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on the semiconductor or solid-state body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/49431on the semiconductor or solid-state body
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR POWER MODULE
    • Publication number 20250219025
    • Publication date Jul 3, 2025
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250006621
    • Publication date Jan 2, 2025
    • ROHM CO., LTD.
    • Ryohei UMENO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH SPEED, EFFICIENT SIC POWER MODULE
    • Publication number 20240380320
    • Publication date Nov 14, 2024
    • Wolfspeed, Inc.
    • Mrinal K. DAS
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240347426
    • Publication date Oct 17, 2024
    • ROHM CO., LTD.
    • Katsuhiro IWAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR POWER MODULE
    • Publication number 20240234380
    • Publication date Jul 11, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR POWER MODULE
    • Publication number 20240136335
    • Publication date Apr 25, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20230343735
    • Publication date Oct 26, 2023
    • ROHM CO., LTD.
    • Koshun SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230253298
    • Publication date Aug 10, 2023
    • ROHM CO., LTD.
    • Katsuhiro IWAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR POWER MODULE
    • Publication number 20230187416
    • Publication date Jun 15, 2023
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR APPARATUS
    • Publication number 20220140082
    • Publication date May 5, 2022
    • Fuji Electric Co., Ltd.
    • Masanori INOUE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210407893
    • Publication date Dec 30, 2021
    • ROHM CO., LTD.
    • Katsuhiro IWAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20210391287
    • Publication date Dec 16, 2021
    • ROHM CO., LTD.
    • Koshun SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR POWER MODULE
    • Publication number 20210175213
    • Publication date Jun 10, 2021
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210090978
    • Publication date Mar 25, 2021
    • ROHM CO., LTD.
    • Katsuhiro IWAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20200251433
    • Publication date Aug 6, 2020
    • ROHM CO., LTD.
    • Koshun SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR POWER MODULE
    • Publication number 20200185358
    • Publication date Jun 11, 2020
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    SEMICONDUCTOR DEVICE WITH DIE-SKIPPING WIRE BONDS
    • Publication number 20200098728
    • Publication date Mar 26, 2020
    • Western Digital Technologies, Inc.
    • Xinzhi Xing
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20190348332
    • Publication date Nov 14, 2019
    • RENESAS ELECTRONICS CORPORATION
    • Toshihiko AKIBA
    • G01 - MEASURING TESTING
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD
    • Publication number 20190348402
    • Publication date Nov 14, 2019
    • Fuji Electric Co., Ltd.
    • Shin Soyano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20190333885
    • Publication date Oct 31, 2019
    • ROHM CO., LTD.
    • Koshun SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND DRIVE CIRCUIT
    • Publication number 20190326248
    • Publication date Oct 24, 2019
    • Kabushiki Kaisha Toshiba
    • Masahiko HORI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR POWER MODULE
    • Publication number 20190295990
    • Publication date Sep 26, 2019
    • Rohm Co., Ltd.
    • Kenji HAYASHI
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20190139871
    • Publication date May 9, 2019
    • ROHM CO., LTD.
    • Katsuhiro IWAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    • Publication number 20190057913
    • Publication date Feb 21, 2019
    • RENESAS ELECTRONICS CORPORATION
    • Toshihiko AKIBA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER MODULE BASED ON MULTI-LAYER CIRCUIT BOARD
    • Publication number 20180366400
    • Publication date Dec 20, 2018
    • ABB Schweiz AG
    • Fabian Mohn
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20180247923
    • Publication date Aug 30, 2018
    • ABB Schweiz AG
    • Samuel Hartmann
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HALF-BRIDGE POWER SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING...
    • Publication number 20180240787
    • Publication date Aug 23, 2018
    • NISSAN ARC, LTD.
    • Satoshi Tanimoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
    • Publication number 20180090463
    • Publication date Mar 29, 2018
    • RENESAS ELECTRONICS CORPORATION
    • Yukihiro SATOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CTE COMPENSATION FOR WAFER-LEVEL AND CHIP-SCALE PACKAGES AND ASSEMB...
    • Publication number 20170330836
    • Publication date Nov 16, 2017
    • Nuvotronics, INC
    • Kenneth J. Vanhille
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20170062375
    • Publication date Mar 2, 2017
    • Sharp Kabushiki Kaisha
    • Etsuko ISHIZUKA
    • H01 - BASIC ELECTRIC ELEMENTS