outside the semiconductor or solid-state body

Industry

CPC
H01L2224/49433

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/49433outside the semiconductor or solid-state body

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 12,142,348
- Issue date Nov 12, 2024
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with detection conductor
- Patent number 11,955,440
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 11,901,340
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 11,783,879
- Issue date Oct 10, 2023
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 11,600,602
- Issue date Mar 7, 2023
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 11,211,105
- Issue date Dec 28, 2021
- RAMBUS INC.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 11,075,186
- Issue date Jul 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 10,950,582
- Issue date Mar 16, 2021
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip packaging including a heat sink topped cavity
- Patent number 10,818,572
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carbide power module
- Patent number 10,784,235
- Issue date Sep 22, 2020
- Cree Fayetteville, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 10,770,124
- Issue date Sep 8, 2020
- RAMBUS INC.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor apparatus
- Patent number 10,727,152
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module based on multi-layer circuit board
- Patent number 10,636,732
- Issue date Apr 28, 2020
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip packaging
- Patent number 10,600,715
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor power module
- Patent number 10,600,764
- Issue date Mar 24, 2020
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) die attached between an offset lead frame d...
- Patent number 10,553,524
- Issue date Feb 4, 2020
- Microchip Technology Incorporated
- Man Kit Lam
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor module
- Patent number 10,276,552
- Issue date Apr 30, 2019
- ABB Schweiz AG
- Samuel Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 10,192,598
- Issue date Jan 29, 2019
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device, package, and vehicle
- Patent number 10,186,479
- Issue date Jan 22, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidenori Katsumura
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 10,170,402
- Issue date Jan 1, 2019
- Renesas Electronics Corporation
- Yosuke Imazeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current, low switching loss SiC power module
- Patent number 10,141,302
- Issue date Nov 27, 2018
- Cree, Inc.
- Mrinal K. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor chip package assembly and electronic device having sensor ch...
- Patent number 10,121,750
- Issue date Nov 6, 2018
- Shenzhen Goodix Technology Co., Ltd.
- Yuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a lead frame by additive process
- Patent number 10,074,596
- Issue date Sep 11, 2018
- STMicroelectronics S.R.L.
- Fabio Marchisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure, semiconductor package and method...
- Patent number 10,002,843
- Issue date Jun 19, 2018
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive micromachined ultrasonic transducer probe using wire-bon...
- Patent number 9,955,948
- Issue date May 1, 2018
- Samsung Electronics Co., Ltd.
- Sungchan Kang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Power semiconductor module
- Patent number 9,941,255
- Issue date Apr 10, 2018
- Mitsubishi Electric Corporation
- Junichi Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having leadframe features preventing...
- Patent number 9,892,936
- Issue date Feb 13, 2018
- Texas Instruments Incorporated
- Wei Fen Sueann Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package fabrication
- Patent number 9,859,197
- Issue date Jan 2, 2018
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor package
- Patent number 9,842,792
- Issue date Dec 12, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Danny Retuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including independent film layer for embedding...
- Patent number 9,773,766
- Issue date Sep 26, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258248
- Publication date Aug 1, 2024
- ROHM CO., LTD.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20240234380
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20240136335
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20240096387
- Publication date Mar 21, 2024
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20230187416
- Publication date Jun 15, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20220172760
- Publication date Jun 2, 2022
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210193592
- Publication date Jun 24, 2021
- Rohm Co., Ltd.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20210175213
- Publication date Jun 10, 2021
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20210050043
- Publication date Feb 18, 2021
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20200185358
- Publication date Jun 11, 2020
- ROHM CO., LTD.
- Kenji HAYASHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20200168524
- Publication date May 28, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20200168525
- Publication date May 28, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20190295990
- Publication date Sep 26, 2019
- Rohm Co., Ltd.
- Kenji HAYASHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20190206458
- Publication date Jul 4, 2019
- RAMBUS INC.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20180247923
- Publication date Aug 30, 2018
- ABB Schweiz AG
- Samuel Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20180047436
- Publication date Feb 15, 2018
- RAMBUS INC.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20170243816
- Publication date Aug 24, 2017
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING A PLURALITY...
- Publication number 20160372446
- Publication date Dec 22, 2016
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD...
- Publication number 20160284659
- Publication date Sep 29, 2016
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Tien-Szu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20160260691
- Publication date Sep 8, 2016
- Toyota Jidosha Kabushiki Kaisha
- Masaki AOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160148895
- Publication date May 26, 2016
- RENESAS ELECTRONICS CORPORATION
- Akira OHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD CONFIGURATIONS FOR AN ELECTRONIC PACKAGE ASSEMBLY
- Publication number 20150035160
- Publication date Feb 5, 2015
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20140264812
- Publication date Sep 18, 2014
- MEDIATEK INC.
- Sheng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CURRENT, LOW SWITCHING LOSS SiC POWER MODULE
- Publication number 20140246681
- Publication date Sep 4, 2014
- Cree, Inc.
- Mrinal K. Das
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
INFORMATION ENCODING USING WIREBONDS
- Publication number 20140239469
- Publication date Aug 28, 2014
- International Business Machines Corporation
- William E. Bentley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE DESIGN METHOD, SEMICONDU...
- Publication number 20140210096
- Publication date Jul 31, 2014
- RENESAS ELECTRONICS CORPORATION
- Masafumi TOMODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING
- Publication number 20140191380
- Publication date Jul 10, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A PLURALITY OF UPPER SEMICONDUCTOR...
- Publication number 20140167260
- Publication date Jun 19, 2014
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER RF AMPLIFIERS
- Publication number 20140103447
- Publication date Apr 17, 2014
- NXP B.V.
- Gerard Jean-Louis Bouisse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH OFFSET DIE STACKING AND METHOD OF MAKING SAME
- Publication number 20130309810
- Publication date Nov 21, 2013
- MOSAID TECHNOLOGIES INCORPORATED
- Peter GILLINGHAM
- H01 - BASIC ELECTRIC ELEMENTS

outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory device comprising programmable command-and-address and/or da...

Semiconductor device with detection conductor

Semiconductor power module

Memory device comprising programmable command-and-address and/or da...

Semiconductor power module

Memory device comprising programmable command-and-address and/or da...

Semiconductor package

Semiconductor power module

Integrated circuit chip packaging including a heat sink topped cavity

Silicon carbide power module

Memory device comprising programmable command-and-address and/or da...

Semiconductor apparatus

Power module based on multi-layer circuit board

Integrated circuit chip packaging

Semiconductor power module

Integrated circuit (IC) die attached between an offset lead frame d...

Semiconductor module

Memory device comprising programmable command-and-address and/or da...

Semiconductor device, package, and vehicle

Semiconductor device

High current, low switching loss SiC power module

Sensor chip package assembly and electronic device having sensor ch...

Method of fabricating a lead frame by additive process

Semiconductor substrate structure, semiconductor package and method...

Capacitive micromachined ultrasonic transducer probe using wire-bon...

Power semiconductor module

Packaged semiconductor device having leadframe features preventing...

Integrated circuit package fabrication

Method of producing a semiconductor package

Semiconductor device including independent film layer for embedding...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR POWER MODULE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

SEMICONDUCTOR POWER MODULE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR POWER MODULE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

SEMICONDUCTOR POWER MODULE

INTEGRATED CIRCUIT CHIP PACKAGING

INTEGRATED CIRCUIT CHIP PACKAGING

SEMICONDUCTOR POWER MODULE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

SEMICONDUCTOR MODULE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

INTEGRATED CIRCUIT CHIP PACKAGING

LOW PROFILE INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING A PLURALITY...

SEMICONDUCTOR SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD...

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PAD CONFIGURATIONS FOR AN ELECTRONIC PACKAGE ASSEMBLY

SEMICONDUCTOR PACKAGE ASSEMBLY

HIGH CURRENT, LOW SWITCHING LOSS SiC POWER MODULE

INFORMATION ENCODING USING WIREBONDS

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE DESIGN METHOD, SEMICONDU...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING

SEMICONDUCTOR PACKAGES INCLUDING A PLURALITY OF UPPER SEMICONDUCTOR...

POWER RF AMPLIFIERS

MULTI-CHIP PACKAGE WITH OFFSET DIE STACKING AND METHOD OF MAKING SAME