Palladium (Pd) as principal constituent

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    • Kuei-Hao TSENG
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    AI WIRING MATERIAL

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    • NIPPON MICROMETAL CORPORATION
    • Yuto KURIHARA
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    • Publication date Apr 6, 2023
    • NIPPON MICROMETAL CORPORATION
    • Tomohiro UNO
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    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

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    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
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    • Publication date Aug 25, 2022
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
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    • NIPPON MICROMETAL CORPORATION
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    • KIOXIA Corporation
    • Kazuya MARUYAMA
    • H01 - BASIC ELECTRIC ELEMENTS
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    CHIP ARRANGEMENTS

    • Publication number 20210167034
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    • INFINEON TECHNOLOGIES AG
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    • Skyworks Solutions, Inc.
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    • NIPPON STREET CHEMICAL & MATERTIAL CORPORATION CO., LTD.
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    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
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    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
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    • Publication date Sep 24, 2020
    • Toshiba Memory Corporation
    • Satoshi TSUKIYAMA
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    BONDING WIRE FOR SEMICONDUCTOR DEVICE

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    • Publication date Oct 24, 2019
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya OYAMADA
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    • HERAEUS MATERIALS SINGAPORE PTE., LTD.
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    • WIRE TECHNOLOGY CO., LTD.
    • Chien-Hsun CHUANG
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    • RENESAS ELECTRONICS CORPORATION
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    • NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
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    • Publication number 20170323865
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    • INFINEON TECHNOLOGIES AG
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    • NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
    • Tomohiro UNO
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    • MICRO SYSTEMS ENGINEERING GMBH
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    • United Test & Assembly Center Ltd.
    • Rui HUANG
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    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
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    • TSUNG JEN LIAO
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    • JIN-HO LEE
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    WIRE BONDING APPARATUS AND METHOD

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    • Jia Lin Yap
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