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  • CPC
  • H01L2224/41175
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/41175Parallel arrangements
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device
    • Patent number 11,990,455
    • Issue date May 21, 2024
    • Rohm Co., Ltd.
    • Hiroyuki Sakairi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic module
    • Patent number 11,309,274
    • Issue date Apr 19, 2022
    • Shindengen Electric Manufacturing Co., Ltd.
    • Yoshihiro Kamiyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-clip structure for die bonding
    • Patent number 11,189,592
    • Issue date Nov 30, 2021
    • Infineon Technologies Austria AG
    • Balehithlu Manjappaiah Upendra
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 10,770,400
    • Issue date Sep 8, 2020
    • Kabushiki Kaisha Toyota Jidoshokki
    • Naoki Kato
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 9,397,030
    • Issue date Jul 19, 2016
    • NSK Ltd.
    • Takashi Sunaga
    • B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
  • Information Patent Grant

    Semiconductor module and semiconductor device
    • Patent number 9,362,219
    • Issue date Jun 7, 2016
    • Mitsubishi Electric Corporation
    • Tatsuya Kawase
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for manufacturing a semiconductor component and structure th...
    • Patent number 8,582,317
    • Issue date Nov 12, 2013
    • Semiconductor Components Industries, LLC
    • Yenting Wen
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents