Palladium [Pd] as principal constituent

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H01L2224/81464

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81464Palladium [Pd] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,790,206
- Issue date Oct 17, 2023
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,288,564
- Issue date Mar 29, 2022
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 11,276,630
- Issue date Mar 15, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,195,726
- Issue date Dec 7, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic...
- Patent number 11,179,748
- Issue date Nov 23, 2021
- Seiko Epson Corporation
- Koji Ohashi
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,930,695
- Issue date Feb 23, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated bump structures in package structure
- Patent number 10,784,223
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages with sintered interconnects formed out of pads
- Patent number 10,777,496
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 10,651,116
- Issue date May 12, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,651,052
- Issue date May 12, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,553,451
- Issue date Feb 4, 2020
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 10,546,836
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,446,455
- Issue date Oct 15, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wiring board and semiconductor device
- Patent number 10,438,883
- Issue date Oct 8, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a carrier-less silicon interposer using photo...
- Patent number 10,403,510
- Issue date Sep 3, 2019
- Invensas Corporation
- Andrew Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,388,582
- Issue date Aug 20, 2019
- Amkor Technology, Inc.
- Young Rae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,297,515
- Issue date May 21, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having conductive bumps of varying heights
- Patent number 10,163,844
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,008,393
- Issue date Jun 26, 2018
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,941,180
- Issue date Apr 10, 2018
- Amkor Technology, Inc.
- Young Rae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,917,025
- Issue date Mar 13, 2018
- Ibiden Co., Ltd.
- Kota Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,793,200
- Issue date Oct 17, 2017
- Ibiden Co., Ltd.
- Kota Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated bump structures in package structure
- Patent number 9,786,621
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS
- Publication number 20230299032
- Publication date Sep 21, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210225921
- Publication date Jul 22, 2021
- Sony Semiconductor Solutions Corporation
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180308712
- Publication date Oct 25, 2018
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180226312
- Publication date Aug 9, 2018
- Amkor Technology, Inc.
- Young Rae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20180082982
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elongated Bump Structures in Package Structure
- Publication number 20180047690
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20150024555
- Publication date Jan 22, 2015
- FUJITSU LIMITED
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTERPOSER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...
- Publication number 20140306355
- Publication date Oct 16, 2014
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACT...
- Publication number 20140284791
- Publication date Sep 25, 2014
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140225242
- Publication date Aug 14, 2014
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Metal Bump Die Assembly
- Publication number 20140193952
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELONGATED BUMP STRUCTURES IN PACKAGE STRUCTURE
- Publication number 20140191391
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH ON TRACE FOR A THERMAL COMPRESSION FLIP CHIP (TCFC)
- Publication number 20140138831
- Publication date May 22, 2014
- QUALCOMM Incorporated
- Houssam W. Jomaa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Delamination Between an Underfill and a Buffer Layer in a...
- Publication number 20140087522
- Publication date Mar 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20140077357
- Publication date Mar 20, 2014
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Devices and Methods of Packaging Semiconductor Dies
- Publication number 20130341786
- Publication date Dec 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MA...
- Publication number 20130320566
- Publication date Dec 5, 2013
- Soohan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20130087912
- Publication date Apr 11, 2013
- Fujitsu Limited
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP-ON-TRACE (BOT) STRUCTURES
- Publication number 20130001778
- Publication date Jan 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuh Chern SHIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Device
- Publication number 20120273935
- Publication date Nov 1, 2012
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED-STRESS BUMP-ON-TRACE (BOT) STRUCTURES
- Publication number 20120273934
- Publication date Nov 1, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuh Chern SHIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20120193812
- Publication date Aug 2, 2012
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20120161330
- Publication date Jun 28, 2012
- Intel Corporation
- Mark S. Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Delamination Between an Underfill and a Buffer layer in a...
- Publication number 20120018875
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSVs with Different Sizes in Interposers for Bonding Dies
- Publication number 20110254160
- Publication date Oct 20, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Palladium [Pd] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fingerprint sensor and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

High-speed RFID tag assembly using impulse heating

Fingerprint sensor and manufacturing method thereof

High-speed RFID tag assembly using impulse heating

Planar integrated circuit package interconnects

Wafer level integration including design/co-design, structure proce...

Semiconductor device and manufacturing method thereof

Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic...

Semiconductor device and method of manufacturing the same

Elongated bump structures in package structure

Chip packages with sintered interconnects formed out of pads

Planar integrated circuit package interconnects

Semiconductor package structure and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Wafer level integration including design/co-design, structure proce...

Fingerprint sensor and manufacturing method thereof

Wiring board and semiconductor device

Method of fabricating a carrier-less silicon interposer using photo...

Semiconductor device and manufacturing method thereof

Fingerprint sensor and manufacturing method thereof

Semiconductor device having conductive bumps of varying heights

Semiconductor device and manufacturing method thereof

Bonding structure for semiconductor package and method of manufactu...

Semiconductor device and manufacturing method thereof

Printed wiring board and method for manufacturing printed wiring board

Magnetic intermetallic compound interconnect

Printed wiring board

Elongated bump structures in package structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

Elongated Bump Structures in Package Structure

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

CHIP INTERPOSER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...

CORELESS INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACT...

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Methods for Metal Bump Die Assembly

ELONGATED BUMP STRUCTURES IN PACKAGE STRUCTURE

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

SURFACE FINISH ON TRACE FOR A THERMAL COMPRESSION FLIP CHIP (TCFC)

Reducing Delamination Between an Underfill and a Buffer Layer in a...

CIRCUIT SUBSTRATE AND PROCESS FOR FABRICATING THE SAME

Package on Package Devices and Methods of Packaging Semiconductor Dies

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MA...

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

BUMP-ON-TRACE (BOT) STRUCTURES

Semiconductor Device and Method of Making a Semiconductor Device

REDUCED-STRESS BUMP-ON-TRACE (BOT) STRUCTURES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...

INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...

Reducing Delamination Between an Underfill and a Buffer layer in a...

TSVs with Different Sizes in Interposers for Bonding Dies