on the semiconductor or solid-state body

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H01L2224/49431

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/49431on the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High speed, efficient SiC power module
- Patent number 12,046,998
- Issue date Jul 23, 2024
- Wolfspeed, Inc.
- Mrinal K. Das
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 12,046,541
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 11,901,340
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, efficient sic power module
- Patent number 11,888,392
- Issue date Jan 30, 2024
- Wolfspeed, Inc.
- Mrinal K. Das
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,728,298
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 11,658,100
- Issue date May 23, 2023
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 11,600,602
- Issue date Mar 7, 2023
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip package manufacturing process
- Patent number 11,587,923
- Issue date Feb 21, 2023
- EGALAX_EMPIA TECHNOLOGY INC.
- Po-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with die-skipping wire bonds
- Patent number 11,362,063
- Issue date Jun 14, 2022
- Western Digital Technologies, Inc.
- Xinzhi Xing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 11,183,444
- Issue date Nov 23, 2021
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,133,276
- Issue date Sep 28, 2021
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device fabrication method
- Patent number 11,075,190
- Issue date Jul 27, 2021
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,075,186
- Issue date Jul 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 10,950,582
- Issue date Mar 16, 2021
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure with recessed outer and inner lead surfaces
- Patent number 10,886,203
- Issue date Jan 5, 2021
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CTE compensation for wafer-level and chip-scale packages and assemb...
- Patent number 10,847,469
- Issue date Nov 24, 2020
- Cubic Corporation
- Kenneth J. Vanhille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide power module
- Patent number 10,784,235
- Issue date Sep 22, 2020
- Cree Fayetteville, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge power semiconductor module and method of manufacturing...
- Patent number 10,756,057
- Issue date Aug 25, 2020
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, efficient SiC power module
- Patent number 10,680,518
- Issue date Jun 9, 2020
- Cree, Inc.
- Mrinal K. Das
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,672,762
- Issue date Jun 2, 2020
- Fuji Electric Co., Ltd.
- Akio Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,658,317
- Issue date May 19, 2020
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module based on multi-layer circuit board
- Patent number 10,636,732
- Issue date Apr 28, 2020
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,615,092
- Issue date Apr 7, 2020
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 10,600,764
- Issue date Mar 24, 2020
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,566,255
- Issue date Feb 18, 2020
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) die attached between an offset lead frame d...
- Patent number 10,553,524
- Issue date Feb 4, 2020
- Microchip Technology Incorporated
- Man Kit Lam
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package structure
- Patent number 10,446,516
- Issue date Oct 15, 2019
- Realtek Semiconductor Corporation
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device fabrication method
- Patent number 10,396,056
- Issue date Aug 27, 2019
- Fuji Electric Co., Ltd.
- Shin Soyano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Half-bridge power semiconductor module and method for manufacturing...
- Patent number 10,396,057
- Issue date Aug 27, 2019
- NISSAN ARC, LTD.
- Satoshi Tanimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,388,616
- Issue date Aug 20, 2019
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH SPEED, EFFICIENT SIC POWER MODULE
- Publication number 20240380320
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Mrinal K. DAS
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347426
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20240234380
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20240136335
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343735
- Publication date Oct 26, 2023
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230253298
- Publication date Aug 10, 2023
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20230187416
- Publication date Jun 15, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20220140082
- Publication date May 5, 2022
- Fuji Electric Co., Ltd.
- Masanori INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407893
- Publication date Dec 30, 2021
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210391287
- Publication date Dec 16, 2021
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20210175213
- Publication date Jun 10, 2021
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210090978
- Publication date Mar 25, 2021
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200251433
- Publication date Aug 6, 2020
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20200185358
- Publication date Jun 11, 2020
- ROHM CO., LTD.
- Kenji HAYASHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE WITH DIE-SKIPPING WIRE BONDS
- Publication number 20200098728
- Publication date Mar 26, 2020
- Western Digital Technologies, Inc.
- Xinzhi Xing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190348332
- Publication date Nov 14, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD
- Publication number 20190348402
- Publication date Nov 14, 2019
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190333885
- Publication date Oct 31, 2019
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DRIVE CIRCUIT
- Publication number 20190326248
- Publication date Oct 24, 2019
- Kabushiki Kaisha Toshiba
- Masahiko HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20190295990
- Publication date Sep 26, 2019
- Rohm Co., Ltd.
- Kenji HAYASHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190139871
- Publication date May 9, 2019
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190057913
- Publication date Feb 21, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE BASED ON MULTI-LAYER CIRCUIT BOARD
- Publication number 20180366400
- Publication date Dec 20, 2018
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20180247923
- Publication date Aug 30, 2018
- ABB Schweiz AG
- Samuel Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF-BRIDGE POWER SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING...
- Publication number 20180240787
- Publication date Aug 23, 2018
- NISSAN ARC, LTD.
- Satoshi Tanimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
- Publication number 20180090463
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CTE COMPENSATION FOR WAFER-LEVEL AND CHIP-SCALE PACKAGES AND ASSEMB...
- Publication number 20170330836
- Publication date Nov 16, 2017
- Nuvotronics, INC
- Kenneth J. Vanhille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170062375
- Publication date Mar 2, 2017
- Sharp Kabushiki Kaisha
- Etsuko ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING A PLURALITY...
- Publication number 20160372446
- Publication date Dec 22, 2016
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20160260691
- Publication date Sep 8, 2016
- Toyota Jidosha Kabushiki Kaisha
- Masaki AOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS

on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High speed, efficient SiC power module

Packaging of a semiconductor device with a plurality of leads

Semiconductor power module

High speed, efficient sic power module

Semiconductor device and method for manufacturing the same

Packaging of a semiconductor device with a plurality of leads

Semiconductor power module

Multichip package manufacturing process

Semiconductor device with die-skipping wire bonds

Packaging of a semiconductor device with a plurality of leads

Semiconductor device and method for manufacturing the same

Semiconductor device and semiconductor device fabrication method

Semiconductor package

Semiconductor power module

Packaging structure with recessed outer and inner lead surfaces

CTE compensation for wafer-level and chip-scale packages and assemb...

Silicon carbide power module

Half-bridge power semiconductor module and method of manufacturing...

High speed, efficient SiC power module

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Power module based on multi-layer circuit board

Electronic device

Semiconductor power module

Method of manufacturing semiconductor device

Integrated circuit (IC) die attached between an offset lead frame d...

Semiconductor package structure

Semiconductor device and semiconductor device fabrication method

Half-bridge power semiconductor module and method for manufacturing...

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

HIGH SPEED, EFFICIENT SIC POWER MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR DEVICE WITH DIE-SKIPPING WIRE BONDS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND DRIVE CIRCUIT

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

POWER MODULE BASED ON MULTI-LAYER CIRCUIT BOARD

SEMICONDUCTOR MODULE

HALF-BRIDGE POWER SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE

CTE COMPENSATION FOR WAFER-LEVEL AND CHIP-SCALE PACKAGES AND ASSEMB...

SEMICONDUCTOR DEVICE

LOW PROFILE INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING A PLURALITY...

SEMICONDUCTOR MODULE