Membership
Tour
Register
Log in
Organic substrates
Follow
Industry
CPC
H01L23/145
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L23/00
Details of semiconductor or other solid state devices
Current Industry
H01L23/145
Organic substrates
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Flexible microwave power transistor and preparation method thereof
Patent number
11,973,136
Issue date
Apr 30, 2024
University of Electronic Science and Technology of China
Yuehang Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,961,742
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package device and method of manufacturing the same
Patent number
11,956,897
Issue date
Apr 9, 2024
Advanced Semiconductor Engineering, Inc.
Ming-Ze Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,923,280
Issue date
Mar 5, 2024
Amkor Technology Singapore Holding Pte Ltd.
Won Bae Bang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,908,837
Issue date
Feb 20, 2024
Kioxia Corporation
Soichiro Ibaraki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,908,759
Issue date
Feb 20, 2024
Mediatek Inc.
Nan-Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of package structure
Patent number
11,895,780
Issue date
Feb 6, 2024
Unimicron Technology Corp.
Kai-Ming Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for supporting ultra-thin semicondu...
Patent number
11,881,398
Issue date
Jan 23, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Gordon M. Grivna
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminate, metal foil-clad laminate, laminate having patterned metal...
Patent number
11,877,396
Issue date
Jan 16, 2024
Mitsubishi Gas Chemical Company, Inc.
Syunsuke Hirano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Supports for thinned semiconductor substrates and related methods
Patent number
11,854,995
Issue date
Dec 26, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure on a PCB and semiconductor module i...
Patent number
11,848,255
Issue date
Dec 19, 2023
Samsung Electronics Co., Ltd.
YoungJoon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna-in-package with frequency-selective surface structure
Patent number
11,848,481
Issue date
Dec 19, 2023
Mediatek Inc.
Shih-Chia Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with layer structures, antenna layer and elec...
Patent number
11,837,552
Issue date
Dec 5, 2023
Mediatek Inc.
Wen-Sung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management in integrated circuit packages
Patent number
11,830,787
Issue date
Nov 28, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate with reduced interconnect stress
Patent number
11,824,013
Issue date
Nov 21, 2023
Intel Corporation
Lauren A. Link
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Warp mitigation using pattern-matched metal layers in organic subst...
Patent number
11,817,359
Issue date
Nov 14, 2023
International Business Machines Corporation
Hien Dang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Package substrate and method for manufacturing the same
Patent number
11,791,281
Issue date
Oct 17, 2023
Advanced Semiconductor Engineering, Inc.
You-Lung Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper alloys for interconnectors and methods for making the same
Patent number
11,776,893
Issue date
Oct 3, 2023
The Trustees of the University of Pennsylvania
Daniel S. Gianola
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Organic interposer including a dual-layer inductor structure and me...
Patent number
11,769,741
Issue date
Sep 26, 2023
Taiwan Semiconductor Manufacturing Company Limited
Wei-Han Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate and method for manufacturing the same
Patent number
11,749,619
Issue date
Sep 5, 2023
Advanced Semiconductor Engineering, Inc.
You-Lung Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple die package using an embedded bridge connecting dies
Patent number
11,742,293
Issue date
Aug 29, 2023
Intel Corporation
Yidnekachew S. Mekonnen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory modules and memory packages including graphene layers for th...
Patent number
11,721,742
Issue date
Aug 8, 2023
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer frame and method of manufacturing the same
Patent number
11,699,691
Issue date
Jul 11, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
Patent number
11,676,938
Issue date
Jun 13, 2023
JCET Semiconductor (Shaoxing) Co., Ltd.
Ming-Che Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
Patent number
11,670,575
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sheet material, metal mesh, wiring substrate, display device and ma...
Patent number
11,668,008
Issue date
Jun 6, 2023
TDK Corporation
Makoto Orikasa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Integrated circuit module with a structurally balanced package usin...
Patent number
11,664,302
Issue date
May 30, 2023
International Business Machines Corporation
Mark K. Hoffmeyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inductor structure, semiconductor package and fabrication method th...
Patent number
11,658,134
Issue date
May 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via-trace structures
Patent number
11,652,036
Issue date
May 16, 2023
Santa Clara
Jeremy Ecton
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Fibrillated liquid crystal polymer powder, method of producing fibr...
Patent number
11,646,127
Issue date
May 9, 2023
Murata Manufacturing Co., Ltd.
Hiroyuki Ohata
B32 - LAYERED PRODUCTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240128179
Publication date
Apr 18, 2024
Unimicron Technology Corp.
Jyun-Hong CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS
Publication number
20240128181
Publication date
Apr 18, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IN-MOLD ELECTRONICS DEVICE
Publication number
20240112969
Publication date
Apr 4, 2024
Industrial Technology Research Institute
Yu-Ming Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE
Publication number
20240112965
Publication date
Apr 4, 2024
International Business Machines Corporation
Chinami Marushima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER
Publication number
20240113006
Publication date
Apr 4, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDISTRIBUTION LAYERS, AND RELATED METHODS AND DEVICES
Publication number
20240105574
Publication date
Mar 28, 2024
Micron Technology, Inc.
M. Ataul Karim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS
Publication number
20240079343
Publication date
Mar 7, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING
Publication number
20240071937
Publication date
Feb 29, 2024
Microsoft Technology Licensing, LLC
Rahul AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING
Publication number
20240071778
Publication date
Feb 29, 2024
Microsoft Technology Licensing, LLC
Rahul AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Packages and Methods of Forming the Same
Publication number
20240038646
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chi-Yang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
Publication number
20240038649
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ting-Ting KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STRESS BUFFERS AND METHODS OF FORMI...
Publication number
20240006340
Publication date
Jan 4, 2024
Taiwan Semiconductor Manufacturing Company Limited
Po-Chen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
Publication number
20240006285
Publication date
Jan 4, 2024
The Intel Corporation
Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-ON-WAFER-ON-BOARD STRUCTURE USING SPACER DIE AND METHODS OF FO...
Publication number
20230420429
Publication date
Dec 28, 2023
Taiwan Semiconductor Manufacturing Company Limited
Sheng-Kai Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POLYESTER RESIN
Publication number
20230391949
Publication date
Dec 7, 2023
AJINOMOTO CO., INC.
Ichiro OGURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mixed Dielectric Materials for Improving Signal Integrity of Integr...
Publication number
20230395444
Publication date
Dec 7, 2023
Avago Technologies International Sales Pte. Limited
Mayank Mayukh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MALEIMIDE RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM,...
Publication number
20230392001
Publication date
Dec 7, 2023
Naoyoshi SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MALEIMIDE RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED...
Publication number
20230391940
Publication date
Dec 7, 2023
Naoyoshi SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR F...
Publication number
20230386988
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company Limited
Li-Ling Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REINFORCED SUBSTRATES TO MITIGATE UNDERFLOW STRESS AND PACKAGE WARP...
Publication number
20230378042
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company Limited
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
Publication number
20230369255
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company Limited
Wei-Han CHIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
Publication number
20230369284
Publication date
Nov 16, 2023
Pac Tech - Packaging Technologies GmbH
RICARDO GEELHAAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE DIE PACKAGE USING AN EMBEDDED BRIDGE CONNECTING DIES
Publication number
20230352412
Publication date
Nov 2, 2023
Intel Corporation
Yidnekachew S. MEKONNEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CORE SUBSTRATE AND INTERPOSER
Publication number
20230343685
Publication date
Oct 26, 2023
NGK Insulators, Ltd.
Yoshitsugu WAKAZONO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE ELECTRONIC DEVICE
Publication number
20230343660
Publication date
Oct 26, 2023
Japan Display Inc.
Takumi SANO
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION
Publication number
20230317582
Publication date
Oct 5, 2023
Intel Corporation
Carlton Hanna
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS BRIDGE FOR CONNECTING DIES
Publication number
20230317618
Publication date
Oct 5, 2023
Intel Corporation
Carlton Hanna
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC STRUCTURE INCLUDING CONDUCTIVE POLYMER IN TRENCHES...
Publication number
20230298971
Publication date
Sep 21, 2023
Intel Corporation
Shayan Kaviani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION SUBSTRATE AND METHOD OF MANUFACTURING SUCH A SUBSTRATE
Publication number
20230290712
Publication date
Sep 14, 2023
STMicroelectronics (Grenoble 2) SAS
Fanny LAPORTE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
Publication number
20230290761
Publication date
Sep 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun Yi WU
H01 - BASIC ELECTRIC ELEMENTS