Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Industry

CPC
H01L2924/0002

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory device with a three-dimensional stacked memory...
- Patent number 12,185,538
- Issue date Dec 31, 2024
- Kioxia Corporation
- Tomoo Hishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart pixel lighting and display microcontroller
- Patent number 12,175,945
- Issue date Dec 24, 2024
- Apple Inc.
- Kapil V. Sakariya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Devices and methods related to voltage compensated switch stack
- Patent number 12,176,304
- Issue date Dec 24, 2024
- Skyworks Solutions, Inc.
- Hanching Fuh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device using high stress cleave plane
- Patent number 12,176,326
- Issue date Dec 24, 2024
- Silicon Genesis Corporation
- Theodore E. Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic circuit and semiconductor device
- Patent number 12,170,338
- Issue date Dec 17, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked DRAM device and method of manufacture
- Patent number 12,170,126
- Issue date Dec 17, 2024
- RAMBUS INC.
- Thomas Vogelsang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing conductive lines in a circuit
- Patent number 12,165,972
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 12,159,823
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scan testable through silicon VIAs
- Patent number 12,154,835
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale thermoelectric refrigerator
- Patent number 12,154,841
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Henry Litzmann Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-voltage solid-state transducers and associated systems and met...
- Patent number 12,155,026
- Issue date Nov 26, 2024
- Micron Technology, Inc.
- Martin F. Schubert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having non-integral multiple pitch
- Patent number 12,153,868
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Chih Hsieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming a semiconductor device with inter-layer vias
- Patent number 12,154,851
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Lin Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Camera having a reduced dark current photodetector
- Patent number 12,148,855
- Issue date Nov 19, 2024
- Shimon Maimon
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Liquid submerged, horizontal computer server rack and systems and m...
- Patent number 12,150,282
- Issue date Nov 19, 2024
- GREEN REVOLUTION COOLING, INC.
- Christiaan Scott Best
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Light emitting diode constructions and methods for making the same
- Patent number 12,148,868
- Issue date Nov 19, 2024
- Bridgelux, Inc.
- Vladimir A. Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with transistor local interconnects
- Patent number 12,148,702
- Issue date Nov 19, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Mahbub Rashed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with patterned ground shielding
- Patent number 12,148,694
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Medium voltage sensor using a multi-component resistive voltage div...
- Patent number 12,140,615
- Issue date Nov 12, 2024
- Aclara Technologies LLC
- Michael Giovannoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mechanism
- Patent number 12,140,625
- Issue date Nov 12, 2024
- Delta Design, Inc.
- Jerry Ihor Tustaniwskyj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked trench contacts and structures formed the...
- Patent number 12,142,566
- Issue date Nov 12, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having contact trenches extending from opposit...
- Patent number 12,136,670
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical systems fabricated by printing-based assembly
- Patent number 12,136,620
- Issue date Nov 5, 2024
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 12,131,952
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for a two phase heat transfer
- Patent number 12,130,093
- Issue date Oct 29, 2024
- National University of Singapore
- Poh Seng Lee
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Bonded semiconductor structures
- Patent number 12,131,898
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including dummy conductive cells
- Patent number 12,125,809
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module package with high illumination efficiency
- Patent number 12,125,835
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Chee-Pin T'Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20240413016
- Publication date Dec 12, 2024
- Intel Corporation
- Sridhar GOVINDARAJU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...
- Publication number 20240405044
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Masahiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...
- Publication number 20240404880
- Publication date Dec 5, 2024
- Lodestar Licensing Group LLC
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20240405010
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DUMMY CONDUCTIVE CELLS
- Publication number 20240387412
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING ESD PROTECTION CIRCUIT
- Publication number 20240387509
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Yu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING
- Publication number 20240387363
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING OF SEMICONDUCTOR DEVICES
- Publication number 20240379746
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure
- Publication number 20240371754
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENT SCALING RATIO IN FEOL / MOL/ BEOL
- Publication number 20240371765
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Liang-Yao Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TEMPERATURE PROTECTION CIRCUIT
- Publication number 20240369424
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong CHERN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD T...
- Publication number 20240365540
- Publication date Oct 31, 2024
- KIOXIA Corporation
- Yoshihiro AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA SUB-ASSEMBLY FOR VEHICULAR CAMERA
- Publication number 20240364992
- Publication date Oct 31, 2024
- MAGNA ELECTRONICS INC.
- Yuesheng Lu
- B60 - VEHICLES IN GENERAL
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM FOR AND METHOD OF FORMING AN INTEGRATED...
- Publication number 20240362394
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chan YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED...
- Publication number 20240339582
- Publication date Oct 10, 2024
- Micron Technology, Inc.
- Kevin Tetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20240332191
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS FOR NEUROTECHNOLOGY AND OTHER APPLICATIONS
- Publication number 20240325731
- Publication date Oct 3, 2024
- President and Fellows of Harvard College
- Hongkun Park
- B82 - NANO-TECHNOLOGY
Information Patent Application
MULTI REQUEST ASYNCHRONOUS DELEGATION FOR ENHANCED PERFORMANCE
- Publication number 20240332292
- Publication date Oct 3, 2024
- eBay Inc.
- Vineet BINDAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240321832
- Publication date Sep 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE FILM AND METHOD FOR FORMING METAL OXIDE FILM
- Publication number 20240321897
- Publication date Sep 26, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Masahiro TAKAHASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Heat Transfer Device for High Heat Flux Applications and Related Me...
- Publication number 20240310128
- Publication date Sep 19, 2024
- University of Virginia Patent Foundation
- Hossein Haj-Hariri
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SELF-ALIGNED INTERCONNECT WITH PROTECTION LAYER
- Publication number 20240297076
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chan Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS
- Publication number 20240282624
- Publication date Aug 22, 2024
- Intel Corporation
- Sean KING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Tunable Filter Architecture
- Publication number 20240274551
- Publication date Aug 15, 2024
- pSemi Corporation
- William R. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING PATTERN COLLAPSE
- Publication number 20240258163
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE AND METHOD FOR CREAT...
- Publication number 20240258234
- Publication date Aug 1, 2024
- KIOXIA Corporation
- Kosuke YANAGIDAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DRAM DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240242741
- Publication date Jul 18, 2024
- Rambus Inc.
- Thomas Vogelsang
- G11 - INFORMATION STORAGE
Information Patent Application
Solid State Light Sheet Having Wide Support Substrate and Narrow St...
- Publication number 20240243224
- Publication date Jul 18, 2024
- QUARKSTAR LLC
- Louis Lerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE
- Publication number 20240234385
- Publication date Jul 11, 2024
- Apple Inc.
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS

Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor memory device with a three-dimensional stacked memory...

Smart pixel lighting and display microcontroller

Devices and methods related to voltage compensated switch stack

Method of forming semiconductor device using high stress cleave plane

Logic circuit and semiconductor device

Stacked DRAM device and method of manufacture

Method of manufacturing conductive lines in a circuit

Semiconductor package with front side and back side redistribution...

Chemical direct pattern plating method

Scan testable through silicon VIAs

Nanoscale thermoelectric refrigerator

High-voltage solid-state transducers and associated systems and met...

Integrated circuit having non-integral multiple pitch

Method of forming a semiconductor device with inter-layer vias

Camera having a reduced dark current photodetector

Liquid submerged, horizontal computer server rack and systems and m...

Light emitting diode constructions and methods for making the same

Semiconductor device with transistor local interconnects

Semiconductor device with patterned ground shielding

Medium voltage sensor using a multi-component resistive voltage div...

Alignment mechanism

Method of forming stacked trench contacts and structures formed the...

Semiconductor device having contact trenches extending from opposit...

Optical systems fabricated by printing-based assembly

Heat sink, semiconductor package and semiconductor module

Wafer dicing using femtosecond-based laser and plasma etch

Device and method for a two phase heat transfer

Bonded semiconductor structures

Semiconductor device including dummy conductive cells

Module package with high illumination efficiency

Patents Applicationslast 30 patents

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...

MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...

SEMICONDUCTOR MEMORY SYSTEM

SEMICONDUCTOR DEVICE INCLUDING DUMMY CONDUCTIVE CELLS

THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING ESD PROTECTION CIRCUIT

SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING

THERMOELECTRIC COOLING OF SEMICONDUCTOR DEVICES

Semiconductor Structure

DIFFERENT SCALING RATIO IN FEOL / MOL/ BEOL

TEMPERATURE PROTECTION CIRCUIT

NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD T...

CAMERA SUB-ASSEMBLY FOR VEHICULAR CAMERA

INTEGRATED CIRCUIT, SYSTEM FOR AND METHOD OF FORMING AN INTEGRATED...

LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED...

Interconnect Structure and Method of Forming Same

INTEGRATED CIRCUITS FOR NEUROTECHNOLOGY AND OTHER APPLICATIONS

MULTI REQUEST ASYNCHRONOUS DELEGATION FOR ENHANCED PERFORMANCE

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

METAL OXIDE FILM AND METHOD FOR FORMING METAL OXIDE FILM

Heat Transfer Device for High Heat Flux Applications and Related Me...

SELF-ALIGNED INTERCONNECT WITH PROTECTION LAYER

CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS

Integrated Tunable Filter Architecture

MITIGATING PATTERN COLLAPSE

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE AND METHOD FOR CREAT...

STACKED DRAM DEVICE AND METHOD OF MANUFACTURE

Solid State Light Sheet Having Wide Support Substrate and Narrow St...

LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE