Osmium [Os]

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CPC
H01L2924/01076

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01076Osmium [Os]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,876,053
- Issue date Jan 16, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,824,008
- Issue date Nov 21, 2023
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective surface layer on under bump metallurgy for solder joining
- Patent number 11,682,640
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four D device process and structure
- Patent number 11,458,717
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 11,201,129
- Issue date Dec 14, 2021
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 10,923,429
- Issue date Feb 16, 2021
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 10,763,216
- Issue date Sep 1, 2020
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 10,510,669
- Issue date Dec 17, 2019
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 10,249,588
- Issue date Apr 2, 2019
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four D device process and structure
- Patent number 10,011,098
- Issue date Jul 3, 2018
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 10,014,273
- Issue date Jul 3, 2018
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 9,875,969
- Issue date Jan 23, 2018
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor package
- Patent number 9,842,792
- Issue date Dec 12, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Danny Retuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip, face-up and face-down centerbond memory wirebond assemblies
- Patent number 9,806,017
- Issue date Oct 31, 2017
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a three dimensional integrated circuit by t...
- Patent number 9,711,407
- Issue date Jul 18, 2017
- Monolithic 3D Inc.
- Zvi Or-Bach
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of forming semiconductor elements using micro-abrasive part...
- Patent number 9,640,437
- Issue date May 2, 2017
- Tessera, Inc.
- Vage Oganesian
- B24 - GRINDING POLISHING
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 9,543,261
- Issue date Jan 10, 2017
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-grid-array package, electronic system and method of manufacture
- Patent number 9,502,345
- Issue date Nov 22, 2016
- Samsung Electronics Co., Ltd.
- Sunpil Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 9,455,234
- Issue date Sep 27, 2016
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of dual-molding die formed on oppos...
- Patent number 9,443,829
- Issue date Sep 13, 2016
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer systems having an interposer including a flexible material
- Patent number 9,412,677
- Issue date Aug 9, 2016
- Micron Technology, Inc.
- Teck Kheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of joining a chip on a substrate
- Patent number 9,393,633
- Issue date Jul 19, 2016
- GLOBALFOUNDRIES Inc.
- Pascal P Blais
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip and manufacturing method thereof
- Patent number 9,362,206
- Issue date Jun 7, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a metallurgical intercon...
- Patent number 9,312,150
- Issue date Apr 12, 2016
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor package
- Patent number 9,281,218
- Issue date Mar 8, 2016
- United Test & Assembly Center Ltd.
- Danny Retuta
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
4D Device, process and structure
- Patent number 9,259,902
- Issue date Feb 16, 2016
- International Business Machines Corporation
- Roy R. Yu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Stretchable electronic device
- Patent number 9,247,648
- Issue date Jan 26, 2016
- IMEC
- Jan Vanfleteren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid storage and dispensing system including dynamic fluid monitor...
- Patent number 9,170,246
- Issue date Oct 27, 2015
- Entegris, Inc.
- James Dietz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING
- Publication number 20220165691
- Publication date May 26, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20220059484
- Publication date Feb 24, 2022
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20200075493
- Publication date Mar 5, 2020
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20190198472
- Publication date Jun 27, 2019
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20180145031
- Publication date May 24, 2018
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
- Publication number 20180025967
- Publication date Jan 25, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED WIRE FOR BONDING APPLICATIONS
- Publication number 20150360316
- Publication date Dec 17, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen MILKE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20140313676
- Publication date Oct 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20140299984
- Publication date Oct 9, 2014
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20140197228
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Thomas E. LOMBARDI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGING
- Publication number 20140087521
- Publication date Mar 27, 2014
- CAMBRIDGE SILICON RADIO LTD.
- Andrew Holland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING SYSTEM INCLUDING TH...
- Publication number 20140073127
- Publication date Mar 13, 2014
- Elpida Memory, Inc.
- Satoshi Itaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Dual-Molding Die Formed on Oppos...
- Publication number 20140048932
- Publication date Feb 20, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID STORAGE AND DISPENSING SYSTEM INCLUDING DYNAMIC FLUID MONITOR...
- Publication number 20140041440
- Publication date Feb 13, 2014
- Advanced Technology Materials, Inc.
- James DIETZ
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT APPARATUS, SYSTEMS, AND METHODS
- Publication number 20130307164
- Publication date Nov 21, 2013
- Micron Technology, Inc.
- Paul A. Silvestri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINATION OF A SUBSTRATE AND A WAFER
- Publication number 20130309840
- Publication date Nov 21, 2013
- Erich Thallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINATION OF A SUBSTRATE AND A WAFER
- Publication number 20130295746
- Publication date Nov 7, 2013
- Erich Thallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING A SEMICONDUCTOR DEVICE...
- Publication number 20130285249
- Publication date Oct 31, 2013
- Boon Huat Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...
- Publication number 20130193467
- Publication date Aug 1, 2013
- Nichia Corporation.
- Takeshi KUSUSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, CONDUCTIVE COMPOSITION, METAL FILLING APPARATUS,...
- Publication number 20130186943
- Publication date Jul 25, 2013
- Shigenobu SEKINE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING SYSTEM INCLUDING TH...
- Publication number 20130175682
- Publication date Jul 11, 2013
- Elpida Memory, Inc.
- Satoshi Itaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130119561
- Publication date May 16, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Koji DAIRIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20130119557
- Publication date May 16, 2013
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20130119544
- Publication date May 16, 2013
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Metallurgical Intercon...
- Publication number 20130113093
- Publication date May 9, 2013
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
- Publication number 20130056868
- Publication date Mar 7, 2013
- AGERE SYSTEMS LLC
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Bonded Structure
- Publication number 20130037603
- Publication date Feb 14, 2013
- AGENCY FOR SCIENCE ,TECHNOLOGY AND RESEARCH
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void-Free Implantable Hermetically Sealed Structures
- Publication number 20130018434
- Publication date Jan 17, 2013
- Mark J. Zdeblick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Osmium [Os]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-chip package and method of providing die-to-die interconnects...

Multi-chip package and method of providing die-to-die interconnects...

Multi-chip package and method of providing die-to-die interconnects...

Protective surface layer on under bump metallurgy for solder joining

Four D device process and structure

Designs and methods for conductive bumps

Multi-chip package and method of providing die-to-die interconnects...

Multi-chip package and method of providing die-to-die interconnects...

Multi-chip package and method of providing die-to-die interconnects...

Designs and methods for conductive bumps

Four D device process and structure

Fixture to constrain laminate and method of assembly

Multi-chip package and method of providing die-to-die interconnects...

Method of producing a semiconductor package

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Epoxy resin composition for encapsulating semiconductor device and...

Method of manufacturing a three dimensional integrated circuit by t...

Methods of forming semiconductor elements using micro-abrasive part...

Designs and methods for conductive bumps

Ball-grid-array package, electronic system and method of manufacture

Fixture to constrain laminate and method of assembly

Semiconductor device and method of dual-molding die formed on oppos...

Computer systems having an interposer including a flexible material

Method of joining a chip on a substrate

Chip and manufacturing method thereof

Semiconductor device and method of forming a metallurgical intercon...

Method of producing a semiconductor package

4D Device, process and structure

Stretchable electronic device

Fluid storage and dispensing system including dynamic fluid monitor...

Patents Applicationslast 30 patents

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

COATED WIRE FOR BONDING APPLICATIONS

ELECTRONIC COMPONENT PACKAGE

CHIP AND MANUFACTURING METHOD THEREOF

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

WAFER LEVEL CHIP SCALE PACKAGING

SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING SYSTEM INCLUDING TH...

Semiconductor Device and Method of Dual-Molding Die Formed on Oppos...

FLUID STORAGE AND DISPENSING SYSTEM INCLUDING DYNAMIC FLUID MONITOR...

INTEGRATED CIRCUIT APPARATUS, SYSTEMS, AND METHODS

COMBINATION OF A SUBSTRATE AND A WAFER

COMBINATION OF A SUBSTRATE AND A WAFER

SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING A SEMICONDUCTOR DEVICE...

SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...

ELECTRONIC DEVICE, CONDUCTIVE COMPOSITION, METAL FILLING APPARATUS,...

SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING SYSTEM INCLUDING TH...

SEMICONDUCTOR DEVICE

SYSTEMS COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME

Semiconductor Device and Method of Forming a Metallurgical Intercon...

ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER

Method of Forming a Bonded Structure

Void-Free Implantable Hermetically Sealed Structures