Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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H01L2924/0002

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Camera having a reduced dark current photodetector
- Patent number 12,148,855
- Issue date Nov 19, 2024
- Shimon Maimon
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Light emitting diode constructions and methods for making the same
- Patent number 12,148,868
- Issue date Nov 19, 2024
- Bridgelux, Inc.
- Vladimir A. Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with transistor local interconnects
- Patent number 12,148,702
- Issue date Nov 19, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Mahbub Rashed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid submerged, horizontal computer server rack and systems and m...
- Patent number 12,150,282
- Issue date Nov 19, 2024
- GREEN REVOLUTION COOLING, INC.
- Christiaan Scott Best
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device with patterned ground shielding
- Patent number 12,148,694
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Medium voltage sensor using a multi-component resistive voltage div...
- Patent number 12,140,615
- Issue date Nov 12, 2024
- Aclara Technologies LLC
- Michael Giovannoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mechanism
- Patent number 12,140,625
- Issue date Nov 12, 2024
- Delta Design, Inc.
- Jerry Ihor Tustaniwskyj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked trench contacts and structures formed the...
- Patent number 12,142,566
- Issue date Nov 12, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having contact trenches extending from opposit...
- Patent number 12,136,670
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical systems fabricated by printing-based assembly
- Patent number 12,136,620
- Issue date Nov 5, 2024
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 12,131,952
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Device and method for a two phase heat transfer
- Patent number 12,130,093
- Issue date Oct 29, 2024
- National University of Singapore
- Poh Seng Lee
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Bonded semiconductor structures
- Patent number 12,131,898
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including dummy conductive cells
- Patent number 12,125,809
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module package with high illumination efficiency
- Patent number 12,125,835
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Chee-Pin T'Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for detection and identification of counterfei...
- Patent number 12,117,476
- Issue date Oct 15, 2024
- NOKOMIS, INC.
- Walter J. Keller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solid state transducer devices, including devices having integrated...
- Patent number 12,113,092
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate yield prediction based on spectra data from...
- Patent number 12,111,355
- Issue date Oct 8, 2024
- Onto Innovation Inc.
- Xin Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal control system
- Patent number 12,110,881
- Issue date Oct 8, 2024
- APR Technologies AB
- Robert Thorslund
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Threshold adjustment for quantum dot array devices with metal sourc...
- Patent number 12,107,144
- Issue date Oct 1, 2024
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with tolerance optimizing interconnects
- Patent number 12,100,716
- Issue date Sep 24, 2024
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test equipment for testing a device under test having an antenna
- Patent number 12,099,088
- Issue date Sep 24, 2024
- Advantest Corporation
- Jan Hesselbarth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid heat exchanger
- Patent number 12,101,906
- Issue date Sep 24, 2024
- Coolit Systems, Inc.
- Geoff Sean Lyon
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor memory system
- Patent number 12,094,866
- Issue date Sep 17, 2024
- Kioxia Corporation
- Hayato Masubuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor integrated circuit device having a standard cell whic...
- Patent number 12,094,878
- Issue date Sep 17, 2024
- SOCIONEXT INC.
- Hiroyuki Shimbo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and manufacturing methods thereof
- Patent number 12,094,880
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ali Keshavarzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and method of manufacturing the same
- Patent number 12,092,935
- Issue date Sep 17, 2024
- Samsung Display Co., Ltd.
- Jin-Soo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting structure
- Patent number 12,094,864
- Issue date Sep 17, 2024
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and configurations to reduce transistor gate short defects
- Patent number 12,094,780
- Issue date Sep 17, 2024
- Intel Corporation
- Sridhar Govindaraju
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DUMMY CONDUCTIVE CELLS
- Publication number 20240387412
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING ESD PROTECTION CIRCUIT
- Publication number 20240387509
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING
- Publication number 20240387363
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING OF SEMICONDUCTOR DEVICES
- Publication number 20240379746
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure
- Publication number 20240371754
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE PROTECTION CIRCUIT
- Publication number 20240369424
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong CHERN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENT SCALING RATIO IN FEOL / MOL/ BEOL
- Publication number 20240371765
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Liang-Yao Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD T...
- Publication number 20240365540
- Publication date Oct 31, 2024
- KIOXIA Corporation
- Yoshihiro AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA SUB-ASSEMBLY FOR VEHICULAR CAMERA
- Publication number 20240364992
- Publication date Oct 31, 2024
- MAGNA ELECTRONICS INC.
- Yuesheng Lu
- B60 - VEHICLES IN GENERAL
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM FOR AND METHOD OF FORMING AN INTEGRATED...
- Publication number 20240362394
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chan YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED...
- Publication number 20240339582
- Publication date Oct 10, 2024
- Micron Technology, Inc.
- Kevin Tetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20240332191
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS FOR NEUROTECHNOLOGY AND OTHER APPLICATIONS
- Publication number 20240325731
- Publication date Oct 3, 2024
- President and Fellows of Harvard College
- Hongkun Park
- B82 - NANO-TECHNOLOGY
Information Patent Application
MULTI REQUEST ASYNCHRONOUS DELEGATION FOR ENHANCED PERFORMANCE
- Publication number 20240332292
- Publication date Oct 3, 2024
- eBay Inc.
- Vineet BINDAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240321832
- Publication date Sep 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE FILM AND METHOD FOR FORMING METAL OXIDE FILM
- Publication number 20240321897
- Publication date Sep 26, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Masahiro TAKAHASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Heat Transfer Device for High Heat Flux Applications and Related Me...
- Publication number 20240310128
- Publication date Sep 19, 2024
- University of Virginia Patent Foundation
- Hossein Haj-Hariri
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SELF-ALIGNED INTERCONNECT WITH PROTECTION LAYER
- Publication number 20240297076
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chan Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS
- Publication number 20240282624
- Publication date Aug 22, 2024
- Intel Corporation
- Sean KING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Tunable Filter Architecture
- Publication number 20240274551
- Publication date Aug 15, 2024
- pSemi Corporation
- William R. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING PATTERN COLLAPSE
- Publication number 20240258163
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE AND METHOD FOR CREAT...
- Publication number 20240258234
- Publication date Aug 1, 2024
- KIOXIA Corporation
- Kosuke YANAGIDAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid State Light Sheet Having Wide Support Substrate and Narrow St...
- Publication number 20240243224
- Publication date Jul 18, 2024
- QUARKSTAR LLC
- Louis Lerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DRAM DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240242741
- Publication date Jul 18, 2024
- Rambus Inc.
- Thomas Vogelsang
- G11 - INFORMATION STORAGE
Information Patent Application
LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE
- Publication number 20240234385
- Publication date Jul 11, 2024
- Apple Inc.
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA HAVING A REDUCED DARK CURRENT PHOTODETECTOR
- Publication number 20240222544
- Publication date Jul 4, 2024
- Shimon Maimon
- G01 - MEASURING TESTING
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240222333
- Publication date Jul 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pitch Reduction Technology Using Alternating Spacer Depositions Dur...
- Publication number 20240222131
- Publication date Jul 4, 2024
- Lodestar Licensing Group LLC
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSE SIGNAL OUTPUT CIRCUIT AND SHIFT REGISTER
- Publication number 20240212774
- Publication date Jun 27, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Seiko Amano
- G11 - INFORMATION STORAGE

Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Camera having a reduced dark current photodetector

Light emitting diode constructions and methods for making the same

Semiconductor device with transistor local interconnects

Liquid submerged, horizontal computer server rack and systems and m...

Semiconductor device with patterned ground shielding

Medium voltage sensor using a multi-component resistive voltage div...

Alignment mechanism

Method of forming stacked trench contacts and structures formed the...

Semiconductor device having contact trenches extending from opposit...

Optical systems fabricated by printing-based assembly

Wafer dicing using femtosecond-based laser and plasma etch

Heat sink, semiconductor package and semiconductor module

Device and method for a two phase heat transfer

Bonded semiconductor structures

Semiconductor device including dummy conductive cells

Module package with high illumination efficiency

Method and apparatus for detection and identification of counterfei...

Solid state transducer devices, including devices having integrated...

Semiconductor substrate yield prediction based on spectra data from...

Thermal control system

Threshold adjustment for quantum dot array devices with metal sourc...

Image sensor with tolerance optimizing interconnects

Test equipment for testing a device under test having an antenna

Fluid heat exchanger

Semiconductor memory system

Semiconductor integrated circuit device having a standard cell whic...

Integrated circuits and manufacturing methods thereof

Display panel and method of manufacturing the same

Light emitting structure

Techniques and configurations to reduce transistor gate short defects

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING DUMMY CONDUCTIVE CELLS

THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING ESD PROTECTION CIRCUIT

SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING

THERMOELECTRIC COOLING OF SEMICONDUCTOR DEVICES

Semiconductor Structure

TEMPERATURE PROTECTION CIRCUIT

DIFFERENT SCALING RATIO IN FEOL / MOL/ BEOL

NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD T...

CAMERA SUB-ASSEMBLY FOR VEHICULAR CAMERA

INTEGRATED CIRCUIT, SYSTEM FOR AND METHOD OF FORMING AN INTEGRATED...

LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED...

Interconnect Structure and Method of Forming Same

INTEGRATED CIRCUITS FOR NEUROTECHNOLOGY AND OTHER APPLICATIONS

MULTI REQUEST ASYNCHRONOUS DELEGATION FOR ENHANCED PERFORMANCE

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

METAL OXIDE FILM AND METHOD FOR FORMING METAL OXIDE FILM

Heat Transfer Device for High Heat Flux Applications and Related Me...

SELF-ALIGNED INTERCONNECT WITH PROTECTION LAYER

CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS

Integrated Tunable Filter Architecture

MITIGATING PATTERN COLLAPSE

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE AND METHOD FOR CREAT...

Solid State Light Sheet Having Wide Support Substrate and Narrow St...

STACKED DRAM DEVICE AND METHOD OF MANUFACTURE

LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE

CAMERA HAVING A REDUCED DARK CURRENT PHOTODETECTOR

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

Pitch Reduction Technology Using Alternating Spacer Depositions Dur...

PULSE SIGNAL OUTPUT CIRCUIT AND SHIFT REGISTER