Palladium [Pd] as principal constituent

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H01L2224/13164

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13164Palladium [Pd] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
- Patent number 12,272,663
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 12,207,569
- Issue date Jan 21, 2025
- Rigetti & Co, LLC
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing
- Patent number 12,165,980
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable quantum processor design
- Patent number 12,086,689
- Issue date Sep 10, 2024
- Google LLC
- Julian Shaw Kelly
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,051,639
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 12,027,483
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing package structure
- Patent number 12,021,037
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,955,465
- Issue date Apr 9, 2024
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature hierarchy solder bonding
- Patent number 11,887,956
- Issue date Jan 30, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,887,952
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package assembly including the same
- Patent number 11,855,025
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure
- Patent number 11,817,437
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having distinguishable electrodes
- Patent number 11,817,439
- Issue date Nov 14, 2023
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,790,206
- Issue date Oct 17, 2023
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 11,770,982
- Issue date Sep 26, 2023
- Rigetti & Co, LLC
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,728,297
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 11,676,924
- Issue date Jun 13, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace design for enlarge bump-to-trace distance
- Patent number 11,658,143
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,640,958
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding element and method for manufacturing the same
- Patent number 11,621,241
- Issue date Apr 4, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Han-Wen Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TREATMENT PROCESS FOR WAFER BONDING PROCESSES
- Publication number 20250239564
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250233083
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
- Publication number 20250210608
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250183205
- Publication date Jun 5, 2025
- WIN SEMICONDUCTORS CORP.
- Shao-Yu TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250167092
- Publication date May 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Li LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...
- Publication number 20250125309
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Hsiang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
- Publication number 20250118690
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP SCALE PACKAGE TRANSIENT VOLTAGE SUPPRESSION DIODE...
- Publication number 20250113508
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Kronenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250087543
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...
- Publication number 20250087612
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- JUNHYUN AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250087549
- Publication date Mar 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Yu Jin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250054885
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250044510
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20250046722
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250046753
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250006680
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429116
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seoung Joon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421054
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seongho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGING
- Publication number 20240411084
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240395744
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES ANDMETHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240332272
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Yun MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321823
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321797
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yoshiaki SHIMOOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240312976
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20240297086
- Publication date Sep 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY FOR METAL UNDERCUT REDUCTION
- Publication number 20240290735
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- RAFAEL JOSE GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20240234340
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Palladium [Pd] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device and method for UBM/RDL routing

Semiconductor packages and methods of forming same

Metal-bump sidewall protection

Microwave integrated quantum circuits with cap wafers and their met...

Package structure

Semiconductor package and methods of manufacturing

Integrated fan-out package and the methods of manufacturing

Scalable quantum processor design

Package structure and manufacturing method thereof

Packaged semiconductor device with electroplated pillars

Method for manufacturing package structure

Packaged die and RDL with bonding structures therebetween

Solderless interconnection structure and method of forming same

Reducing loss in stacked quantum devices

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Multilayer substrate

Temperature hierarchy solder bonding

Semiconductor device encapsulated by molding material attached to r...

Semiconductor device and package assembly including the same

Connector structure and method of forming same

Method of forming package structure

Semiconductor device having distinguishable electrodes

High-speed RFID tag assembly using impulse heating

Microwave integrated quantum circuits with cap wafers and their met...

Semiconductor devices, semiconductor packages, and methods of manuf...

Semiconductor chip with reduced pitch conductive pillars

Bump-on-trace design for enlarge bump-to-trace distance

Packaged die and RDL with bonding structures therebetween

Interconnect structure with redundant electrical connectors and ass...

Bonding element and method for manufacturing the same

Patents Applicationslast 30 patents

TREATMENT PROCESS FOR WAFER BONDING PROCESSES

Semiconductor Packages and Methods of Forming Same

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...

SEMICONDUCTOR STRUCTURE

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...

DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...

WAFER-LEVEL CHIP SCALE PACKAGE TRANSIENT VOLTAGE SUPPRESSION DIODE...

INTEGRATED CIRCUIT PACKAGES AND METHODS

CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

METHOD FOR FORMING PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING

INTEGRATED CIRCUIT PACKAGE AND METHOD

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE

OPTICAL PACKAGING

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC DEVICES ANDMETHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE

ALLOY FOR METAL UNDERCUT REDUCTION

INTEGRATED CIRCUIT PACKAGES AND METHODS