Multistep processes for the separation of wafers into individual elements

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CPC
B81C1/00865

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00865Multistep processes for the separation of wafers into individual elements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for multiple MEMS sound transducers
- Patent number 11,375,317
- Issue date Jun 28, 2022
- USOUND GMBH
- Andrea Rusconi Clerici Beltrami
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
LED transfer device and micro LED transferring method using the same
- Patent number 11,264,531
- Issue date Mar 1, 2022
- Samsung Electronics Co., Ltd.
- Sangmoo Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of strain gauge fabrication using a transfer substrate
- Patent number 10,183,862
- Issue date Jan 22, 2019
- GM Global Technology Operations LLC
- Stephen A. Berggren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor with side port and method of fabricating same
- Patent number 9,790,089
- Issue date Oct 17, 2017
- NXP USA, INC.
- Chad S. Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Shielding MEMS structures during wafer dicing
- Patent number 9,346,671
- Issue date May 24, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromirror device package fabrication method
- Patent number 6,624,921
- Issue date Sep 23, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a semiconductor acceleration sensor device
- Patent number 5,668,033
- Issue date Sep 16, 1997
- Nippondenso Co., Ltd.
- Fumio Ohara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SENSOR CHIP WITH A PLURALITY OF INTEGRATED SENSOR CIRCUITS
- Publication number 20230035123
- Publication date Feb 2, 2023
- INFINEON TECHNOLOGIES AG
- Stephan LEISENHEIMER
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Multistep processes for the separation of wafers into individual elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method for multiple MEMS sound transducers

LED transfer device and micro LED transferring method using the same

Method of strain gauge fabrication using a transfer substrate

MEMS sensor with side port and method of fabricating same

Shielding MEMS structures during wafer dicing

Micromirror device package fabrication method

Method for manufacturing a semiconductor acceleration sensor device

Patents Applicationslast 30 patents

SENSOR CHIP WITH A PLURALITY OF INTEGRATED SENSOR CIRCUITS