of a plurality of connectors

Industry

CPC
H01L24/67

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/67of a plurality of connectors

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Chip socket, testing fixture and chip testing method thereof
- Patent number 11,959,939
- Issue date Apr 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Shih-Ting Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 11,955,457
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with insulated conductive layer
- Patent number 11,935,860
- Issue date Mar 19, 2024
- Intel Corporation
- Morten Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 11,756,844
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures with narrowed portions, and a...
- Patent number 11,676,932
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,398,424
- Issue date Jul 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Jaw-Ming Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding and interconnecting semiconductor chips
- Patent number 11,114,337
- Issue date Sep 7, 2021
- Imec VZW
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 10,943,842
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 10,867,964
- Issue date Dec 15, 2020
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 10,580,710
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,490,488
- Issue date Nov 26, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-chip alignment
- Patent number 10,410,989
- Issue date Sep 10, 2019
- University of Notre Dame du Lac
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,325,835
- Issue date Jun 18, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connectors having a bent main body for electrical connec...
- Patent number 10,320,097
- Issue date Jun 11, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois De Crecy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and package
- Patent number 10,229,861
- Issue date Mar 12, 2019
- Sabin Lupan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with interior polygonal pads
- Patent number 10,056,343
- Issue date Aug 21, 2018
- Nexperia B.V.
- Roelf A. J. Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for inter-chip communication
- Patent number 9,633,976
- Issue date Apr 25, 2017
- University of Notre Dame Du Lac
- Gary H. Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 9,397,028
- Issue date Jul 19, 2016
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with interior polygonal pads
- Patent number 9,269,690
- Issue date Feb 23, 2016
- NXP B.V.
- Roelf A. J. Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method of manufacturing the same
- Patent number 9,196,596
- Issue date Nov 24, 2015
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 9,070,721
- Issue date Jun 30, 2015
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Facilitating chip dicing for metal-metal bonding and hybrid wafer b...
- Patent number 9,059,333
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package and method for manufacturing the same
- Patent number 9,030,009
- Issue date May 12, 2015
- SK Hynix Inc.
- Ki Il Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making an electrically conducting mechanical interconnec...
- Patent number 8,178,416
- Issue date May 15, 2012
- Centre National de la Recherche Scientifique
- Patrice Simon
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...
- Publication number 20240222325
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF
- Publication number 20240192252
- Publication date Jun 13, 2024
- NANYA TECHNOLOGY CORPORATION
- SHIH-TING LIN
- G01 - MEASURING TESTING
Information Patent Application
CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF
- Publication number 20230069959
- Publication date Mar 9, 2023
- NANYA TECHNOLOGY CORPORATION
- SHIH-TING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR WITH INSULATED CONDUCTIVE LAYER
- Publication number 20210305196
- Publication date Sep 30, 2021
- Intel Corporation
- Morten JENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210257286
- Publication date Aug 19, 2021
- Advanced Semiconductor Engineering, Inc.
- Jaw-Ming DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH NARROWED PORTIONS, AND A...
- Publication number 20210202430
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
- Publication number 20210183716
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...
- Publication number 20210091039
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING AND INTERCONNECTING SEMICONDUCTOR CHIPS
- Publication number 20200203224
- Publication date Jun 25, 2020
- IMEC vzw
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
- Publication number 20200168517
- Publication date May 28, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20190326202
- Publication date Oct 24, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
- Publication number 20190067137
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY CURVED MECHANICALLY FLEXIBLE INTERCONNECTS, METHODS OF M...
- Publication number 20180294211
- Publication date Oct 11, 2018
- Georgia Tech Research Corporation
- MUHANNAD S. BAKIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Package
- Publication number 20180294204
- Publication date Oct 11, 2018
- Sabin Lupan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20180138109
- Publication date May 17, 2018
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inter-Chip Alignment
- Publication number 20170229416
- Publication date Aug 10, 2017
- UNIVERSITY OF NOTRE DAME DU LAC
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR FOR MATRIX CONNECTION BETWEEN A HOUSING AND A SUPPORT, CO...
- Publication number 20170222340
- Publication date Aug 3, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Francois DE CRECY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACILITATING CHIP DICING FOR METAL-METAL BONDING AND HYBRID WAFER B...
- Publication number 20150255417
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH INTERIOR POLYGONAL PADS
- Publication number 20150162298
- Publication date Jun 11, 2015
- NXP B.V.
- Roelf A.J. Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACILITATING CHIP DICING FOR METAL-METAL BONDING AND HYBRID WAFER B...
- Publication number 20150155263
- Publication date Jun 4, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150102484
- Publication date Apr 16, 2015
- Siliconware Precision Industries Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140367849
- Publication date Dec 18, 2014
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140361426
- Publication date Dec 11, 2014
- SK HYNIX INC.
- Ki Il MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20140264806
- Publication date Sep 18, 2014
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING AN ELECTRICALLY CONDUCTING MECHANICAL INTERCONNEC...
- Publication number 20100308473
- Publication date Dec 9, 2010
- Centre Nat De La Recherche Scientifique
- Patrice Simon
- B82 - NANO-TECHNOLOGY

of a plurality of connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip socket, testing fixture and chip testing method thereof

Semiconductor assemblies using edge stacking and methods of manufac...

Electrical connector with insulated conductive layer

Semiconductor device with a protection mechanism and associated sys...

Semiconductor interconnect structures with narrowed portions, and a...

Semiconductor package structure

Method for bonding and interconnecting semiconductor chips

Semiconductor device with a protection mechanism and associated sys...

Semiconductor assemblies using edge stacking and methods of manufac...

Semiconductor device with a protection mechanism and associated sys...

Semiconductor devices and methods of making the same

Inter-chip alignment

Semiconductor devices and methods of making the same

Electrical connectors having a bent main body for electrical connec...

Power semiconductor device and package

Packaged semiconductor device with interior polygonal pads

Systems and methods for inter-chip communication

Semiconductor devices and methods of making the same

Packaged semiconductor device with interior polygonal pads

Interposer and method of manufacturing the same

Semiconductor devices and methods of making the same

Facilitating chip dicing for metal-metal bonding and hybrid wafer b...

Stacked semiconductor package and method for manufacturing the same

Method for making an electrically conducting mechanical interconnec...

Patents Applicationslast 30 patents

SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...

CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF

CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF

ELECTRICAL CONNECTOR WITH INSULATED CONDUCTIVE LAYER

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR INTERCONNECT STRUCTURES WITH NARROWED PORTIONS, AND A...

SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...

SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...

METHOD FOR BONDING AND INTERCONNECTING SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...

VERTICALLY CURVED MECHANICALLY FLEXIBLE INTERCONNECTS, METHODS OF M...

Power Semiconductor Device and Package

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

Inter-Chip Alignment

CONNECTOR FOR MATRIX CONNECTION BETWEEN A HOUSING AND A SUPPORT, CO...

FACILITATING CHIP DICING FOR METAL-METAL BONDING AND HYBRID WAFER B...

PACKAGED SEMICONDUCTOR DEVICE WITH INTERIOR POLYGONAL PADS

FACILITATING CHIP DICING FOR METAL-METAL BONDING AND HYBRID WAFER B...

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

INTERPOSER AND METHOD OF MANUFACTURING THE SAME

STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

METHOD FOR MAKING AN ELECTRICALLY CONDUCTING MECHANICAL INTERCONNEC...