of an individual wire connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48of an individual wire connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-typed integrated passive device (IPD) components and devices...
- Patent number 12,230,614
- Issue date Feb 18, 2025
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,230,557
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Sangwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with vertical passive components
- Patent number 12,230,615
- Issue date Feb 18, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Jiraphat Charoenratpratoom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor, and method for manufacturing optical sensor
- Patent number 12,230,618
- Issue date Feb 18, 2025
- Rohm Co., Ltd.
- Yuya Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile sensor packages
- Patent number 12,230,619
- Issue date Feb 18, 2025
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,224,232
- Issue date Feb 11, 2025
- SILICONIX INCORPORATED
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 12,224,247
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component arrangement, package and package arrangement, as well as...
- Patent number 12,224,388
- Issue date Feb 11, 2025
- MSG LITHOGLAS GMBH
- Oliver Gyenge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a thermally and electrically conductiv...
- Patent number 12,224,222
- Issue date Feb 11, 2025
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,224,231
- Issue date Feb 11, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-cut lead-frame for integrated circuit (IC) packages
- Patent number 12,224,181
- Issue date Feb 11, 2025
- Texas Instruments Incorporated
- Tiange Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device
- Patent number 12,224,579
- Issue date Feb 11, 2025
- Nexperia B.V.
- Hans-Martin Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,218,077
- Issue date Feb 4, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 12,218,074
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved performance in operation and imp...
- Patent number 12,218,029
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fault tolerant memory systems and components with interconnected an...
- Patent number 12,216,543
- Issue date Feb 4, 2025
- RAMBUS INC.
- Kenneth L. Wright
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pattern
- Patent number 12,211,777
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,211,829
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener package and method of fabricating stiffener package
- Patent number 12,211,705
- Issue date Jan 28, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 12,209,015
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light emitting device, resin package, resin-molded body, and method...
- Patent number 12,211,959
- Issue date Jan 28, 2025
- Nichia Corporation
- Hirofumi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride based depletion mode differential amplifiers and...
- Patent number 12,212,289
- Issue date Jan 28, 2025
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 12,211,772
- Issue date Jan 28, 2025
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly protective wafer edge sidewall protection layer
- Patent number 12,211,766
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and lead frame with enhanced device isolation
- Patent number 12,211,770
- Issue date Jan 28, 2025
- Infineon Technologies Austria AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having first and second lead frames
- Patent number 12,211,824
- Issue date Jan 28, 2025
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062283
- Publication date Feb 20, 2025
- SK HYNIX INC.
- Seong Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE
- Publication number 20250062290
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250062298
- Publication date Feb 20, 2025
- JCET Group Co., Ltd.
- Yaojian LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING TH...
- Publication number 20250062202
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yi Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20250062217
- Publication date Feb 20, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE
- Publication number 20250062242
- Publication date Feb 20, 2025
- Hitachi Energy Ltd
- Fabian FISCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20250063876
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Masahiko KOBAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING CHIP STACK STRUCTURE
- Publication number 20250062288
- Publication date Feb 20, 2025
- SK HYNIX INC.
- Seong Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062237
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Kwangsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SEMICONDUCTOR DIE CURRENT SENSOR INTEGRATED CIRCUIT
- Publication number 20250062198
- Publication date Feb 20, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Matthew Hein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING DUMMY STRUCTURE AT CORNER REGION T...
- Publication number 20250062210
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Seongyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250062277
- Publication date Feb 20, 2025
- Macronix International Co., Ltd.
- Shih-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Using Lead Frame Interposer in Bump...
- Publication number 20250054902
- Publication date Feb 13, 2025
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFA...
- Publication number 20250054830
- Publication date Feb 13, 2025
- Mitsubishi Electric Corporation
- Riki KAJIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...
- Publication number 20250054844
- Publication date Feb 13, 2025
- Realtek Semiconductor Corp.
- Yu-Hsin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD
- Publication number 20250054845
- Publication date Feb 13, 2025
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AN INDUCTIVE COATING
- Publication number 20250054882
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Bong Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250054889
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jinhee HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR PRODUCING SAME
- Publication number 20250054907
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250054901
- Publication date Feb 13, 2025
- Fuji Electric Co., Ltd.
- Seiichi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054927
- Publication date Feb 13, 2025
- Rohm Co., Ltd.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING
- Publication number 20250054818
- Publication date Feb 13, 2025
- SANDISK TECHNOLOGIES, INC.
- Akira Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE, IMAGING MODULE, ELECTRONIC DEVICE, AND IMAGING SYSTEM
- Publication number 20250053798
- Publication date Feb 13, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Takayuki IKEDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT
- Publication number 20250054868
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250054896
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jooyoung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE BRIDGE AND ITS MANUFACTURING PROCESS
- Publication number 20250054918
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20250054921
- Publication date Feb 13, 2025
- Sony Semiconductor Solutions Corporation
- Akira OHMAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...
- Publication number 20250056880
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20250054841
- Publication date Feb 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS

of an individual wire connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronics assemblies employing copper in multiple locations

Multi-typed integrated passive device (IPD) components and devices...

Semiconductor package

Semiconductor packages with vertical passive components

Optical sensor, and method for manufacturing optical sensor

Low profile sensor packages

Semiconductor package having side wall plating

Fan-out package having a main die and a dummy die

Component arrangement, package and package arrangement, as well as...

Semiconductor package having a thermally and electrically conductiv...

Semiconductor module

Semiconductor module and power conversion apparatus

Laser-cut lead-frame for integrated circuit (IC) packages

ESD protection device

Semiconductor device package

DC and AC magnetic field protection for MRAM device using magnetic-...

Semiconductor device with improved performance in operation and imp...

Fault tolerant memory systems and components with interconnected an...

Semiconductor device and method of manufacturing the same

Semiconductor package including a dummy pattern

Semiconductor package

Stiffener package and method of fabricating stiffener package

MEMS packages and methods of manufacture thereof

Light emitting device, resin package, resin-molded body, and method...

Group III nitride based depletion mode differential amplifiers and...

Method of manufacturing semiconductor devices and corresponding sem...

Highly protective wafer edge sidewall protection layer

Semiconductor package and lead frame with enhanced device isolation

Package-on-package assembly with wire bond vias

Power semiconductor package having first and second lead frames

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

POWER SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

PACKAGE STRUCTURE, SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING TH...

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING CHIP STACK STRUCTURE

SEMICONDUCTOR PACKAGE

DUAL SEMICONDUCTOR DIE CURRENT SENSOR INTEGRATED CIRCUIT

SEMICONDUCTOR PACKAGE COMPRISING DUMMY STRUCTURE AT CORNER REGION T...

MEMORY DEVICE

Semiconductor Device and Method Using Lead Frame Interposer in Bump...

SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFA...

LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...

LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD

SEMICONDUCTOR DEVICE WITH AN INDUCTIVE COATING

SEMICONDUCTOR PACKAGE

POWER MODULE AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING

IMAGING DEVICE, IMAGING MODULE, ELECTRONIC DEVICE, AND IMAGING SYSTEM

POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT

SEMICONDUCTOR PACKAGE

POWER MODULE BRIDGE AND ITS MANUFACTURING PROCESS

LIGHT EMITTING DEVICE AND ELECTRONIC APPARATUS

METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...

PACKAGE AND SEMICONDUCTOR DEVICE