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Patents Grants
last 30 patents
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Patent Grant
Device bonding apparatus and method of manufacturing a package usin...
Patent number
12,368,128
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yi-Jung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing composite layer circuit structure of elect...
Patent number
12,362,252
Issue date
Jul 15, 2025
INNOLUX CORPORATION
Yu-Jen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic substrate and electronic device
Patent number
12,362,300
Issue date
Jul 15, 2025
INNOLUX CORPORATION
Chueh Yuan Nien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
Patent number
12,347,802
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company Limited
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-electron mobility transistor and fabrication method thereof
Patent number
12,342,561
Issue date
Jun 24, 2025
United Microelectronics Corp.
Chih-Tung Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming method of semiconductor structure and semiconductor structure
Patent number
12,341,073
Issue date
Jun 24, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Huiwen Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming recesses in molding compound of wafer to reduce stress
Patent number
12,334,474
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with protective film for reducing aluminum sli...
Patent number
12,334,410
Issue date
Jun 17, 2025
Renesas Electronics Corporation
Takashi Aoki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package using a coreless signal distribution structure
Patent number
12,322,731
Issue date
Jun 3, 2025
Amkor Technology Singapore Holding Pte Ltd.
Do Hyung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stimulus responsive polymer films and formulations
Patent number
12,322,588
Issue date
Jun 3, 2025
Lam Research Corporation
Gregory Blachut
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Edge encapsulation for high voltage devices
Patent number
12,315,770
Issue date
May 27, 2025
MACOM Technology Solutions Holdings, Inc.
Timothy Boles
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for preparing semiconductor device with composite passivatio...
Patent number
12,315,796
Issue date
May 27, 2025
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die with tapered sidewall in package
Patent number
12,308,346
Issue date
May 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die, manufacturing method thereof, and semiconductor...
Patent number
12,308,298
Issue date
May 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Moat coverage with dielectric film for device passivation and singu...
Patent number
12,300,548
Issue date
May 13, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Mark Anand Thomas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transistor device structure with angled wire bonds
Patent number
12,300,564
Issue date
May 13, 2025
Wolfspeed, Inc.
Kyoung-Keun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Organic light emitting diode display and method for manufacturing t...
Patent number
12,289,952
Issue date
Apr 29, 2025
Samsung Display Co., Ltd.
Jin-Kwang Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,289,901
Issue date
Apr 29, 2025
INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
Yi-Lun Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
12,272,568
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun-Ting Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
12,255,116
Issue date
Mar 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic structures including bridges
Patent number
12,243,792
Issue date
Mar 4, 2025
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package with polymer layer delamination prevention desi...
Patent number
12,230,593
Issue date
Feb 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Heng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal bumps and method forming same
Patent number
12,230,595
Issue date
Feb 18, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with passivated contact plugs, semiconductor s...
Patent number
12,225,706
Issue date
Feb 11, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Zhengqing Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming the same
Patent number
12,218,023
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and testing method
Patent number
12,216,157
Issue date
Feb 4, 2025
Advanced Semiconductor Engineering, Inc.
Chen-Chao Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
12,218,207
Issue date
Feb 4, 2025
INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
Qiyue Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Barrier structures between external electrical connectors
Patent number
12,218,035
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Chun Miao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Highly protective wafer edge sidewall protection layer
Patent number
12,211,766
Issue date
Jan 28, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Su-Jen Sung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor package including forming cav...
Patent number
12,205,861
Issue date
Jan 21, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Meng-Liang Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
IMPROVED HEMT DEVICE, IN PARTICULAR DEPLETION MODE DEVICE, AND MANU...
Publication number
20250240997
Publication date
Jul 24, 2025
STMicroelectronics International N.V.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20250239463
Publication date
Jul 24, 2025
UNITED MICROELECTRONICS CORP.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING T...
Publication number
20250234754
Publication date
Jul 17, 2025
SAMSUNG DISPLAY CO., LTD.
Jin-Kwang Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER TRIM EDGE PROTECTION
Publication number
20250218888
Publication date
Jul 3, 2025
Intel Corporation
Bradley PARKS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM-ON-CHIP GAP FILL METHOD AND STRUCTURE
Publication number
20250210600
Publication date
Jun 26, 2025
ADVANCED MICRO DEVICES, INC.
Hsiang-Wei Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Publication number
20250201583
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun-Ting Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
Publication number
20250194208
Publication date
Jun 12, 2025
INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
Xiao ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250183110
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250174585
Publication date
May 29, 2025
Samsung Electronics Co., Ltd.
Hyeonjae KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
Publication number
20250167062
Publication date
May 22, 2025
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...
Publication number
20250169070
Publication date
May 22, 2025
WESTERN DIGITAL TECHNOLOGIES, INC.,
Kota FUNAYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND TESTING METHOD
Publication number
20250155498
Publication date
May 15, 2025
Advanced Semiconductor Engineering, Inc.
Chen-Chao WANG
G01 - MEASURING TESTING
Information
Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
Publication number
20250157955
Publication date
May 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Heng CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D-IC FOR RF APPLICATIONS
Publication number
20250157988
Publication date
May 15, 2025
INFINEON TECHNOLOGIES AG
Hans Taddiken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20250157868
Publication date
May 15, 2025
United Microelectronics Corp.
Chen-Hsiao Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL BUMPS AND METHOD FORMING SAME
Publication number
20250149485
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING ELECTROMAGNETIC-WAVE SHIELD, METHOD OF MANUFACTUR...
Publication number
20250149346
Publication date
May 8, 2025
Hideo NAKAMORI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC LAYER PROTRUSIONS
Publication number
20250140628
Publication date
May 1, 2025
TEXAS INSTRUMENTS INCORPORATED
Enis TUNCER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-STEP GATE AND RECESSED MULTI-STEP F...
Publication number
20250142924
Publication date
May 1, 2025
NXP USA, Inc.
Bernhard Grote
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOISTURE RESISTANT SEMICONDUTOR DEVICE
Publication number
20250140713
Publication date
May 1, 2025
MICROCHIP TECHNOLOGY INCORPORATED
Shesh Mani Pandey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250140629
Publication date
May 1, 2025
Fuji Electric Co., Ltd.
Shingo HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
Publication number
20250132216
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250132217
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Ting LAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250118718
Publication date
Apr 10, 2025
SK HYNIX INC.
Heon Yong CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEMT TRANSISTOR
Publication number
20250118613
Publication date
Apr 10, 2025
STMicroelectronics International N.V.
Paolo COLPANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20250118612
Publication date
Apr 10, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING AN IMPROVED TERMINATION AREA, AS WELL A...
Publication number
20250120132
Publication date
Apr 10, 2025
NEXPERIA B.V.
Tianxiang Dai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
Publication number
20250118690
Publication date
Apr 10, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGHLY PROTECTIVE WAFER EDGE SIDEWALLl PROTECTION LAYER
Publication number
20250112102
Publication date
Apr 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Su-Jen Sung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTER
Publication number
20250112103
Publication date
Apr 3, 2025
Mitsubishi Electric Corporation
Kohei EBIHARA
H01 - BASIC ELECTRIC ELEMENTS