of an individual wire connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48of an individual wire connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,272,625
- Issue date Apr 8, 2025
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic chip support device and corresponding manufacturing method
- Patent number 12,272,922
- Issue date Apr 8, 2025
- STMicroelectronics (Grenoble 2) SAS
- Fabien Quercia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting device for frequency-modulated emission
- Patent number 12,270,905
- Issue date Apr 8, 2025
- Lumileds, LLC
- Emanuel Nicolaas Hermanus Johannes Stassar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive members atop semiconductor packages
- Patent number 12,272,626
- Issue date Apr 8, 2025
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated transformer module
- Patent number 12,272,638
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Takayuki Tange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer configured for single touch-down testing
- Patent number 12,270,853
- Issue date Apr 8, 2025
- SanDisk Technologies, Inc.
- Toru Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,272,652
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jiwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 12,272,725
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Ball bond impedance matching
- Patent number 12,266,629
- Issue date Apr 1, 2025
- Raytheon Company
- Patrick E. Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with isolated semiconductor die and el...
- Patent number 12,266,595
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,266,633
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Beta-sialon phosphor and light emitting device
- Patent number 12,264,274
- Issue date Apr 1, 2025
- DENKA COMPANY LIMITED
- Tomohiro Nomiyama
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Voltage-controlled switching device with resistive path
- Patent number 12,266,680
- Issue date Apr 1, 2025
- Infineon Technologies Dresden GmbH & Co. KG
- Christian Philipp Sandow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light-emitting device
- Patent number 12,266,737
- Issue date Apr 1, 2025
- Epistar Corporation
- Yi-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with solder restraining wall
- Patent number 12,266,624
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,266,627
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Shinji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing a housing
- Patent number 12,261,063
- Issue date Mar 25, 2025
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flanks and tie bars and...
- Patent number 12,261,101
- Issue date Mar 25, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of conductive via or trench for intra module EMI shielding
- Patent number 12,261,127
- Issue date Mar 25, 2025
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for on-circuit board de-embedding
- Patent number 12,259,430
- Issue date Mar 25, 2025
- Intel Corporation
- Bishnu Prasad Patra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metallization of integrated circuit packages
- Patent number 12,261,123
- Issue date Mar 25, 2025
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,103
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, electronic apparatus, and method for manufac...
- Patent number 12,255,170
- Issue date Mar 18, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yasushi Otsuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CONTROLLER
- Publication number 20250118689
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118700
- Publication date Apr 10, 2025
- QUANZHOU SANAN INTEGRATED CIRCUIT CO.,LTD.
- Xiaopeng GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-END CIRCUIT AND SEMI-CONDUCTOR DEVICE
- Publication number 20250118708
- Publication date Apr 10, 2025
- RICHWAVE TECHNOLOGY CORP.
- Kuang-Lieh Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118621
- Publication date Apr 10, 2025
- DENSO CORPORATION
- MOTOMI MUROZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE ARRANGEMENT
- Publication number 20250118634
- Publication date Apr 10, 2025
- Infineon Technologies Austria AG
- Chang Young PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming
- Publication number 20250118609
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118616
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Tea-Geon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118623
- Publication date Apr 10, 2025
- DENSO CORPORATION
- Ryo KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118652
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250118617
- Publication date Apr 10, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Huibin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...
- Publication number 20250118681
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL THERMAL DISSIPATION STRU...
- Publication number 20250112114
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Ninad Shahane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20250112131
- Publication date Apr 3, 2025
- Shinko Electric Industries Co., Ltd.
- Konosuke KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250112134
- Publication date Apr 3, 2025
- Mitsubishi Electric Corporation
- Yoshihisa UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND MULTICHIP PACKAGE
- Publication number 20250112197
- Publication date Apr 3, 2025
- MEDIATEK INC.
- Yu-Liang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER
- Publication number 20250112182
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE
- Publication number 20250110301
- Publication date Apr 3, 2025
- Intel Corporation
- Saeed Fathololoumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250112095
- Publication date Apr 3, 2025
- Mitsubishi Electric Corporation
- Kazufumi OKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE
- Publication number 20250112126
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250112562
- Publication date Apr 3, 2025
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT POWER MODULE
- Publication number 20250112211
- Publication date Apr 3, 2025
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH STEPPED CONDUCTIVE TERMINALS
- Publication number 20250112133
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Huo Yun DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY PROTECTIVE WAFER EDGE SIDEWALLl PROTECTION LAYER
- Publication number 20250112102
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGES OVER METAL VOIDS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20250112125
- Publication date Apr 3, 2025
- Intel Corporation
- Ranjul Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS
- Publication number 20250112130
- Publication date Apr 3, 2025
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH SLANTED SECTIONS
- Publication number 20250112132
- Publication date Apr 3, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER GUARD TRACE
- Publication number 20250112148
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20250105125
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Daisuke Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION
- Publication number 20250107305
- Publication date Mar 27, 2025
- ROHM CO., LTD.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS

of an individual wire connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing semiconductor device

Stacking structure, package structure and method of fabricating the...

Electronic chip support device and corresponding manufacturing method

Lighting device for frequency-modulated emission

Conductive members atop semiconductor packages

Integrated transformer module

Semiconductor wafer configured for single touch-down testing

Semiconductor package

Low warpage high density trench capacitor

3D semiconductor memory device and structure with memory and metal...

Ball bond impedance matching

Semiconductor device package with isolated semiconductor die and el...

Semiconductor structure and method of forming the same

Beta-sialon phosphor and light emitting device

Voltage-controlled switching device with resistive path

Semiconductor light-emitting device

Hermetic package for high CTE mismatch

Semiconductor die with solder restraining wall

Semiconductor device and method for manufacturing the same

Method and device for producing a housing

Semiconductor package having wettable lead flanks and tie bars and...

Semiconductor package having an encapulant comprising conductive fi...

Application of conductive via or trench for intra module EMI shielding

Technologies for on-circuit board de-embedding

Selective metallization of integrated circuit packages

Semiconductor device package and a method of manufacturing the same

Semiconductor package

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor device and method for manufacturing the same

Semiconductor package, electronic apparatus, and method for manufac...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING A CONTROLLER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

FRONT-END CIRCUIT AND SEMI-CONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTELLIGENT POWER MODULE ARRANGEMENT

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Semiconductor Packages and Methods of Forming

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

POWER MODULE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL THERMAL DISSIPATION STRU...

LEAD FRAME AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WIREBOND MULTICHIP PACKAGE

SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER

TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE

SEMICONDUCTOR DEVICE

COMPACT POWER MODULE

PACKAGES WITH STEPPED CONDUCTIVE TERMINALS

HIGHLY PROTECTIVE WAFER EDGE SIDEWALLl PROTECTION LAYER

BRIDGES OVER METAL VOIDS IN INTEGRATED CIRCUIT PACKAGES

FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS

SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH SLANTED SECTIONS

TRANSFORMER GUARD TRACE

ISOLATOR

SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION