Membership
Tour
Register
Log in
of an individual bump connector
Follow
Industry
CPC
H01L2224/16
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/16
of an individual bump connector
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Deep trench capacitors in an inter-layer medium on an interconnect...
Patent number
11,973,019
Issue date
Apr 30, 2024
QUALCOMM Incorporated
Jihong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for manufacturing the same
Patent number
11,973,048
Issue date
Apr 30, 2024
Advanced Semiconductor Engineering, Inc.
An-Nong Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Lid attach process and dispenser head
Patent number
11,972,956
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chin-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate having porous dielectric layer
Patent number
11,973,017
Issue date
Apr 30, 2024
Texas Instruments Incorporated
Jaimal Mallory Williamson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-silicon transmission lines and other structures enabled by...
Patent number
11,973,057
Issue date
Apr 30, 2024
Analog Devices, Inc.
Ed Balboni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,973,001
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing substrate structure with filling material f...
Patent number
11,973,014
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Chang-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple conductive posts
Patent number
11,973,043
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Chih-Hsien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
Patent number
11,972,995
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Dahee Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip semiconductor-on-insulator transistor layout
Patent number
11,973,033
Issue date
Apr 30, 2024
Skyworks Solutions, Inc.
Yang Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package including electronic structure and electronic co...
Patent number
11,973,047
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for low temperature bonding using nanoparticles
Patent number
11,973,056
Issue date
Apr 30, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Double-layer stacked 3D fan-out packaging structure and method maki...
Patent number
11,973,070
Issue date
Apr 30, 2024
SJ Semiconductor (Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer stacking structure and manufacturing method thereof
Patent number
11,967,558
Issue date
Apr 23, 2024
Powerchip Semiconductor Manufacturing Corporation
Shou-Zen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for fabricating a computing system with an int...
Patent number
11,967,528
Issue date
Apr 23, 2024
Apple Inc.
Vidhya Ramachandran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabric-based items with electrical component arrays
Patent number
11,967,561
Issue date
Apr 23, 2024
Apple Inc.
Daniel D. Sunshine
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly including plural through wafer vias, method of cooling the...
Patent number
11,967,548
Issue date
Apr 23, 2024
International Business Machines Corporation
Kerry Bernstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
Patent number
11,967,567
Issue date
Apr 23, 2024
Amkor Technology Singapore Holding Pte Ltd.
Doo Soub Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having improved thermal interface between sem...
Patent number
11,967,570
Issue date
Apr 23, 2024
Mediatek Inc.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,967,577
Issue date
Apr 23, 2024
Rohm Co., Ltd.
Yosui Futamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional IC package with thermal enhancement
Patent number
11,967,538
Issue date
Apr 23, 2024
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat dissipation sheet, manufacturing method of heat dissipation sh...
Patent number
11,967,539
Issue date
Apr 23, 2024
Fujitsu Limited
Shinichi Hirose
B32 - LAYERED PRODUCTS
Information
Patent Grant
3DIC packaging with hot spot thermal management features
Patent number
11,961,779
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a molded substrate electronic package and structure
Patent number
11,961,794
Issue date
Apr 16, 2024
Amikor Technology Singapore Holding Pte. Ltd.
Won Bae Bang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and fabricating method thereof
Patent number
11,961,797
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Keun Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,961,742
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Efficient wave guide transition between package and PCB using solde...
Patent number
11,963,291
Issue date
Apr 16, 2024
NXP B.V.
Leo van Gemert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solderless interconnection structure and method of forming same
Patent number
11,961,810
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company
Yu-Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming and/or configuring stacked dies
Patent number
11,961,823
Issue date
Apr 16, 2024
Xilinx, Inc.
Praful Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
Patent number
11,961,764
Issue date
Apr 16, 2024
STATS ChipPAC Pte. Ltd.
Thomas J. Strothmann
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE AND METHOD FOR MAN...
Publication number
20240145359
Publication date
May 2, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240145360
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Hwanjoo PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...
Publication number
20240145368
Publication date
May 2, 2024
Intel Corporation
Jackson Chung Peng KONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER STRUCTURE
Publication number
20240145398
Publication date
May 2, 2024
Siliconware Precision Industries Co., Ltd.
Cheng-Liang HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CIRCUIT AND SEMICONDUCTOR DEVICE
Publication number
20240145406
Publication date
May 2, 2024
Rohm Co., Ltd.
Takatsugu WACHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
Publication number
20240145433
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturiing Co., Ltd.
Po-Yao Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE
Publication number
20240145457
Publication date
May 2, 2024
Micron Technology, Inc.
Faxing CHE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR PACKAGE
Publication number
20240145326
Publication date
May 2, 2024
Samsung Electronics Co., LTD
Seungchul OH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package with Heat Dissipation Structure and Method for Forming the...
Publication number
20240145342
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Tung-Liang Shao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA
Publication number
20240145346
Publication date
May 2, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Dong Joo PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE
Publication number
20240145358
Publication date
May 2, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Publication number
20240145361
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
WONBIN SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240145370
Publication date
May 2, 2024
InnoLux Corporation
Te-Hsun LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240145417
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Hyeongwoo JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240145418
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Junghoo Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integration of Discrete Embeddable Capacitors on Integrated Circuit...
Publication number
20240145447
Publication date
May 2, 2024
pSemi Corporation
Shishir Ray
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL
Publication number
20240145448
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Heh-Chang HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package-On-Package Assembly Containing A Decoupling Capacitor
Publication number
20240145452
Publication date
May 2, 2024
KYOCERA AVX Components Corporation
Laurent Desclos
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240145455
Publication date
May 2, 2024
Siliconware Precision Industries Co., Ltd.
Meng-Jie LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...
Publication number
20240145363
Publication date
May 2, 2024
TEXAS INSTRUMENTS INCORPORATED
Vivek SRIDHARAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240145397
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Jeongho LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT
Publication number
20240145414
Publication date
May 2, 2024
Wolfspeed, Inc.
Gerard Bouisse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASING TO ATTACH DIE TO LEAD FRAME
Publication number
20240145419
Publication date
May 2, 2024
TEXAS INSTRUMENTS INCORPORATED
Daiki KOMATSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL
Publication number
20240145422
Publication date
May 2, 2024
Micron Technology, Inc.
Jungbae Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECT...
Publication number
20240145432
Publication date
May 2, 2024
Tesla, Inc.
Mengzhi Pang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20240145367
Publication date
May 2, 2024
MEDIATEK SINGAPORE PTE LTD
Jubao ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...
Publication number
20240145393
Publication date
May 2, 2024
Ankur AGGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB
Publication number
20240145395
Publication date
May 2, 2024
Intel Corporation
MD Altaf HOSSAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...
Publication number
20240145427
Publication date
May 2, 2024
Stroke Precision Advanced Engineering Co., Ltd.
Chingju Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240145444
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Kiju Lee
H01 - BASIC ELECTRIC ELEMENTS