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B81B2207/09

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

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B81B2207/09Packages

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,227,410
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po Chen Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing package structure
- Patent number 12,215,018
- Issue date Feb 4, 2025
- Winbond Electronics Corp.
- Jin-Neng Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical microphone with reduced overall size
- Patent number 12,215,022
- Issue date Feb 4, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Samer Dagher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package for device
- Patent number 12,209,012
- Issue date Jan 28, 2025
- Teknologian tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cover member for electronic device, package, electronic device, and...
- Patent number 12,187,602
- Issue date Jan 7, 2025
- Kyocera Corporation
- Sho Yamasaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Undercut-free patterned aluminum nitride structure and methods for...
- Patent number 12,134,824
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked MEMS device and co...
- Patent number 12,129,168
- Issue date Oct 29, 2024
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor devices with gas-permeable cover and associated production m...
- Patent number 12,122,667
- Issue date Oct 22, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics H-frame device
- Patent number 12,122,666
- Issue date Oct 22, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for supporting MEMS and/or ASIC components
- Patent number 12,116,270
- Issue date Oct 15, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Ismael Brunner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor and package assembly thereof
- Patent number 12,091,312
- Issue date Sep 17, 2024
- Robert Bosch GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon MEMS gyroscopes with upper and lower sense plates
- Patent number 12,092,460
- Issue date Sep 17, 2024
- The Charles Stark Draper Laboratory, Inc.
- Eugene H. Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level packaging of MEMS
- Patent number 12,091,311
- Issue date Sep 17, 2024
- Texas Instruments Incorporated
- Stuart M. Jacobsen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric MEMS microphone
- Patent number 12,058,939
- Issue date Aug 6, 2024
- The Regents of the University of Michigan
- Karl Grosh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and MEMS accelerometer on a single substrate
- Patent number 12,054,383
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing monolithic integration of piezoelectric microm...
- Patent number 12,037,239
- Issue date Jul 16, 2024
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a sensor device and moulding support structure
- Patent number 12,024,418
- Issue date Jul 2, 2024
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and method for manufacturing sensing device
- Patent number 12,024,420
- Issue date Jul 2, 2024
- Mitsumi Electric Co., Ltd.
- Etsuji Hayakawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS resonator system
- Patent number 11,987,495
- Issue date May 21, 2024
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with shock and vibration protection
- Patent number 11,975,961
- Issue date May 7, 2024
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Youmin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,970,388
- Issue date Apr 30, 2024
- Winbond Electronics Corp.
- Jin-Neng Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual-layer micro-ribbon MEMS light modulator
- Patent number 11,958,738
- Issue date Apr 16, 2024
- Silicon Light Machines Corporation
- Olav Solgaard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging of microfluidic devices and microfluidic integrated syste...
- Patent number 11,926,522
- Issue date Mar 12, 2024
- Corporation for National Research Initiatives
- Michael A. Huff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
IR emitter with glass lid
- Patent number 11,926,521
- Issue date Mar 12, 2024
- Infineon Technologies AG
- Stephan Pindl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ovenized MEMS
- Patent number 11,909,354
- Issue date Feb 20, 2024
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device having an ASIC chip integrated into a...
- Patent number 11,906,383
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical device with contact pad
- Patent number 11,897,756
- Issue date Feb 13, 2024
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical contacting and method for producing an electrical contac...
- Patent number 11,897,758
- Issue date Feb 13, 2024
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,897,759
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po Chen Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
3D Heterogeneously Integrated Power Electronic Building Blocks
- Publication number 20250033954
- Publication date Jan 30, 2025
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Vivek Mehrotra
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Dual-Layer Micro-ribbon MEMS Light Modulator
- Publication number 20250026633
- Publication date Jan 23, 2025
- SILICON LIGHT MACHINES CORPORATION
- Olav Solgaard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20250019229
- Publication date Jan 16, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE
- Publication number 20250011164
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Klaus ELIAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE
- Publication number 20250011160
- Publication date Jan 9, 2025
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250011165
- Publication date Jan 9, 2025
- Vanguard International Semiconductor Corporation
- JIA JIE XIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Ovenized MEMS
- Publication number 20250007455
- Publication date Jan 2, 2025
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...
- Publication number 20250002330
- Publication date Jan 2, 2025
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME
- Publication number 20250002333
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Eric SAUGIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT WITH EXTERNAL CONTACTING
- Publication number 20240425362
- Publication date Dec 26, 2024
- ROBERT BOSCH GmbH
- Benjamin Biasi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE
- Publication number 20240425363
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Bernhard Rieder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGING WITH ACTUATOR STATOR PROVIDING ELECTRICAL CONNECTION...
- Publication number 20240417241
- Publication date Dec 19, 2024
- Connaught Electronics Ltd.
- Gerard Conway
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SWITCH UTILIZING CONDUCTIVE BARRIER LAYER
- Publication number 20240409397
- Publication date Dec 12, 2024
- Menlo Microsystems, Inc.
- Christopher F. Keimel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE
- Publication number 20240400374
- Publication date Dec 5, 2024
- Rohm Co., Ltd.
- Toma FUJITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS COMPONENT WITH UPSIDE-DOWN CHIP
- Publication number 20240391759
- Publication date Nov 28, 2024
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20240368746
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME, AND SENSOR
- Publication number 20240359972
- Publication date Oct 31, 2024
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Lihui WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
- Publication number 20240343558
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...
- Publication number 20240327203
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ELEMENT, OPTICAL SCANNING DEVICE, AND DISTANCE MEASURING DEVICE
- Publication number 20240317577
- Publication date Sep 26, 2024
- Mitsubishi Electric Corporation
- Yusuke SHIRAYANAGI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240317580
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Fumiya KUROKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240317578
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Fumiya KUROKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PMUT ARRAY WITH RESONANCE FREQUENCY TUNABLE DUE TO ADJUSTABLE EMBED...
- Publication number 20240272298
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Domenico GIUSTI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME
- Publication number 20240270567
- Publication date Aug 15, 2024
- Murata Manufacturing Co., Ltd.
- Hiroshi MATSUBARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS
- Publication number 20240272004
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE
- Publication number 20240217808
- Publication date Jul 4, 2024
- WINBOND ELECTRONICS CORP.
- Jin-Neng WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE
- Publication number 20240199411
- Publication date Jun 20, 2024
- Qorvo US, Inc.
- Robertus Petrus Van Kampen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20240174511
- Publication date May 30, 2024
- Murata Manufacturing Co., Ltd.
- Masakazu FUKUMITSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for forming the same

Method for manufacturing package structure

Microelectromechanical microphone with reduced overall size

Wafer level package for device

Cover member for electronic device, package, electronic device, and...

Undercut-free patterned aluminum nitride structure and methods for...

Microelectronics package with vertically stacked MEMS device and co...

Sensor devices with gas-permeable cover and associated production m...

Microelectronics H-frame device

Device for supporting MEMS and/or ASIC components

Sensor and package assembly thereof

Silicon MEMS gyroscopes with upper and lower sense plates

Wafer level packaging of MEMS

Piezoelectric MEMS microphone

MEMS microphone and MEMS accelerometer on a single substrate

Method for producing monolithic integration of piezoelectric microm...

Method of manufacturing a sensor device and moulding support structure

Sensing device and method for manufacturing sensing device

MEMS resonator system

MEMS package with shock and vibration protection

Semiconductor package and method for manufacturing the same

Package structure and method for manufacturing the same

Dual-layer micro-ribbon MEMS light modulator

Packaging of microfluidic devices and microfluidic integrated syste...

IR emitter with glass lid

Ovenized MEMS

Micromechanical sensor device having an ASIC chip integrated into a...

Micromechanical device with contact pad

Electrical contacting and method for producing an electrical contac...

Semiconductor device and method for forming the same

Patents Applicationslast 30 patents

3D Heterogeneously Integrated Power Electronic Building Blocks

Dual-Layer Micro-ribbon MEMS Light Modulator

STACKED-DIE MEMS RESONATOR

SENSOR DEVICE

METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE

MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF

Ovenized MEMS

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...

WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME

MICROMECHANICAL COMPONENT WITH EXTERNAL CONTACTING

COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE

MEMS PACKAGING WITH ACTUATOR STATOR PROVIDING ELECTRICAL CONNECTION...

MEMS SWITCH UTILIZING CONDUCTIVE BARRIER LAYER

MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE

MEMS COMPONENT WITH UPSIDE-DOWN CHIP

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME, AND SENSOR

DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE

MEMS DIES EMBEDDED IN GLASS CORES

METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...

MEMS ELEMENT, OPTICAL SCANNING DEVICE, AND DISTANCE MEASURING DEVICE

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

PMUT ARRAY WITH RESONANCE FREQUENCY TUNABLE DUE TO ADJUSTABLE EMBED...

ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME

PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING PACKAGE STRUCTURE

VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE

MEMS DEVICE