semiconductor device with spacer over bonding pad

Interlocked redistribution layer interface for flip-chip integrated...

Semiconductor device with spacer over bonding pad

Semiconductor contact structure having stress buffer layer formed b...

Power semiconductor device load terminal

Semiconductor structure

Chip and wafer having multi-layered pad

Semiconductor package and method of manufacturing same

Semiconductor contact structure having stress buffer layer formed b...

Semiconductor structure and method for forming the same

Semiconductor backmetal (BM) and over pad metallization (OPM) struc...

Method of manufacturing semiconductor devices and corresponding device

Semiconductor structure and manufacturing method thereof

Wafer bonding process and structure

Semiconductor package

Semiconductor structure

Semiconductor device and manufacturing method thereof

Power semiconductor device load terminal

Integrated circuit chip and integrated circuit wafer with guard ring

Patents Applicationslast 30 patents

METAL-INSULATOR-METAL STRUCTURE

SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...

INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...

MOAT COVERAGE WITH DIELECTRIC FILM FOR DEVICE PASSIVATION AND SINGU...

ELECTRONIC COMPONENT

SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...

Passivation Structure for Metal Pattern

INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...

METAL-INSULATOR-METAL STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTERLOCKED REDISTRIBUTION LAYER INTERFACE FOR FLIP-CHIP INTEGRATED...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR CONTACT STRUCTURE HAVING STRESS BUFFER LAYER FORMED B...

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND R...

POWER SEMICONDUCTOR DEVICE LOAD TERMINAL

SHEET MOLDING PROCESS FOR WAFER LEVEL PACKAGING

LARGE SCALE INTEGRATED CIRCUIT CHIP AND LARGE SCALE INTEGRATED CIRC...

POWER SEMICONDUCTOR DEVICE LOAD TERMINAL

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE

SEMICONDUCTOR STRUCTURE

WAFER-LEVEL CHIP-SCALE PACKAGE WITH REDISTRIBUTION LAYER

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Device with Metal Structure Electrically Connected to...

Wafer Bonding Process and Structure