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H01L2924/20

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/20Parameters

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package structure with conductive patterns in a redistribution layer
- Patent number 12,100,682
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,051,674
- Issue date Jul 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating hybrid bonded structure
- Patent number 12,021,103
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer and integrated circuit including redistributio...
- Patent number 12,021,046
- Issue date Jun 25, 2024
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,967,583
- Issue date Apr 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,961,827
- Issue date Apr 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,929,343
- Issue date Mar 12, 2024
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 11,923,330
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,916,045
- Issue date Feb 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,894,337
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Launch structures for radio frequency integrated device packages
- Patent number 11,894,322
- Issue date Feb 6, 2024
- Analog Devices, Inc.
- Bruce E. Wilcox
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATED WCSP WITH THERMAL PAD FOR EFFICIENT HEAT DISSIPATION
- Publication number 20250046668
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Gail Edselle S. REYES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250046750
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Grain Structure Engineering for Metal Gapfill Materials
- Publication number 20250038137
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP
- Publication number 20250038143
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Chun-Chia Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL
- Publication number 20250022829
- Publication date Jan 16, 2025
- AJINOMOTO CO., INC.
- Ichiro OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES
- Publication number 20250006653
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...
- Publication number 20240413034
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDES
- Publication number 20240396198
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Ernst SELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371814
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240335901
- Publication date Oct 10, 2024
- Mitsubishi Electric Corporation
- Erubi SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD
- Publication number 20240332116
- Publication date Oct 3, 2024
- Intel Corporation
- Chun Keang Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240321832
- Publication date Sep 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312868
- Publication date Sep 19, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20240313026
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MA...
- Publication number 20240304575
- Publication date Sep 12, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- ZZU-CHI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20240297138
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20240282675
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE
- Publication number 20240249950
- Publication date Jul 25, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION AND FORMING METHOD THEREOF
- Publication number 20240234351
- Publication date Jul 11, 2024
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reliable semiconductor packages

Low cost package warpage solution

Semiconductor device

Process flow for fabrication of cap metal over top metal with sinte...

Solder reflow apparatus and method of manufacturing an electronic d...

Low pressure sintering powder

Package structure with conductive patterns in a redistribution layer

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Bump structure having a side recess and semiconductor structure inc...

3D integrations and methods of making thereof

3D semiconductor device and structure with metal layers

Impedance controlled electrical interconnection employing meta-mate...

Method for fabricating hybrid bonded structure

Redistribution layer and integrated circuit including redistributio...

Packages with electrical fuses

High density organic bridge device and method

Multiple plated via arrays of different wire heights on a same subs...

Package structure with a barrier layer

Power module semiconductor device and inverter equipment, and fabri...

Power module semiconductor device and inverter equipment, and fabri...

3D semiconductor device and structure with metal layers

3D semiconductor device and structure with metal layers

Low warpage curing methodology by inducing curvature

Bonding wire for semiconductor devices

Adhesive member, display device, and manufacturing method of displa...

3D semiconductor device and structure with metal layers

Semiconductor package with solder standoff

Contact pad for semiconductor device

Manufacturing method of power semiconductor device, power semicondu...

Launch structures for radio frequency integrated device packages

Patents Applicationslast 30 patents

ENCAPSULATED WCSP WITH THERMAL PAD FOR EFFICIENT HEAT DISSIPATION

SEMICONDUCTOR PACKAGE

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

Grain Structure Engineering for Metal Gapfill Materials

CHIP

UNDERFILL MATERIAL

FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES

LOW PRESSURE SINTERING POWDER

SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDES

PACKAGE STRUCTURE

Lead-Free Solder Ball

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGES WITH ELECTRICAL FUSES

SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MA...

PACKAGE STRUCTURE WITH A BARRIER LAYER

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE

ELECTRICAL CONNECTION AND FORMING METHOD THEREOF