of an individual strap connector

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CPC
H01L2224/37

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/37of an individual strap connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Long-life extended temperature range embedded diode design for elec...
- Patent number 12,154,814
- Issue date Nov 26, 2024
- Lam Research Corporation
- Siyuan Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sense terminal
- Patent number 12,113,041
- Issue date Oct 8, 2024
- Renesas Electronics Corporation
- Noriko Okunishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bonding method
- Patent number 12,080,675
- Issue date Sep 3, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and semiconductor arrangement having thermally conduct...
- Patent number 12,068,213
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,068,741
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,063,030
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method for semiconductor device
- Patent number 12,062,634
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with adjustable clip
- Patent number 12,046,540
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Christian Feuerbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including resin with a filler for encapsulatin...
- Patent number 11,990,393
- Issue date May 21, 2024
- Denso Corporation
- Tarou Igoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stack module and method of fabricating the same
- Patent number 11,984,432
- Issue date May 14, 2024
- Unity Power Technology Limited
- Kuk Fong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,936,369
- Issue date Mar 19, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method of manufacturing the same and metal b...
- Patent number 11,908,824
- Issue date Feb 20, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with branch electrode terminal and method of m...
- Patent number 11,901,326
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact clip with a contact region ha...
- Patent number 11,869,865
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long-life extended temperature range embedded diode design for elec...
- Patent number 11,869,794
- Issue date Jan 9, 2024
- Lam Research Corporation
- Siyuan Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wire bond joints and related methods of...
- Patent number 11,842,953
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side heat dissipation for silicon chip package
- Patent number 11,842,952
- Issue date Dec 12, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current shunt with reduced temperature relative to voltage drop
- Patent number 11,810,888
- Issue date Nov 7, 2023
- Infineon Technologies AG
- Andreas Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and processes for increasing semiconductor device reliability
- Patent number 11,784,155
- Issue date Oct 10, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metal clip with a solder volume balan...
- Patent number 11,769,748
- Issue date Sep 26, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer, semiconductor wafer, c...
- Patent number 11,756,917
- Issue date Sep 12, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with laser-welded leadframe
- Patent number 11,749,633
- Issue date Sep 5, 2023
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 11,736,197
- Issue date Aug 22, 2023
- CIG PHOTONICS JAPAN LIMITED
- Daisuke Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,728,801
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,715,676
- Issue date Aug 1, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module using same
- Patent number 11,694,948
- Issue date Jul 4, 2023
- Mitsubishi Electric Corporation
- Masashi Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with three leads
- Patent number 11,688,714
- Issue date Jun 27, 2023
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240404941
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Asuma IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240395761
- Publication date Nov 28, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387455
- Publication date Nov 21, 2024
- NHINC Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...
- Publication number 20240387526
- Publication date Nov 21, 2024
- Infineon Technologies Austria AG
- Gerhard Thomas Nöbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240387442
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Kensuke TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BONDING METHOD
- Publication number 20240379610
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240363501
- Publication date Oct 31, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Qian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE
- Publication number 20240355773
- Publication date Oct 24, 2024
- STATS ChipPAC Pte Ltd.
- KyungEun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES
- Publication number 20240355772
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Suhaimi Azizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...
- Publication number 20240332133
- Publication date Oct 3, 2024
- ams-OSRAM International GmbH
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20240332144
- Publication date Oct 3, 2024
- NEXPERIA B.V.
- Hiu Hay Nichole Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Delay-Free Temperature Measurement Of Power Switches
- Publication number 20240319012
- Publication date Sep 26, 2024
- Vitesco Technologies GMBH
- Fadi Rifai
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER C...
- Publication number 20240312880
- Publication date Sep 19, 2024
- Mitsubishi Electric Corporation
- Yusuke KUSAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312875
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Rie ARIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...
- Publication number 20240312882
- Publication date Sep 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Junqing HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICH PACKAGE FOR MICROELECTRONICS
- Publication number 20240290757
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282692
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yo MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282678
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282677
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Masaaki MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20240275373
- Publication date Aug 15, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
- Publication number 20240274557
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Yo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP ASSEMBLY, SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANU...
- Publication number 20240250005
- Publication date Jul 25, 2024
- CHONGQING ALPHA AND OMEGA SEMICONDUCTOR LIMITED
- LIMIN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240244750
- Publication date Jul 18, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND A...
- Publication number 20240243095
- Publication date Jul 18, 2024
- CHONGQING ALPHA AND OMEGA SEMICONDUCTOR LIMITED
- LIMIN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240234360
- Publication date Jul 11, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234361
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid Immersion-Cooled Power Module
- Publication number 20240222225
- Publication date Jul 4, 2024
- Hyundai Motor Company
- Suk Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONN...
- Publication number 20240222311
- Publication date Jul 4, 2024
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213208
- Publication date Jun 27, 2024
- Power Master Semiconductor Co., Ltd.
- Taekkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS

of an individual strap connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Long-life extended temperature range embedded diode design for elec...

Semiconductor device with sense terminal

Semiconductor device and bonding method

Chip package and semiconductor arrangement having thermally conduct...

Switching device and electronic circuit

Switching device and electronic circuit

Semiconductor device and production method for semiconductor device

Leadframe package with adjustable clip

Semiconductor device and electronic device

Semiconductor device including resin with a filler for encapsulatin...

Semiconductor chip stack module and method of fabricating the same

Switching device and electronic circuit

Semiconductor package, method of manufacturing the same and metal b...

Semiconductor device with branch electrode terminal and method of m...

Semiconductor device having a contact clip with a contact region ha...

Long-life extended temperature range embedded diode design for elec...

Semiconductor package with wire bond joints and related methods of...

Double side heat dissipation for silicon chip package

Current shunt with reduced temperature relative to voltage drop

Systems and processes for increasing semiconductor device reliability

Semiconductor device having a metal clip with a solder volume balan...

Method for processing a semiconductor wafer, semiconductor wafer, c...

Power semiconductor module with laser-welded leadframe

Optical module

Semiconductor device

Switching device and electronic circuit

Semiconductor device

Semiconductor device and semiconductor module using same

Semiconductor package with three leads

Additive manufacturing of a frontside or backside interconnect of a...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE

METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND BONDING METHOD

SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...

SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE

ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES

CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

Delay-Free Temperature Measurement Of Power Switches

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER C...

SEMICONDUCTOR DEVICE

CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...

SANDWICH PACKAGE FOR MICROELECTRONICS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE

METAL CLIP ASSEMBLY, SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANU...

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND A...

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SEMICONDUCTOR DEVICE

Liquid Immersion-Cooled Power Module

SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONN...

SEMICONDUCTOR DEVICE