onto an inorganic, non-metallic substrate

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CPC
H05K3/0067

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0067onto an inorganic, non-metallic substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a number of electrical nodes, electrical n...
- Patent number 12,052,829
- Issue date Jul 30, 2024
- TACTOTEK OY
- Tomi Simula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,991,824
- Issue date May 21, 2024
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric layer for component carrier with varying material proper...
- Patent number 11,882,648
- Issue date Jan 23, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Thomas Kristl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a number of electrical nodes, electrical n...
- Patent number 11,729,915
- Issue date Aug 15, 2023
- TACTOTEK OY
- Tomi Simula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 11,659,651
- Issue date May 23, 2023
- Hitachi Astemo, Ltd.
- Kazuo Maruyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structures and methods of manufacture
- Patent number 11,419,217
- Issue date Aug 16, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods
- Patent number 11,304,290
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting substrate, supporting substrate-attached laminate and me...
- Patent number 11,217,445
- Issue date Jan 4, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing laminate and substrate for mounting a semicon...
- Patent number 10,964,552
- Issue date Mar 30, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Yoshihiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid raft
- Patent number 10,939,558
- Issue date Mar 2, 2021
- ROLLS-ROYCE pic
- Matthew Hocking
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Grant
Multi-layered substrate manufacturing method
- Patent number 10,714,351
- Issue date Jul 14, 2020
- Nikon Corporation
- Hidehiro Maeda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-layer cooling element
- Patent number 10,327,323
- Issue date Jun 18, 2019
- CeramTec GmbH
- Alexander Dohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible hybrid substrate for display and method for manufacturing...
- Patent number 10,076,030
- Issue date Sep 11, 2018
- Corning Precision Materials Co., Ltd.
- Jin Nyoung Heo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board arrangement and electronic device having a pr...
- Patent number 9,992,866
- Issue date Jun 5, 2018
- Biotronik SE & Co. KG
- Frederik Sporon-Fiedler
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Resin composition for printed wiring board, prepreg, metal-clad lam...
- Patent number 9,775,239
- Issue date Sep 26, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tatsuya Arisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic electronic component, method of manufacturing th...
- Patent number 9,743,514
- Issue date Aug 22, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Hee Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode device of an electrosurgical instrument
- Patent number 9,622,815
- Issue date Apr 18, 2017
- ERBE ELEKTROMEDIZIN GMBH
- Ralf Kuehner
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electronic component and manufacturing method therefor
- Patent number 9,565,757
- Issue date Feb 7, 2017
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curved capacitive touch panel and manufacture method thereof
- Patent number 9,426,893
- Issue date Aug 23, 2016
- TPK Touch Solutions Inc.
- Jun-Yao Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with cavity
- Patent number 9,232,647
- Issue date Jan 5, 2016
- Schweizer Electronic AG
- Thomas Gottwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Active ester resin, thermosetting resin composition, cured product...
- Patent number 9,217,053
- Issue date Dec 22, 2015
- DIC Corporation
- Etsuko Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module
- Patent number 8,303,196
- Issue date Nov 6, 2012
- Kabushiki Kaisha Toshiba
- Toyokazu Aizawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
PCB droplet actuator fabrication
- Patent number 8,268,246
- Issue date Sep 18, 2012
- Advanced Liquid Logic Inc
- Vijay Srinivasan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Icon illumination for capacitive touch switch
- Patent number 8,258,987
- Issue date Sep 4, 2012
- Whirlpool Corporation
- Benedito G. Anorozo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photodetecting device including base with positioning portion
- Patent number 8,110,802
- Issue date Feb 7, 2012
- Hamamatsu Photonics K.K.
- Hiroya Kobayashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Substrate process for an embedded component
- Patent number 7,727,818
- Issue date Jun 1, 2010
- Advanced Semiconductor Engineering, Inc.
- Chueh-An Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electro-optical module comprising flexible connection cable and met...
- Patent number 7,389,012
- Issue date Jun 17, 2008
- International Business Machines Corporation
- Stefano S. Oggioni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electro-optical module comprising flexible connection cable and met...
- Patent number 7,382,946
- Issue date Jun 3, 2008
- International Business Machines Corporation
- Stefano S. Oggioni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal wafer carrier for wafer level die burn-in
- Patent number 7,362,113
- Issue date Apr 22, 2008
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Method for testing using a universal wafer carrier for wafer level...
- Patent number 7,288,953
- Issue date Oct 30, 2007
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Ultra-Thin Sandwich Component
- Publication number 20240314928
- Publication date Sep 19, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE
- Publication number 20240306298
- Publication date Sep 12, 2024
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A NUMBER OF ELECTRICAL NODES, ELECTRICAL N...
- Publication number 20230309242
- Publication date Sep 28, 2023
- TactoTek Oy
- Tomi SIMULA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20220386454
- Publication date Dec 1, 2022
- HITACHI ASTEMO, LTD.
- Kazuo Maruyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20220322534
- Publication date Oct 6, 2022
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Shin Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220071010
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dielectric Layer for Component Carrier With Varying Material Proper...
- Publication number 20210315093
- Publication date Oct 7, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Kristl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...
- Publication number 20210257207
- Publication date Aug 19, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT MODULE MANUFACTURING METHOD AND ELECTRONIC CIRCU...
- Publication number 20200068750
- Publication date Feb 27, 2020
- Murata Manufacturing Co., Ltd.
- Hirokazu YAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...
- Publication number 20190181000
- Publication date Jun 13, 2019
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID RAFT
- Publication number 20190045637
- Publication date Feb 7, 2019
- Rolls-Royce plc
- Matthew HOCKING
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
FLEXIBLE HYBRID SUBSTRATE FOR DISPLAY AND METHOD FOR MANUFACTURING...
- Publication number 20170171968
- Publication date Jun 15, 2017
- Corning Precision Materials Co., Ltd.
- Jin Nyoung Heo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL-CLAD LAM...
- Publication number 20170099731
- Publication date Apr 6, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- TATSUYA ARISAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
FABRICATION OF A FLEXIBLE METAL-CLAD LAMINATE
- Publication number 20160302311
- Publication date Oct 13, 2016
- POMIRAN METALIZATION RESEARCH CO., LTD.
- Chung-Yi Chen
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Printed Circuit Board Arrangement and Electronic Device Having a Pr...
- Publication number 20160295693
- Publication date Oct 6, 2016
- BIOTRONIK SE & CO. KG
- Frederik Sporon-Fiedler
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MULTI-LAYER SUBSTRATE, ELECTRONIC DEVICE USING MULTI-LAYER SUBSTRAT...
- Publication number 20160105958
- Publication date Apr 14, 2016
- Denso Corporation
- Toshihiro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD BACKUP PLATE AND THE PREPARATION METHOD THEREOF
- Publication number 20160057849
- Publication date Feb 25, 2016
- SHENZHEN NEWCCESS INDUSTRIAL CO.,LTD
- XIAOYANG LUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
- Publication number 20150156868
- Publication date Jun 4, 2015
- MURATA MANUFACTURING CO., LTD.
- Masato NOMIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE
- Publication number 20150147535
- Publication date May 28, 2015
- Lee-Sheng Yen
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150129293
- Publication date May 14, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Suk Hyeon CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTIVE ESTER RESIN, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT...
- Publication number 20150118499
- Publication date Apr 30, 2015
- DIC CORPORATION
- Etsuko Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATELESS DEVICE AND THE METHOD TO FABRICATE THEREOF
- Publication number 20150029678
- Publication date Jan 29, 2015
- CYNTEC CO., LTD.
- BAU-RU LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD...
- Publication number 20140345664
- Publication date Nov 27, 2014
- Curamik ElectronicsGmbH
- Andreas Meyer
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
PCB Droplet Actuator Fabrication
- Publication number 20130264010
- Publication date Oct 10, 2013
- Advanced Liquid Logic Inc
- Vijay Srinivasan
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ILLUMINATION METHOD AND SYSTEM FOR A BAG
- Publication number 20130250603
- Publication date Sep 26, 2013
- JOANEL INC.
- Aldjia BEGRICHE
- G02 - OPTICS
Information Patent Application
Electrode Device of an Electrosurgical Instrument
- Publication number 20130226176
- Publication date Aug 29, 2013
- Ralf Kuehner
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PRINTED CIRCUIT BOARD WITH CAVITY
- Publication number 20130199829
- Publication date Aug 8, 2013
- Schweizer Electronic AG
- Thomas Gottwald
- G01 - MEASURING TESTING
Information Patent Application
LIGHT EMITTING MODULE AND BACKLIGHT UNIT USING THE SAME
- Publication number 20120155115
- Publication date Jun 21, 2012
- SAMSUNG LED CO., LTD.
- Kyu Ho JANG
- G02 - OPTICS
Information Patent Application
FLEXIBLE CIRCUITS AND METHODS FOR MAKING THE SAME
- Publication number 20120086113
- Publication date Apr 12, 2012
- Brian Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME
- Publication number 20120086135
- Publication date Apr 12, 2012
- Jeffrey C. Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

onto an inorganic, non-metallic substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing a number of electrical nodes, electrical n...

Circuit board structure and manufacturing method thereof

Dielectric layer for component carrier with varying material proper...

Method for manufacturing a number of electrical nodes, electrical n...

Electronic control device

Substrate structures and methods of manufacture

Semiconductor structures and methods

Supporting substrate, supporting substrate-attached laminate and me...

Methods for producing laminate and substrate for mounting a semicon...

Rigid raft

Multi-layered substrate manufacturing method

Multi-layer cooling element

Flexible hybrid substrate for display and method for manufacturing...

Printed circuit board arrangement and electronic device having a pr...

Resin composition for printed wiring board, prepreg, metal-clad lam...

Multilayer ceramic electronic component, method of manufacturing th...

Electrode device of an electrosurgical instrument

Electronic component and manufacturing method therefor

Curved capacitive touch panel and manufacture method thereof

Printed circuit board with cavity

Active ester resin, thermosetting resin composition, cured product...

Camera module

PCB droplet actuator fabrication

Icon illumination for capacitive touch switch

Photodetecting device including base with positioning portion

Substrate process for an embedded component

Electro-optical module comprising flexible connection cable and met...

Electro-optical module comprising flexible connection cable and met...

Universal wafer carrier for wafer level die burn-in

Method for testing using a universal wafer carrier for wafer level...

Patents Applicationslast 30 patents

Ultra-Thin Sandwich Component

MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE

METHOD FOR MANUFACTURING A NUMBER OF ELECTRICAL NODES, ELECTRICAL N...

ELECTRONIC CONTROL DEVICE

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

Dielectric Layer for Component Carrier With Varying Material Proper...

SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...

ELECTRONIC CIRCUIT MODULE MANUFACTURING METHOD AND ELECTRONIC CIRCU...

SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...

RIGID RAFT

FLEXIBLE HYBRID SUBSTRATE FOR DISPLAY AND METHOD FOR MANUFACTURING...

RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL-CLAD LAM...

FABRICATION OF A FLEXIBLE METAL-CLAD LAMINATE

Printed Circuit Board Arrangement and Electronic Device Having a Pr...

MULTI-LAYER SUBSTRATE, ELECTRONIC DEVICE USING MULTI-LAYER SUBSTRAT...

PRINTED CIRCUIT BOARD BACKUP PLATE AND THE PREPARATION METHOD THEREOF

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

LAMINATE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ACTIVE ESTER RESIN, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT...

SUBSTRATELESS DEVICE AND THE METHOD TO FABRICATE THEREOF

THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD...

PCB Droplet Actuator Fabrication

ILLUMINATION METHOD AND SYSTEM FOR A BAG

Electrode Device of an Electrosurgical Instrument

PRINTED CIRCUIT BOARD WITH CAVITY

LIGHT EMITTING MODULE AND BACKLIGHT UNIT USING THE SAME

FLEXIBLE CIRCUITS AND METHODS FOR MAKING THE SAME

INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME