of a plurality of strap connectors

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CPC
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/38of a plurality of strap connectors

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of a plurality of strap connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Double side heat dissipation for silicon chip package

Electronic module

Multi-clip structure for die bonding

Method of forming a packaged semiconductor device using ganged cond...

Monolithic power converter package

Patents Applicationslast 30 patents

HEMT PACKAGE WITH BOND WIRE-FREE CONNECTIONS

SANDWICH PACKAGE FOR MICROELECTRONICS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Forming Leadframe with Clip Bond...

ELECTRONIC MODULE

Double Side Heat Dissipation for Silicon Chip Package

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE USING GANGED COND...

Multi-Clip Structure for Die Bonding

Semiconductor Device and Manufacturing Method Thereof

Monolithic Power Converter Package