of an individual connector

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CPC
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/66of an individual connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 11,955,457
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacers formed on a substrate with etched micro-springs
- Patent number 11,908,782
- Issue date Feb 20, 2024
- Xerox Corporation
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive micro pin
- Patent number 11,101,232
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Jui Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Scan channel fabric for tiled circuit designs
- Patent number 10,990,739
- Issue date Apr 27, 2021
- Amazon Technologies, Inc.
- Dan Trock
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 10,867,964
- Issue date Dec 15, 2020
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,727,218
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip scale packages
- Patent number 10,553,511
- Issue date Feb 4, 2020
- Cubic Corporation
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bonding flexible part including inclined leads
- Patent number 10,475,728
- Issue date Nov 12, 2019
- PROTEC CO., LTD.
- Moo Sup Shim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,453,832
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-chip alignment
- Patent number 10,410,989
- Issue date Sep 10, 2019
- University of Notre Dame du Lac
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,403,804
- Issue date Sep 3, 2019
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and alternator and power conversion device wh...
- Patent number 10,319,849
- Issue date Jun 11, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Tetsuya Ishimaru
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated chip scale packages
- Patent number 10,319,654
- Issue date Jun 11, 2019
- Cubic Corporation
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,026,882
- Issue date Jul 17, 2018
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap for a chip device having a groove, device provided with said ca...
- Patent number 9,888,573
- Issue date Feb 6, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Dominique Vicard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale technique for interconnecting vertically stacked dies
- Patent number 9,331,051
- Issue date May 3, 2016
- Technische Universiteit Eindhoven
- Pinxiang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-transfer structure
- Patent number 9,308,571
- Issue date Apr 12, 2016
- Alcatel Lucent
- Roger Scott Kempers
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,136,193
- Issue date Sep 15, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masanori Minamio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Deformable network structure
- Patent number 8,987,913
- Issue date Mar 24, 2015
- Monolithe Semiconductor Inc.
- Kevin T. Y. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,987,877
- Issue date Mar 24, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masanori Minamio
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Heat-transfer structure
- Patent number 8,963,323
- Issue date Feb 24, 2015
- Alcatel Lucent
- Roger Scott Kempers
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Wafer-level packaged device having self-assembled resilient leads
- Patent number 8,692,367
- Issue date Apr 8, 2014
- Maxim Integrated Products, Inc.
- Chiung C. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extendable network structure
- Patent number 8,471,387
- Issue date Jun 25, 2013
- Monolithe Semiconductor Inc.
- Kevin T. Y. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaged device having self-assembled resilient leads
- Patent number 8,278,748
- Issue date Oct 2, 2012
- Maxim Integrated Products, Inc.
- Chiung C. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device interconnects
- Patent number 8,173,908
- Issue date May 8, 2012
- Sharp Kabushiki Kaisha
- Thomas Heinz-Helmut Altebaeumer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extendable connector and network
- Patent number 8,072,045
- Issue date Dec 6, 2011
- The Board of Trustees of the Leland Stanford Junior University
- Peter Peumans
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit and method of fabricating the same
- Patent number 7,973,417
- Issue date Jul 5, 2011
- Qimonda AG
- Alfred Martin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...
- Publication number 20240222325
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACERS FORMED ON A SUBSTRATE WITH ETCHED MICRO-SPRINGS
- Publication number 20220301996
- Publication date Sep 22, 2022
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20220278090
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...
- Publication number 20210091039
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20200350302
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP SCALE PACKAGES
- Publication number 20190287869
- Publication date Sep 19, 2019
- Cubic Corporation
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP SCALE PACKAGES
- Publication number 20190172764
- Publication date Jun 6, 2019
- Nuvotronics, INC
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20190109125
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MICRO PIN
- Publication number 20190074259
- Publication date Mar 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Jui HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR BONDING FLEXIBLE PART INCLUDING INCLINED LEADS
- Publication number 20180342445
- Publication date Nov 29, 2018
- PROTEC CO., LTD.
- MOO SUP SHIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...
- Publication number 20180301609
- Publication date Oct 18, 2018
- EPISTAR CORPORATION
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20180175012
- Publication date Jun 21, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inter-Chip Alignment
- Publication number 20170229416
- Publication date Aug 10, 2017
- UNIVERSITY OF NOTRE DAME DU LAC
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS AND DEVICES FOR INTER-SUBSTRATE COUPLING
- Publication number 20160126217
- Publication date May 5, 2016
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140299982
- Publication date Oct 9, 2014
- PANASONIC CORPORATION
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer scale technique for interconnecting vertically stacked dies
- Publication number 20140300008
- Publication date Oct 9, 2014
- Pinxiang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140264801
- Publication date Sep 18, 2014
- PANASONIC CORPORATION
- Masanori Minamio
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Deformable Network Structure
- Publication number 20130256921
- Publication date Oct 3, 2013
- Kevin T.Y. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SAME
- Publication number 20130015567
- Publication date Jan 17, 2013
- PANASONIC CORPORATION
- Masanori Minamio
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Extendable Network Structure
- Publication number 20110278729
- Publication date Nov 17, 2011
- MONOLITHE SEMICONDUCTOR INC.
- Kevin T.Y. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGED DEVICE HAVING SELF-ASSEMBLED RESILIENT LEADS
- Publication number 20110198745
- Publication date Aug 18, 2011
- MAXIM INTEGRATED PRODUCTS, INC.
- Chiung C. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method of manufacturing the same
- Publication number 20110042812
- Publication date Feb 24, 2011
- DENSO CORPORATION
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDABLE CONNECTOR AND NETWORK
- Publication number 20110042832
- Publication date Feb 24, 2011
- The Board of Trustees of the Leland Stanford Junior University
- Peter Peumans
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20100136747
- Publication date Jun 3, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Tae-Sung PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-TRANSFER STRUCTURE
- Publication number 20090315173
- Publication date Dec 24, 2009
- Lucent Technologies Inc.
- Roger Scott Kempers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FABRICATING THE SAME
- Publication number 20090261480
- Publication date Oct 22, 2009
- Alfred Martin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE INTERCONNECTS
- Publication number 20090242260
- Publication date Oct 1, 2009
- Thomas Heinz-Helmut ALTEBAEUMER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080111229
- Publication date May 15, 2008
- Samsung Electronics Co., Ltd.
- Tae-Sung PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXTENDABLE CONNECTOR AND NETWORK
- Publication number 20080064125
- Publication date Mar 13, 2008
- Peter Peumans
- G01 - MEASURING TESTING

of an individual connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor assemblies using edge stacking and methods of manufac...

Spacers formed on a substrate with etched micro-springs

Seal ring structures and methods of forming same

Seal ring structures and methods of forming same

Conductive micro pin

Scan channel fabric for tiled circuit designs

Semiconductor assemblies using edge stacking and methods of manufac...

Seal ring structures and methods of forming same

Integrated chip scale packages

Apparatus for bonding flexible part including inclined leads

Seal ring structures and methods of forming same

Inter-chip alignment

Using MEMS fabrication incorporating into LED device mounting and a...

Semiconductor device, and alternator and power conversion device wh...

Integrated chip scale packages

Semiconductor arrangement, semiconductor system and method of formi...

Using MEMS fabrication incorporating into LED device mounting and a...

Cap for a chip device having a groove, device provided with said ca...

Wafer scale technique for interconnecting vertically stacked dies

Heat-transfer structure

Semiconductor device and method of manufacturing the same

Deformable network structure

Semiconductor device

Heat-transfer structure

Wafer-level packaged device having self-assembled resilient leads

Extendable network structure

Wafer-level packaged device having self-assembled resilient leads

Device interconnects

Extendable connector and network

Integrated circuit and method of fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...

SPACERS FORMED ON A SUBSTRATE WITH ETCHED MICRO-SPRINGS

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

INTEGRATED CHIP SCALE PACKAGES

INTEGRATED CHIP SCALE PACKAGES

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

CONDUCTIVE MICRO PIN

APPARATUS FOR BONDING FLEXIBLE PART INCLUDING INCLINED LEADS

USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

Inter-Chip Alignment

SYSTEMS, METHODS AND DEVICES FOR INTER-SUBSTRATE COUPLING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Wafer scale technique for interconnecting vertically stacked dies

SEMICONDUCTOR DEVICE

Deformable Network Structure

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SAME

Extendable Network Structure

WAFER-LEVEL PACKAGED DEVICE HAVING SELF-ASSEMBLED RESILIENT LEADS

Electronic device and method of manufacturing the same

EXTENDABLE CONNECTOR AND NETWORK

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

HEAT-TRANSFER STRUCTURE

INTEGRATED CIRCUIT AND METHOD OF FABRICATING THE SAME

DEVICE INTERCONNECTS

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

EXTENDABLE CONNECTOR AND NETWORK