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H01L2924/12044

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/12044OLED

Industries

Patents Grantslast 30 patents

Information Patent Grant
Etched trenches in bond materials for die singulation, and associat...
- Patent number 12,132,155
- Issue date Oct 29, 2024
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Light emitting structure
- Patent number 12,094,864
- Issue date Sep 17, 2024
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 12,084,609
- Issue date Sep 10, 2024
- Citizen Electronics Co., Ltd.
- Byungchul Hong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Display apparatus including conductive pattern in substrate and met...
- Patent number 12,082,468
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Kiseong Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package
- Patent number 12,062,618
- Issue date Aug 13, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a pad where a driving chip is mounted
- Patent number 12,055,827
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Sujeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 11,978,825
- Issue date May 7, 2024
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip package
- Patent number 11,894,306
- Issue date Feb 6, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,873,435
- Issue date Jan 16, 2024
- CITIZEN ELECTRONICS CO., LTD.
- Byungchul Hong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,856,828
- Issue date Dec 26, 2023
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including conductive pattern in substrate and met...
- Patent number 11,812,644
- Issue date Nov 7, 2023
- Samsung Display Co., Ltd.
- Kiseong Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Flexible display device and method for manufacturing the same
- Patent number RE49596
- Issue date Aug 1, 2023
- LG Display Co., Ltd.
- Sang-Cheon Youn
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrating a light emitting device
- Patent number 11,676,952
- Issue date Jun 13, 2023
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivated nanoparticles
- Patent number 11,656,231
- Issue date May 23, 2023
- Tectus Corporation
- Lianhua Qu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Display device including a pad where a driving chip is mounted
- Patent number 11,650,465
- Issue date May 16, 2023
- Samsung Display Co., Ltd.
- Sujeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Illumination device
- Patent number 11,613,698
- Issue date Mar 28, 2023
- Citizen Electronics Co., Ltd.
- Byungchul Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,552,034
- Issue date Jan 10, 2023
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,538,763
- Issue date Dec 27, 2022
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,515,202
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,495,560
- Issue date Nov 8, 2022
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, electronic apparatus, and display device manufactur...
- Patent number 11,387,299
- Issue date Jul 12, 2022
- Canon Kabushiki Kaisha
- Nobutaka Ukigaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Nanowires-based transparent conductors
- Patent number 11,328,834
- Issue date May 10, 2022
- Cambrios Film Solutions Corporation
- Jonathan S. Alden
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Flexible display device and method for manufacturing the same
- Patent number RE49052
- Issue date Apr 26, 2022
- LG Display Co., Ltd.
- Sang-Cheon Youn
Information Patent Grant
3D IC method and device
- Patent number 11,289,372
- Issue date Mar 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE
- Publication number 20240379566
- Publication date Nov 14, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20240376380
- Publication date Nov 14, 2024
- Citizen Electronics Co., Ltd.
- Byungchul HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING A PAD WHERE A DRIVING CHIP IS MOUNTED
- Publication number 20240361650
- Publication date Oct 31, 2024
- SAMSUNG DISPLAY CO., LTD.
- SUJEONG KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240130157
- Publication date Apr 18, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Akihiro CHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20240120281
- Publication date Apr 11, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20240101899
- Publication date Mar 28, 2024
- Citizen Electronics Co., Ltd.
- Byungchul HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS INCLUDING CONDUCTIVE PATTERN IN SUBSTRATE AND MET...
- Publication number 20240032363
- Publication date Jan 25, 2024
- SAMSUNG DISPLAY CO., LTD.
- Kiseong Seo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE
- Publication number 20240014195
- Publication date Jan 11, 2024
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20230193126
- Publication date Jun 22, 2023
- Citizen Electronics Co., Ltd.
- Byungchul HONG
- F21 - LIGHTING
Information Patent Application
CHIP PACKAGE
- Publication number 20230073104
- Publication date Mar 9, 2023
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220102667
- Publication date Mar 31, 2022
- Semiconductor Energy Laboratory Co., Ltd.
- Akihiro CHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220093719
- Publication date Mar 24, 2022
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20210343862
- Publication date Nov 4, 2021
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE
- Publication number 20210335714
- Publication date Oct 28, 2021
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210313225
- Publication date Oct 7, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE
- Publication number 20210313305
- Publication date Oct 7, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210280461
- Publication date Sep 9, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED OPTOELECTRONIC INTERCONNECT FOR HIGH-DENSITY INTEGRAT...
- Publication number 20210265331
- Publication date Aug 26, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS INCLUDING CONDUCTIVE PATTERN IN SUBSTRATE AND MET...
- Publication number 20210159305
- Publication date May 27, 2021
- SAMSUNG DISPLAY CO., LTD.
- Kiseong Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...
- Publication number 20210135067
- Publication date May 6, 2021
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE OPTOELECTRONIC DEVICE WITH PREFORMED METAL SUPPORT SUBS...
- Publication number 20210126177
- Publication date Apr 29, 2021
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ILLUMINATION DEVICE
- Publication number 20210062085
- Publication date Mar 4, 2021
- Citizen Electronics Co., Ltd.
- Byungchul HONG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200403054
- Publication date Dec 24, 2020
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200358023
- Publication date Nov 12, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Akihiro CHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20200303340
- Publication date Sep 24, 2020
- Intel Deutschland GmbH
- Gottfried BEER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200273827
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED WITH INTERNALLY CONFINED CURRENT INJECTION AREA
- Publication number 20200251614
- Publication date Aug 6, 2020
- Apple Inc.
- Kelly McGroddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20200243467
- Publication date Jul 30, 2020
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE
- Publication number 20200219863
- Publication date Jul 9, 2020
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Etched trenches in bond materials for die singulation, and associat...

Low pressure sintering powder

Light emitting structure

Light emitting device

Display apparatus including conductive pattern in substrate and met...

Methods and devices for fabricating and assembling printable semico...

Chip package

Display device including a pad where a driving chip is mounted

Chiplets with connection posts

LED with internally confined current injection area

Chip package

Light emitting device

Display device and method of manufacturing the same

Display apparatus including conductive pattern in substrate and met...

Light emitting diode display with redundancy scheme

Flexible display device and method for manufacturing the same

Semiconductor device and method of forming interposer with opening...

Method for integrating a light emitting device

Passivated nanoparticles

Display device including a pad where a driving chip is mounted

Illumination device

Chiplets with connection posts

Chip package

3D IC method and device

Chiplets with connection posts

Display device, electronic apparatus, and display device manufactur...

Light emitting diode display with redundancy scheme

Nanowires-based transparent conductors

Flexible display device and method for manufacturing the same

3D IC method and device

Patents Applicationslast 30 patents

CHIP PACKAGE

LIGHT EMITTING DEVICE

DISPLAY DEVICE INCLUDING A PAD WHERE A DRIVING CHIP IS MOUNTED

CHIPLETS WITH CONNECTION POSTS

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE

LIGHT EMITTING DEVICE

DISPLAY APPARATUS INCLUDING CONDUCTIVE PATTERN IN SUBSTRATE AND MET...

METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE

LIGHT EMITTING DEVICE

CHIP PACKAGE

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

CHIP PACKAGE

3D IC METHOD AND DEVICE

METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE

3D IC METHOD AND DEVICE

DIRECT-BONDED OPTOELECTRONIC INTERCONNECT FOR HIGH-DENSITY INTEGRAT...

DISPLAY APPARATUS INCLUDING CONDUCTIVE PATTERN IN SUBSTRATE AND MET...

ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...

SOLID STATE OPTOELECTRONIC DEVICE WITH PREFORMED METAL SUPPORT SUBS...

ILLUMINATION DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

LED WITH INTERNALLY CONFINED CURRENT INJECTION AREA

CHIPLETS WITH CONNECTION POSTS

METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE