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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/69of an individual connector
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEAL RING STRUCTURES AND METHODS OF FORMING SAME
    • Publication number 20220278090
    • Publication date Sep 1, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kuo-Ming Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEAL RING STRUCTURES AND METHODS OF FORMING SAME
    • Publication number 20200350302
    • Publication date Nov 5, 2020
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Kuo-Ming Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Integrated Circuit Package and Method
    • Publication number 20200212018
    • Publication date Jul 2, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chi-Hui Lai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR PRODUCING AN ELECTRIC CIRCUIT
    • Publication number 20190393187
    • Publication date Dec 26, 2019
    • SIEMENS AKTIENGESELLSCHAFT
    • STEFAN PFEFFERLEIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGING METHOD
    • Publication number 20190139952
    • Publication date May 9, 2019
    • Shanghai Zhaoxin Semiconductor Co., Ltd.
    • Wen-Yuan Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEAL RING STRUCTURES AND METHODS OF FORMING SAME
    • Publication number 20190109125
    • Publication date Apr 11, 2019
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Kuo-Ming Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20190088575
    • Publication date Mar 21, 2019
    • Fuji Electric Co., Ltd.
    • Ryoichi Kato
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
    • Publication number 20180344245
    • Publication date Dec 6, 2018
    • International Business Machines Corporation
    • John U. Knickerbocker
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...
    • Publication number 20180301609
    • Publication date Oct 18, 2018
    • EPISTAR CORPORATION
    • Guan Ru He
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VERTICALLY CURVED MECHANICALLY FLEXIBLE INTERCONNECTS, METHODS OF M...
    • Publication number 20180294211
    • Publication date Oct 11, 2018
    • Georgia Tech Research Corporation
    • MUHANNAD S. BAKIR
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERFACE STRUCTURES AND METHODS FOR FORMING SAME
    • Publication number 20180286805
    • Publication date Oct 4, 2018
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Shaowu Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE CONDUCTIVE BONDING
    • Publication number 20180254566
    • Publication date Sep 6, 2018
    • Microsoft Technology Licensing, LLC
    • James David Holbery
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180197813
    • Publication date Jul 12, 2018
    • Mitsubishi Electric Corporation
    • Yukimasa HAYASHIDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEAL RING STRUCTURES AND METHODS OF FORMING SAME
    • Publication number 20180175012
    • Publication date Jun 21, 2018
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Kuo-Ming Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH CLIP ALIGNMENT NOTCH
    • Publication number 20180012829
    • Publication date Jan 11, 2018
    • Amkor Technology, Inc.
    • Marc Alan Mangrum
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
    • Publication number 20180005982
    • Publication date Jan 4, 2018
    • International Business Machines Corporation
    • John U. Knickerbocker
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN COMPOSITION
    • Publication number 20170275453
    • Publication date Sep 28, 2017
    • Fuji Electric Co., Ltd.
    • Yuko Nakamata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Package and Method
    • Publication number 20150255431
    • Publication date Sep 10, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • An-Jhih Su
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    III-Nitride Device and FET in a Package
    • Publication number 20150008445
    • Publication date Jan 8, 2015
    • International Rectifier Corporation
    • Heny Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20150008596
    • Publication date Jan 8, 2015
    • Mitsubishi Electric Corporation
    • Yasukazu Yamamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    III-Nitride Transistor Stacked with FET in a Package
    • Publication number 20120223321
    • Publication date Sep 6, 2012
    • INTERNATIONAL RECTIFIER CORPORATION
    • Heny Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER-LEVEL PACKAGED DEVICE HAVING SELF-ASSEMBLED RESILIENT LEADS
    • Publication number 20110198745
    • Publication date Aug 18, 2011
    • MAXIM INTEGRATED PRODUCTS, INC.
    • Chiung C. Lo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic device and method of manufacturing the same
    • Publication number 20110042812
    • Publication date Feb 24, 2011
    • DENSO CORPORATION
    • Kimiharu Kayukawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EXTENDABLE CONNECTOR AND NETWORK
    • Publication number 20110042832
    • Publication date Feb 24, 2011
    • The Board of Trustees of the Leland Stanford Junior University
    • Peter Peumans
    • G01 - MEASURING TESTING
  • Information Patent Application

    METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
    • Publication number 20100136747
    • Publication date Jun 3, 2010
    • SAMSUNG ELECTRONICS CO., LTD.
    • Tae-Sung PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEAT-TRANSFER STRUCTURE
    • Publication number 20090315173
    • Publication date Dec 24, 2009
    • Lucent Technologies Inc.
    • Roger Scott Kempers
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DEVICE INTERCONNECTS
    • Publication number 20090242260
    • Publication date Oct 1, 2009
    • Thomas Heinz-Helmut ALTEBAEUMER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20080111229
    • Publication date May 15, 2008
    • Samsung Electronics Co., Ltd.
    • Tae-Sung PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EXTENDABLE CONNECTOR AND NETWORK
    • Publication number 20080064125
    • Publication date Mar 13, 2008
    • Peter Peumans
    • G01 - MEASURING TESTING