3363308

Information

• Patent Grant
• 3363308

• References
• Source

• Patent Number

  3,363,308

• Date Filed

  Not available

• Date Issued

  Tuesday, January 16, 1968
  57 years ago

• CPC

  • H01L23/488 - consisting of soldered or bonded constructions
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L24/36 - Structure, shape, material or disposition of the strap connectors prior to the connecting process
  • H01L24/37 - of an individual strap connector
  • H01L24/40 - of an individual strap connector
  • H01L24/63 - Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L2224/37011 - comprising apertures or cavities
  • H01L2224/40479 - on the semiconductor or solid-state body
  • Y10S438/979 - Tunnel diodes

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices