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on the semiconductor or solid-state body

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  • CPC
  • H01L2224/40479
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40479on the semiconductor or solid-state body
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device
    • Patent number 10,109,611
    • Issue date Oct 23, 2018
    • Rohm Co., Ltd.
    • Mamoru Yamagami
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 9,831,212
    • Issue date Nov 28, 2017
    • Rohm Co., Ltd.
    • Mamoru Yamagami
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Thermally efficient integrated circuit package
    • Patent number 8,716,830
    • Issue date May 6, 2014
    • Texas Instruments Incorporated
    • Anindya Poddar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3363308
    • Patent number 3,363,308
    • Issue date Jan 16, 1968
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3296507
    • Patent number 3,296,507
    • Issue date Jan 3, 1967
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents