Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
System and method for sub-column parallel digitizers for hybrid sta...
- Patent number 11,973,090
- Issue date Apr 30, 2024
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,967,583
- Issue date Apr 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating pattern collapse
- Patent number 11,961,761
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced dark current photodetector
- Patent number 11,961,936
- Issue date Apr 16, 2024
- Shimon Maimon
- B82 - NANO-TECHNOLOGY
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,961,827
- Issue date Apr 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super CMOS devices on a microelectronics system
- Patent number 11,955,476
- Issue date Apr 9, 2024
- SCHOTTKY LSI, INC.
- Augustine Wei-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test method for tolerance against the hot carrier effect
- Patent number 11,953,542
- Issue date Apr 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yifei Pan
- G11 - INFORMATION STORAGE
Information Patent Grant
Method, structures and devices for intra-connection structures
- Patent number 11,943,908
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulse signal output circuit and shift register
- Patent number 11,942,170
- Issue date Mar 26, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Seiko Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop layer in integrated circuits
- Patent number 11,942,419
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduction technology using alternating spacer depositions dur...
- Patent number 11,935,756
- Issue date Mar 19, 2024
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal display device, semiconductor device, and electronic...
- Patent number 11,921,382
- Issue date Mar 5, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Hajime Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional semiconductor memory device and method for fabric...
- Patent number 11,925,023
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Sang-Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration barrier for interconnect
- Patent number 11,923,304
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming nanostructures utilizing self-assembled nucleic...
- Patent number 11,923,197
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stack of horizontally extending and vertically overlapping features...
- Patent number 11,923,289
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Sanh D. Tang
- G11 - INFORMATION STORAGE
Information Patent Grant
Solid state lamp using light emitting strips
- Patent number 11,920,739
- Issue date Mar 5, 2024
- Quarkstar LLC
- Robert V. Steele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable inductor arrangement, transceiver, method, and computer pro...
- Patent number 11,923,119
- Issue date Mar 5, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Magnus Nilsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices and methods of manufacturing the same
- Patent number 11,925,015
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Sang-yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated tunable filter architecture
- Patent number 11,923,322
- Issue date Mar 5, 2024
- pSemi Corporation
- William R. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and methods for managing error regions
- Patent number 11,915,774
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Joe M. Jeddeloh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device reflective bank structure
- Patent number 11,916,048
- Issue date Feb 27, 2024
- Apple Inc.
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,916,045
- Issue date Feb 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and organic light-emitting display including the same
- Patent number 11,916,087
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Won Kyu Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land structure for semiconductor package and method therefor
- Patent number 11,908,779
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having a carbon-containing barrier layer
- Patent number 11,908,697
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company
- Rueijer Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective formation of conductor nanowires
- Patent number 11,908,789
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,910,676
- Issue date Feb 20, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Hajime Kimura
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method and apparatus for providing a passive color control scheme u...
- Patent number 11,910,501
- Issue date Feb 20, 2024
- SIGNIFY HOLDING B.V.
- Tao Tong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICES AND FABRICATION TECHNIQUES
- Publication number 20240145480
- Publication date May 2, 2024
- STMicroelectronics, Inc.
- John H. ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE LIGHTING DEVICE WITH DIFFERENT ILLUMINATION PARAMETERS...
- Publication number 20240145440
- Publication date May 2, 2024
- Micron Technology, Inc.
- Zhang Xin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE LIGHTING DEVICES WITH IMPROVED CONTACTS AND ASSOCIATED...
- Publication number 20240128425
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Martin F. Schubert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240128237
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Schottky-CMOS Static Random-Access Memory
- Publication number 20240120922
- Publication date Apr 11, 2024
- Schottky LSI, Inc.
- Augustine Wei-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH REDUCED NON-DEVICE EDGE AREA
- Publication number 20240107797
- Publication date Mar 28, 2024
- UNIVERSAL DISPLAY CORPORATION
- Prashant MANDLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION
- Publication number 20240105572
- Publication date Mar 28, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS ENCLOSURE ASSEMBLY AND SYSTEM
- Publication number 20240100868
- Publication date Mar 28, 2024
- Kateeva, Inc.
- Justin MAUCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20240104037
- Publication date Mar 28, 2024
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLID-STATE IMAGING DEVICE HAVING THROUGH ELECTRODE PROVIDED THEREI...
- Publication number 20240096922
- Publication date Mar 21, 2024
- SONY GROUP CORPORATION
- Hideaki TOGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING METAL INSULATOR MET...
- Publication number 20240096929
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Jhih HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20240088040
- Publication date Mar 14, 2024
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH GUARD RING
- Publication number 20240088027
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiao-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
- Publication number 20240087953
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME
- Publication number 20240088025
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diamond Semiconductor System and Method
- Publication number 20240071763
- Publication date Feb 29, 2024
- AKHAN Semiconductor, Inc.
- Adam Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-VOLTAGE SOLID-STATE TRANSDUCERS AND ASSOCIATED SYSTEMS AND MET...
- Publication number 20240063358
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Martin F. Schubert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID CRYSTAL DISPLAY DEVICE
- Publication number 20240053647
- Publication date Feb 15, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Hajime Kimura
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240047604
- Publication date Feb 8, 2024
- EPISTAR CORPORATION
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...
- Publication number 20240044846
- Publication date Feb 8, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND APPARATUS FOR DETECTION AND IDENTIFICATION OF COUNTERFEI...
- Publication number 20240044963
- Publication date Feb 8, 2024
- NOKOMIS, INC.
- Walter J. Keller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELF-ALIGNED CONTACTS
- Publication number 20240030067
- Publication date Jan 25, 2024
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240030353
- Publication date Jan 25, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Methods for Processing Exfoliated Graphite Materials
- Publication number 20240021495
- Publication date Jan 18, 2024
- 0908905 B.C. Ltd.
- John Kenna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE
- Publication number 20240014195
- Publication date Jan 11, 2024
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CARBON NANOTUBES DISPOSED ON METAL SUBSTRATES WITH ONE OR MORE CAVI...
- Publication number 20240006263
- Publication date Jan 4, 2024
- NTHERMA CORPORATION
- Cattien V. Nguyen
- C01 - INORGANIC CHEMISTRY
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS

Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System and method for sub-column parallel digitizers for hybrid sta...

3D semiconductor device and structure with metal layers

Mitigating pattern collapse

Reduced dark current photodetector

3D semiconductor device and structure with metal layers

Super CMOS devices on a microelectronics system

Etch damage and ESL free dual damascene metal interconnect

Test method for tolerance against the hot carrier effect

Method, structures and devices for intra-connection structures

Pulse signal output circuit and shift register

Etch stop layer in integrated circuits

Pitch reduction technology using alternating spacer depositions dur...

Liquid crystal display device, semiconductor device, and electronic...

Three dimensional semiconductor memory device and method for fabric...

Electro-migration barrier for interconnect

Methods of forming nanostructures utilizing self-assembled nucleic...

Stack of horizontally extending and vertically overlapping features...

Solid state lamp using light emitting strips

Tunable inductor arrangement, transceiver, method, and computer pro...

Vertical memory devices and methods of manufacturing the same

Integrated tunable filter architecture

Memory devices and methods for managing error regions

Light emitting device reflective bank structure

3D semiconductor device and structure with metal layers

Array substrate and organic light-emitting display including the same

Land structure for semiconductor package and method therefor

Interconnect structure having a carbon-containing barrier layer

Selective formation of conductor nanowires

Display device

Method and apparatus for providing a passive color control scheme u...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICES AND FABRICATION TECHNIQUES

SOLID STATE LIGHTING DEVICE WITH DIFFERENT ILLUMINATION PARAMETERS...

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

SOLID STATE LIGHTING DEVICES WITH IMPROVED CONTACTS AND ASSOCIATED...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

Schottky-CMOS Static Random-Access Memory

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

ELECTRONIC DEVICE WITH REDUCED NON-DEVICE EDGE AREA

GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION

GAS ENCLOSURE ASSEMBLY AND SYSTEM

Stacked Semiconductor Device Assembly in Computer System

SOLID-STATE IMAGING DEVICE HAVING THROUGH ELECTRODE PROVIDED THEREI...

METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING METAL INSULATOR MET...

MULTI-LAYER LINE STRUCTURE

INTEGRATED CIRCUIT WITH GUARD RING

Metal Contact Structure and Method of Forming the Same in a Semicon...

SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME

Diamond Semiconductor System and Method

HIGH-VOLTAGE SOLID-STATE TRANSDUCERS AND ASSOCIATED SYSTEMS AND MET...

LIQUID CRYSTAL DISPLAY DEVICE

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...

METHOD AND APPARATUS FOR DETECTION AND IDENTIFICATION OF COUNTERFEI...

SELF-ALIGNED CONTACTS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Apparatus and Methods for Processing Exfoliated Graphite Materials

METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE

MICROMECHANICAL STRUCTURE WITH BONDED COVER

CARBON NANOTUBES DISPOSED ON METAL SUBSTRATES WITH ONE OR MORE CAVI...

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...