Oscillators in combination with lead-frames

Industry

CPC
H01L23/49596

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49596Oscillators in combination with lead-frames

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and measurement device
- Patent number 11,854,952
- Issue date Dec 26, 2023
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an oscillator and an associated integra...
- Patent number 11,309,234
- Issue date Apr 19, 2022
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic radiation control for isolated power transfer product
- Patent number 10,826,334
- Issue date Nov 3, 2020
- Silicon Laboratories Inc.
- Krishna Pentakota
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Oscillator, electronic apparatus, and vehicle
- Patent number 10,742,169
- Issue date Aug 11, 2020
- Seiko Epson Corporation
- Hisahiro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibrator device, oscillator, electronic device, and vehicle
- Patent number 10,734,969
- Issue date Aug 4, 2020
- Seiko Epson Corporation
- Hisahiro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oven-controlled crystal oscillator
- Patent number 10,666,194
- Issue date May 26, 2020
- Nihon Dempa Kogyo Co., Ltd.
- Junichi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device
- Patent number 10,622,944
- Issue date Apr 14, 2020
- Lapis Semiconductor Co., Ltd.
- Kengo Takemasa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and measurement device
- Patent number 10,615,108
- Issue date Apr 7, 2020
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor chip
- Patent number 10,497,618
- Issue date Dec 3, 2019
- Lapis Semiconductor Co., Ltd.
- Fujiyuki Minesaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead frame
- Patent number 10,262,929
- Issue date Apr 16, 2019
- Lapis Semiconductor Co., Ltd.
- Yuuki Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device
- Patent number 10,243,515
- Issue date Mar 26, 2019
- Lapis Semiconductor Co., Ltd.
- Kengo Takemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device
- Patent number 9,787,250
- Issue date Oct 10, 2017
- Lapis Semiconductor Co., Ltd.
- Kengo Takemasa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stacked electronic packages
- Patent number 9,640,517
- Issue date May 2, 2017
- Carsem (M) Sdn. Bhd.
- Thong Kai Choh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device having an oscillator
- Patent number 9,257,377
- Issue date Feb 9, 2016
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device
- Patent number 9,230,890
- Issue date Jan 5, 2016
- Lapis Semiconductor Co., Ltd.
- Kengo Takemasa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Oscillator
- Patent number 9,077,346
- Issue date Jul 7, 2015
- Nihon Dempa Kogyo Co., Ltd.
- Fumio Asamura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and measurement device having an oscillator
- Patent number 8,921,987
- Issue date Dec 30, 2014
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for placing quartz SAW devices together with c...
- Patent number 8,395,247
- Issue date Mar 12, 2013
- Integrated Device Technology, Inc.
- Tacettin Isik
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Fine-pitch routing in a lead frame based system-in-package (SIP) de...
- Patent number 7,825,526
- Issue date Nov 2, 2010
- NXP B.V.
- Peter Adrianus Jacobus Dirks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PLL oscillator package and production method thereof
- Patent number 6,081,164
- Issue date Jun 27, 2000
- Seiko Epson Corporation
- Mikio Shigemori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of encapsulating a crystal oscillator
- Patent number 5,577,319
- Issue date Nov 26, 1996
- Motorola, Inc.
- Thomas A. Knecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a quartz oscillator temperature sensor
- Patent number 5,325,574
- Issue date Jul 5, 1994
- Seiko Epson Corporation
- Michiaki Takagi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Piezoelectric oscillator formed in resin package containing, IC chi...
- Patent number 5,327,104
- Issue date Jul 5, 1994
- Seiko Epson Corporation
- Masayuki Kikushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating surface mountable clock oscillator module
- Patent number 5,267,379
- Issue date Dec 7, 1993
- AVX Corporation
- Hoklay Pak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a pressure seal type piezoelectric oscillator
- Patent number 5,265,316
- Issue date Nov 30, 1993
- Seiko Epson Corporation
- Tatsuo Ikeda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface mountable clock oscillator module
- Patent number 5,229,640
- Issue date Jul 20, 1993
- AVX Corporation
- Hoklay Pak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for piezo-oscillator
- Patent number 4,916,413
- Issue date Apr 10, 1990
- Matsushima Kogyo Kabushiki Kaisha
- Iwao Nakayama
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE
- Publication number 20240105565
- Publication date Mar 28, 2024
- LAPIS SEMICONDUCTOR CO., LTD.
- Toshihisa SONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INERTIAL MEASUREMENT UNIT
- Publication number 20230125187
- Publication date Apr 27, 2023
- SEIKO EPSON CORPORATION
- Shinji Nishio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE
- Publication number 20220223505
- Publication date Jul 14, 2022
- LAPIS SEMICONDUCTOR CO., LTD.
- Toshihisa SONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE
- Publication number 20200235046
- Publication date Jul 23, 2020
- LAPIS SEMICONDUCTOR CO., LTD.
- Toshihisa SONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC RADIATION CONTROL FOR ISOLATED POWER TRANSFER PRODUCT
- Publication number 20190305608
- Publication date Oct 3, 2019
- Silicon Laboratories Inc.
- Krishna Pentakota
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE
- Publication number 20190190449
- Publication date Jun 20, 2019
- LAPIS SEMICONDUCTOR CO., LTD.
- Kengo TAKEMASA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
OSCILLATOR, ELECTRONIC APPARATUS, AND VEHICLE
- Publication number 20190165732
- Publication date May 30, 2019
- SEIKO EPSON CORPORATION
- Hisahiro ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVEN-CONTROLLED CRYSTAL OSCILLATOR
- Publication number 20180013386
- Publication date Jan 11, 2018
- NIHON DEMPA KOGYO CO., LTD.
- Junichi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE
- Publication number 20180006604
- Publication date Jan 4, 2018
- LAPIS SEMICONDUCTOR CO., LTD.
- Kengo TAKEMASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20170162478
- Publication date Jun 8, 2017
- LAPIS SEMICONDUCTOR CO., LTD.
- YUUKI KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE
- Publication number 20160155690
- Publication date Jun 2, 2016
- LAPIS SEMICONDUCTOR CO., LTD.
- Toshihisa SONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE
- Publication number 20160118938
- Publication date Apr 28, 2016
- LAPIS SEMICONDUCTOR CO., LTD.
- Kengo TAKEMASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OSCILLATOR
- Publication number 20150084706
- Publication date Mar 26, 2015
- NIHON DEMPA KOGYO CO., LTD.
- Fumio Asamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE HAVING AN OSCILLATOR
- Publication number 20150076673
- Publication date Mar 19, 2015
- LAPIS SEMICONDUCTOR CO., LTD.
- Toshihisa SONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE
- Publication number 20130285224
- Publication date Oct 31, 2013
- LAPIS SEMICONDUCTOR CO., LTD.
- Kengo TAKEMASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE
- Publication number 20130285225
- Publication date Oct 31, 2013
- LAPIS SEMICONDUCTOR CO., LTD.
- Toshihisa SONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine-pitch routing in a lead frame based system-in-package (SIP) de...
- Publication number 20100006992
- Publication date Jan 14, 2010
- NXP B.V.
- Peter Adrianus Jacobus Dirks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame with attached components
- Publication number 20060273432
- Publication date Dec 7, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Bernhard Lange
- H01 - BASIC ELECTRIC ELEMENTS

Oscillators in combination with lead-frames

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and measurement device

Semiconductor device having an oscillator and an associated integra...

Electromagnetic radiation control for isolated power transfer product

Oscillator, electronic apparatus, and vehicle

Vibrator device, oscillator, electronic device, and vehicle

Oven-controlled crystal oscillator

Semiconductor device and measurement device

Semiconductor device and measurement device

Semiconductor device and semiconductor chip

Semiconductor device with lead frame

Semiconductor device and measurement device

Semiconductor device and measurement device

Stacked electronic packages

Semiconductor device and measurement device having an oscillator

Semiconductor device and measurement device

Oscillator

Semiconductor device and measurement device having an oscillator

Method and apparatus for placing quartz SAW devices together with c...

Fine-pitch routing in a lead frame based system-in-package (SIP) de...

PLL oscillator package and production method thereof

Method of encapsulating a crystal oscillator

Method of forming a quartz oscillator temperature sensor

Piezoelectric oscillator formed in resin package containing, IC chi...

Method of fabricating surface mountable clock oscillator module

Method of manufacturing a pressure seal type piezoelectric oscillator

Surface mountable clock oscillator module

Package for piezo-oscillator

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE

INERTIAL MEASUREMENT UNIT

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE

ELECTROMAGNETIC RADIATION CONTROL FOR ISOLATED POWER TRANSFER PRODUCT

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE

OSCILLATOR, ELECTRONIC APPARATUS, AND VEHICLE

OVEN-CONTROLLED CRYSTAL OSCILLATOR

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE

OSCILLATOR

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE HAVING AN OSCILLATOR

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE

Fine-pitch routing in a lead frame based system-in-package (SIP) de...

Lead frame with attached components