Multilayer coating

Industry

CPC
H01L23/3192

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3192Multilayer coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,678
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing three-dimensional integrated circuit struc...
- Patent number 12,136,619
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 12,131,917
- Issue date Oct 29, 2024
- INNOLUX CORPORATION
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and fabrication method thereof
- Patent number 12,132,011
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmentally protected photonic integrated circuit
- Patent number 12,125,805
- Issue date Oct 22, 2024
- EFFECT PHOTONICS B.V.
- Tsjerk Hans Hoekstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component with a dielectric passivation stack
- Patent number 12,125,745
- Issue date Oct 22, 2024
- General Electric Company
- Cheng-Po Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical conductive structure surrounded by guard ring and method o...
- Patent number 12,113,034
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chien-Hsuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 12,113,055
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,107,025
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Yohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitrogen-rich silicon nitride films for thin film transistors
- Patent number 12,094,796
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Rodney S. Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,087,757
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing die encapsulated by an encapsulant with a roughness surface...
- Patent number 12,087,654
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with nanotube particles for enhanced performance and met...
- Patent number 12,074,086
- Issue date Aug 27, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with multiple gap-filling layers and fabrica...
- Patent number 12,057,363
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, chip structure and method of fabricating the same
- Patent number 12,057,437
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package formation methods including coupling a molded routing layer...
- Patent number 12,057,364
- Issue date Aug 6, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,050,398
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar passivation layers
- Patent number 12,046,527
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Shu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,040,312
- Issue date Jul 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including TSV and multiple insulating layers
- Patent number 12,040,231
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Junghoon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,040,368
- Issue date Jul 16, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive and protective coating for electronic device
- Patent number 12,033,426
- Issue date Jul 9, 2024
- Next Biometrics Group ASA
- Matias N. Troccoli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Warpage control of semiconductor die
- Patent number 12,021,002
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Ting Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer(s) on a stacked structure having a via
- Patent number 12,021,066
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,021,122
- Issue date Jun 25, 2024
- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Anbang Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387311
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS
- Publication number 20240387312
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240387197
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE P...
- Publication number 20240387343
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20240379585
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chien-Hsuan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240371852
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240371851
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240371647
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSIANG HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE
- Publication number 20240355696
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...
- Publication number 20240355698
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...
- Publication number 20240355697
- Publication date Oct 24, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR PASSIVATION LAYERS
- Publication number 20240355695
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Po-Shu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...
- Publication number 20240347407
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347408
- Publication date Oct 17, 2024
- Sumitomo Electric Industries, Ltd.
- Masaki KIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240347515
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20240332380
- Publication date Oct 3, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER
- Publication number 20240321787
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lung SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DICING A SEMICONDUCTOR WAFER
- Publication number 20240321639
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Carlos Augusto SUAREZ SEGOVIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304683
- Publication date Sep 12, 2024
- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Anbang ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE HAVING COMPOSITE DIELECTRIC FILM STRUCT...
- Publication number 20240290672
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Chieh CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240290677
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240290679
- Publication date Aug 29, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAN DEVICE WITH N2 PRE-TREATMENT AND METHOD OF PERFORMING N2 PRE-TR...
- Publication number 20240282841
- Publication date Aug 22, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Po-Hsien Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
- Publication number 20240282658
- Publication date Aug 22, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES
- Publication number 20240282728
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240274487
- Publication date Aug 15, 2024
- InnoLux Corporation
- Shu-Han YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240274518
- Publication date Aug 15, 2024
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION DEVICE, AND METHOD...
- Publication number 20240274655
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Kohei EBIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240274565
- Publication date Aug 15, 2024
- WINBOND ELECTRONICS CORP.
- Yu-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMATION COMPENSATION METHOD FOR GROWING THICK GALIUM NITRIDE ON...
- Publication number 20240263348
- Publication date Aug 8, 2024
- ROBERT BOSCH GmbH
- Bo CHENG
- C30 - CRYSTAL GROWTH

Multilayer coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Integrated chip for standard logic performance improvement having a...

Methods of manufacturing three-dimensional integrated circuit struc...

Manufacturing method of package structure

Integrated circuit device and fabrication method thereof

Environmentally protected photonic integrated circuit

Electrical component with a dielectric passivation stack

Method of manufacturing semiconductor structure

Package having an electronic component and an encapsulant encapsula...

Vertical conductive structure surrounded by guard ring and method o...

Stress reduction apparatus and method

Semiconductor device

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Nitrogen-rich silicon nitride films for thin film transistors

Integrated circuit packages

Sensing die encapsulated by an encapsulant with a roughness surface...

RF devices with nanotube particles for enhanced performance and met...

Semiconductor device and method for manufacturing semiconductor device

Chip package structure with multiple gap-filling layers and fabrica...

Package structure, chip structure and method of fabricating the same

Package formation methods including coupling a molded routing layer...

Semiconductor device and method of forming the same

Planar passivation layers

Semiconductor package structure and method for manufacturing the same

Semiconductor device including TSV and multiple insulating layers

Semiconductor device and manufacturing method thereof

Thermally conductive and protective coating for electronic device

Warpage control of semiconductor die

Buffer layer(s) on a stacked structure having a via

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE P...

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGES

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE

MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...

PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...

PLANAR PASSIVATION LAYERS

METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER

METHOD FOR DICING A SEMICONDUCTOR WAFER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE HAVING COMPOSITE DIELECTRIC FILM STRUCT...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

GAN DEVICE WITH N2 PRE-TREATMENT AND METHOD OF PERFORMING N2 PRE-TR...

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION DEVICE, AND METHOD...

DIE PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

DEFORMATION COMPENSATION METHOD FOR GROWING THICK GALIUM NITRIDE ON...