of an individual wire connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48of an individual wire connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and device for producing a housing
- Patent number 12,261,063
- Issue date Mar 25, 2025
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flanks and tie bars and...
- Patent number 12,261,101
- Issue date Mar 25, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of conductive via or trench for intra module EMI shielding
- Patent number 12,261,127
- Issue date Mar 25, 2025
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for on-circuit board de-embedding
- Patent number 12,259,430
- Issue date Mar 25, 2025
- Intel Corporation
- Bishnu Prasad Patra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metallization of integrated circuit packages
- Patent number 12,261,123
- Issue date Mar 25, 2025
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,103
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, electronic apparatus, and method for manufac...
- Patent number 12,255,170
- Issue date Mar 18, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yasushi Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,255,191
- Issue date Mar 18, 2025
- Rohm Co., Ltd.
- Hideki Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device
- Patent number 12,255,275
- Issue date Mar 18, 2025
- Rohm Co., Ltd.
- Tomoichiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 12,255,177
- Issue date Mar 18, 2025
- SK HYNIX INC.
- Yo Sep Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package type semiconductor package
- Patent number 12,255,197
- Issue date Mar 18, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 12,255,115
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon spacers with improved adhesion and semiconductor device ass...
- Patent number 12,255,128
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor component and method of fabrica...
- Patent number 12,255,162
- Issue date Mar 18, 2025
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate and electronic device
- Patent number 12,249,546
- Issue date Mar 11, 2025
- Kyocera Corporation
- Sadamu Kajisa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent power module containing exposed surfaces of transistor...
- Patent number 12,249,562
- Issue date Mar 11, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and manufacturing method thereof
- Patent number 12,243,811
- Issue date Mar 4, 2025
- Dai Nippon Printing Co., Ltd.
- Masahiro Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,243,842
- Issue date Mar 4, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
- Patent number 12,243,834
- Issue date Mar 4, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Doo Soub Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passives to facilitate mold compound flow
- Patent number 12,243,849
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Chittranjan Mohan Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, systems, and methods for stacked die packages
- Patent number 12,243,850
- Issue date Mar 4, 2025
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ISOLATOR
- Publication number 20250105125
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Daisuke Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND EQUIPMENT
- Publication number 20250107257
- Publication date Mar 27, 2025
- Canon Kabushiki Kaisha
- YU KATASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION
- Publication number 20250107305
- Publication date Mar 27, 2025
- ROHM CO., LTD.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE
- Publication number 20250104761
- Publication date Mar 27, 2025
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE INTERPOSER
- Publication number 20250105131
- Publication date Mar 27, 2025
- Pragmatic Semiconductor Limited
- Brian COBB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105236
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hong Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250107298
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250105188
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Paofa WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF AND INTERMEDIATE FOR MANUFACTURING A SEMICONDUCTOR DIE PA...
- Publication number 20250105206
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD PACKAGE WITH ENHANCED CORNER PADS FOR BOARD LEVEL...
- Publication number 20250105104
- Publication date Mar 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT PACKAGES THAT DEMONSTRATE REDUCED ADHESION TO MO...
- Publication number 20250105107
- Publication date Mar 27, 2025
- Aculon, Inc.
- Donald Cunningham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250107126
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Tomohiro TANIGUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105128
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Byungjoon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A BONDING WIRE
- Publication number 20250105201
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Younghun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105235
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFY DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20250105804
- Publication date Mar 27, 2025
- RICHWAVE TECHNOLOGY CORP.
- Po-Yen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105177
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Shogo MINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250105197
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Tatsuto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, AND A PACKAGE ON PACKAGE TYPE SEMICONDUCTOR...
- Publication number 20250105217
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20250105237
- Publication date Mar 27, 2025
- MEDIATEK INC.
- Chung-Min Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...
- Publication number 20250105079
- Publication date Mar 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONTROL UNIT
- Publication number 20250105081
- Publication date Mar 27, 2025
- DENSO CORPORATION
- Keita FUKUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE
- Publication number 20250105157
- Publication date Mar 27, 2025
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...
- Publication number 20250096008
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096099
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- JAESUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...
- Publication number 20250096102
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...
- Publication number 20250096211
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Sangnam JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20250096220
- Publication date Mar 20, 2025
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20250098325
- Publication date Mar 20, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20250098347
- Publication date Mar 20, 2025
- ams-OSRAM International GmbH
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS

of an individual wire connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and device for producing a housing

Semiconductor package having wettable lead flanks and tie bars and...

Semiconductor package having an encapulant comprising conductive fi...

Application of conductive via or trench for intra module EMI shielding

Technologies for on-circuit board de-embedding

Selective metallization of integrated circuit packages

Semiconductor device package and a method of manufacturing the same

Semiconductor package

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor device and method for manufacturing the same

Semiconductor package, electronic apparatus, and method for manufac...

Semiconductor device

Semiconductor manufacturing apparatus and method of manufacturing s...

Semiconductor light emitting device

Stacked semiconductor device

Secure semiconductor integration and method for making thereof

Package-on-package type semiconductor package

Electronic devices in semiconductor package cavities

Silicon spacers with improved adhesion and semiconductor device ass...

Semiconductor packages and methods of forming the same

Wire bond wires for interference shielding

Semiconductor device, semiconductor component and method of fabrica...

Electronic element mounting substrate and electronic device

Intelligent power module containing exposed surfaces of transistor...

Lead frame and manufacturing method thereof

Semiconductor device with electromagnetic interference film and met...

Semiconductor device with open cavity and method therefor

Semiconductor package with EMI shield and fabricating method thereof

Passives to facilitate mold compound flow

Devices, systems, and methods for stacked die packages

Patents Applicationslast 30 patents

ISOLATOR

ELECTRONIC COMPONENT AND EQUIPMENT

SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE

FLEXIBLE INTERPOSER

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

PACKAGE STRUCTURE

METHOD OF AND INTERMEDIATE FOR MANUFACTURING A SEMICONDUCTOR DIE PA...

QUAD FLAT NO-LEAD PACKAGE WITH ENHANCED CORNER PADS FOR BOARD LEVEL...

ELECTRONIC CIRCUIT PACKAGES THAT DEMONSTRATE REDUCED ADHESION TO MO...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A BONDING WIRE

SEMICONDUCTOR PACKAGE

AMPLIFY DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE, AND A PACKAGE ON PACKAGE TYPE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE ASSEMBLY

INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...

SEMICONDUCTOR DEVICE AND POWER CONTROL UNIT

BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...

INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...