Palladium [Pd] as principal constituent

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CPC
H01L2224/05164

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05164Palladium [Pd] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with thermal release layer and method for fabr...
- Patent number 11,948,857
- Issue date Apr 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jar-Ming Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage system, memory chip unit, and wafer
- Patent number 11,923,325
- Issue date Mar 5, 2024
- Kioxia Corporation
- Yasuhito Yoshimizu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for fabricating semiconductor device with graphene layers
- Patent number 11,908,816
- Issue date Feb 20, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device, device, and manufacturing method
- Patent number 11,854,957
- Issue date Dec 26, 2023
- Seiko Epson Corporation
- Naoki Il
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing pre-polymerized protective layer...
- Patent number 11,776,922
- Issue date Oct 3, 2023
- SanDisk Technologies LLC
- Hajime Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,728,297
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump structure and manufacturing method thereof and driving s...
- Patent number 11,715,715
- Issue date Aug 1, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 11,710,691
- Issue date Jul 25, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for semiconductor packaging
- Patent number 11,705,414
- Issue date Jul 18, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,664,306
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 11,616,008
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing pre-polymerized protective layer...
- Patent number 11,538,777
- Issue date Dec 27, 2022
- SanDisk Technologies LLC
- Hajime Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,527,502
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball application for singular die
- Patent number 11,508,680
- Issue date Nov 22, 2022
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thermal release layer and method for fabr...
- Patent number 11,495,516
- Issue date Nov 8, 2022
- NANYA TECHNOLOGY CORPORATION
- Jar-Ming Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,476,291
- Issue date Oct 18, 2022
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,456,265
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with graphene layers and method for fabricatin...
- Patent number 11,424,198
- Issue date Aug 23, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic component and method
- Patent number 11,380,612
- Issue date Jul 5, 2022
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
- Patent number 11,315,845
- Issue date Apr 26, 2022
- Monolith Semiconductor, Inc.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 11,296,012
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 11,270,967
- Issue date Mar 8, 2022
- Sumitomo Electric Device Innovations, Inc.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads of semiconductor devices
- Patent number 11,244,915
- Issue date Feb 8, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...
- Publication number 20240128215
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR
- Publication number 20240014152
- Publication date Jan 11, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP OF CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING
- Publication number 20230395537
- Publication date Dec 7, 2023
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230386980
- Publication date Nov 30, 2023
- STMicroelectronics S.r.l.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369278
- Publication date Nov 16, 2023
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230352376
- Publication date Nov 2, 2023
- Rohm Co., Ltd.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20230299027
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230275051
- Publication date Aug 31, 2023
- RENESAS ELECTRONICS CORPORATION
- Teruhiro KUWAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230253306
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230246011
- Publication date Aug 3, 2023
- SAMSUNG DISPLAY CO., LTD.
- Nak Cho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE
- Publication number 20230246006
- Publication date Aug 3, 2023
- TDK Corporation
- Ryohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20230215825
- Publication date Jul 6, 2023
- Rohm Co., Ltd.
- Reona TAKEOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230111921
- Publication date Apr 13, 2023
- RENESAS ELECTRONICS CORPORATION
- Takashi TONEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230103655
- Publication date Apr 6, 2023
- Rohm Co., Ltd.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Application for Singular Die
- Publication number 20230055518
- Publication date Feb 23, 2023
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230005979
- Publication date Jan 5, 2023
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220399292
- Publication date Dec 15, 2022
- Rohm Co., Ltd.
- Shoji TAKEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220285323
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...
- Publication number 20220238471
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE SYSTEM, MEMORY CHIP UNIT, AND WAFER
- Publication number 20220223552
- Publication date Jul 14, 2022
- KIOXIA Corporation
- Yasuhito YOSHIMIZU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL RELEASE LAYER AND METHOD FOR FABR...
- Publication number 20220189847
- Publication date Jun 16, 2022
- NANYA TECHNOLOGY CORPORATION
- JAR-MING HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL RELEASE LAYER AND METHOD FOR FABR...
- Publication number 20220165639
- Publication date May 26, 2022
- NANYA TECHNOLOGY CORPORATION
- JAR-MING HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Application for Singular Die
- Publication number 20220157749
- Publication date May 19, 2022
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20220115296
- Publication date Apr 14, 2022
- Advanced Interconnect Systems Limited
- Haruki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS
- Publication number 20220093541
- Publication date Mar 24, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20220093417
- Publication date Mar 24, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS AND METHOD FOR FABRICATIN...
- Publication number 20220068848
- Publication date Mar 3, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...
- Publication number 20220005773
- Publication date Jan 6, 2022
- SANDISK TECHNOLOGIES LLC
- Hajime ARAI
- H01 - BASIC ELECTRIC ELEMENTS

Palladium [Pd] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with thermal release layer and method for fabr...

Storage system, memory chip unit, and wafer

Method for fabricating semiconductor device with graphene layers

Contact pad for semiconductor device

Semiconductor components having conductive vias with aligned back s...

Integrated circuit device, device, and manufacturing method

Semiconductor structure containing pre-polymerized protective layer...

Semiconductor devices, semiconductor packages, and methods of manuf...

Metal bump structure and manufacturing method thereof and driving s...

Semiconductor device and method of forming micro interconnect struc...

Structure and method for semiconductor packaging

Power semiconductor chip, method for producing a power semiconducto...

Semiconductor structure and manufacturing method thereof

Through-substrate via structure and method of manufacture

Semiconductor structure containing pre-polymerized protective layer...

Contact pad for semiconductor device

Solder ball application for singular die

Semiconductor device with thermal release layer and method for fabr...

Semiconductor device and method of manufacturing thereof

Multi-die package with bridge layer

Semiconductor device and method of manufacturing the same

Power amplifier systems with control interface and bias circuit

Method of forming an aluminum oxide layer, metal surface with alumi...

Semiconductor device with graphene layers and method for fabricatin...

Semiconductor device, electronic component and method

Semiconductor packages and methods of forming same

Semiconductor devices comprising getter layers and methods of makin...

Barrier structures between external electrical connectors

Method for manufacturing semiconductor device and semiconductor device

Bond pads of semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...

SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR

BUMP OF CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

JOINT STRUCTURE

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT

Solder Ball Application for Singular Die

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Semiconductor Packages and Methods of Forming Same

METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...

STORAGE SYSTEM, MEMORY CHIP UNIT, AND WAFER

SEMICONDUCTOR DEVICE WITH THERMAL RELEASE LAYER AND METHOD FOR FABR...

SEMICONDUCTOR DEVICE WITH THERMAL RELEASE LAYER AND METHOD FOR FABR...

Solder Ball Application for Singular Die

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

Advanced Device Assembly Structures And Methods

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS AND METHOD FOR FABRICATIN...

SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...