of a chip with build-up interconnect

Industry

CPC
H01L2924/18162

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/18162of a chip with build-up interconnect

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Fan-out wafer level package structure
- Patent number 12,170,242
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,170,251
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on standard commodity FPGA IC chips
- Patent number 12,153,865
- Issue date Nov 26, 2024
- iCometrue Company Ltd.
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating passive devices in package structures
- Patent number 12,132,029
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an antenna arranged over an active main...
- Patent number 12,094,842
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
- Patent number 12,080,615
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods therefor
- Patent number 12,080,601
- Issue date Sep 3, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 12,080,663
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible package architecture concept in fanout
- Patent number 12,074,077
- Issue date Aug 27, 2024
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 12,057,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 12,051,667
- Issue date Jul 30, 2024
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level stack chip package and method of manufacturing the same
- Patent number 12,033,910
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out structure and method of fabricating the same
- Patent number 12,020,953
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of warpage using ABF GC cavity for embedded die package
- Patent number 12,009,318
- Issue date Jun 11, 2024
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding low-k materials in antennas
- Patent number 11,984,668
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 11,961,867
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a redistribution layer
- Patent number 11,935,856
- Issue date Mar 19, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method of forming the same
- Patent number 11,908,795
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and method
- Patent number 11,901,319
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,862,574
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Jung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,855,016
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide layered structure and methods of forming the same
- Patent number 11,854,826
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,854,877
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level fan out semiconductor device and manufacturing method t...
- Patent number 11,855,023
- Issue date Dec 26, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Boo Yang Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240412982
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS THEREFOR
- Publication number 20240387271
- Publication date Nov 21, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240379429
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS
- Publication number 20240362386
- Publication date Oct 31, 2024
- iCometrue Company Ltd.
- Mou-Shiung LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...
- Publication number 20240363463
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240363470
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20240347575
- Publication date Oct 17, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Packaging of Dies Including TSVs using Sacrificial Carrier
- Publication number 20240339370
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufactoring Co., Ltd.
- Chien-Fu Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20240339428
- Publication date Oct 10, 2024
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20240332238
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Guendalina CATALANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLET-FINE-INTERCONNECTION-PACKAGE STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240304556
- Publication date Sep 12, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Xun XIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240304583
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20240250067
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD T...
- Publication number 20240243084
- Publication date Jul 18, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Boo Yang Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS
- Publication number 20240232489
- Publication date Jul 11, 2024
- iCometrue Company Ltd.
- Mou-Shiung LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE CARRIER BOARD INTEGRATED WITH INDUCTIVE CIRCUIT STRUCTURE A...
- Publication number 20240222140
- Publication date Jul 4, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240186257
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Che TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME
- Publication number 20240153872
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND METHOD
- Publication number 20240153896
- Publication date May 9, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240145433
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturiing Co., Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS
- Publication number 20240135079
- Publication date Apr 25, 2024
- iCometrue Company Ltd.
- Mou-Shiung LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240128206
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Peng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240087954
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20240047390
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
- Publication number 20240006377
- Publication date Jan 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages, Packaging Methods, and Packaged Semi...
- Publication number 20230395588
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS

of a chip with build-up interconnect

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out wafer level package structure

Semiconductor package

Logic drive based on standard commodity FPGA IC chips

Integrated fan-out package and the methods of manufacturing

Integrating passive devices in package structures

Semiconductor device packages, packaging methods, and packaged semi...

Semiconductor device having an antenna arranged over an active main...

Method of manufacturing an integrated fan-out package having fan-ou...

Packaged semiconductor devices and methods therefor

Semiconductor devices including a thick metal layer and a bump

Flexible package architecture concept in fanout

Integrated fan-out package structures with recesses in molding comp...

High density substrate routing in package

Semiconductor package having a through intervia through the molding...

Wafer-level stack chip package and method of manufacturing the same

Fan-out structure and method of fabricating the same

Control of warpage using ABF GC cavity for embedded die package

Method of embedding low-k materials in antennas

Structure and method for fabricating a computing system with an int...

Electronic device package and fabricating method thereof

Semiconductor package and manufacturing method thereof

Advanced info POP and method of forming thereof

Semiconductor device having a redistribution layer

Package structures and method of forming the same

Semiconductor package system and method

Fan-out semiconductor package

Semiconductor device and method of manufacture

Metal oxide layered structure and methods of forming the same

Semiconductor device and manufacturing method of the same

Wafer level fan out semiconductor device and manufacturing method t...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Multi-Die Package Structures Including Redistribution Layers

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...

PACKAGED SEMICONDUCTOR DEVICES AND METHODS THEREFOR

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS

METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

Packaging of Dies Including TSVs using Sacrificial Carrier

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

CHIPLET-FINE-INTERCONNECTION-PACKAGE STRUCTURE AND METHOD OF MANUFA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS

WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD T...

Structure and Method for Fabricating a Computing System with an Int...

LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS

PACKAGE CARRIER BOARD INTEGRATED WITH INDUCTIVE CIRCUIT STRUCTURE A...

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE SYSTEM AND METHOD

INTEGRATED CIRCUIT PACKAGE AND METHOD

LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...

Semiconductor Device Packages, Packaging Methods, and Packaged Semi...