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H01L2924/20

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,368,138
- Issue date Jul 22, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier module with transistor dies for multiple amplifier...
- Patent number 12,347,740
- Issue date Jul 1, 2025
- NXP USA, INC.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna substrate and electronic device including the same
- Patent number 12,341,252
- Issue date Jun 24, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Je Sang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,334,456
- Issue date Jun 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding pads and methods of forming the same
- Patent number 12,300,644
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 12,288,744
- Issue date Apr 29, 2025
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide profile control
- Patent number 12,288,758
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,278,216
- Issue date Apr 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 12,272,667
- Issue date Apr 8, 2025
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding method
- Patent number 12,266,623
- Issue date Apr 1, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Yunzhi Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,237,282
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package structure with conductive patterns in a redistribution layer
- Patent number 12,100,682
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,051,674
- Issue date Jul 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating hybrid bonded structure
- Patent number 12,021,103
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer and integrated circuit including redistributio...
- Patent number 12,021,046
- Issue date Jun 25, 2024
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE WITH BOND PAD
- Publication number 20250201738
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- JEFFREY SOLAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER MICROPARTICLE DISPERSION
- Publication number 20250183215
- Publication date Jun 5, 2025
- KAO CORPORATION
- Takaaki EYAMA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20250167180
- Publication date May 22, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING TH...
- Publication number 20250149484
- Publication date May 8, 2025
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR PRESSURE BONDING, SEMICONDUCTOR DEVICE, METHOD FOR...
- Publication number 20250149492
- Publication date May 8, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING...
- Publication number 20250140732
- Publication date May 1, 2025
- Resonac Corporation
- Tomoya MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20250140739
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Kashyap Mohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTORS PACKAGES
- Publication number 20250126909
- Publication date Apr 17, 2025
- UTAC Headquarters Pte. Ltd.
- Il Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Publication number 20250112191
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250107298
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PAD SURFACE LEVELING DEVICE
- Publication number 20250105033
- Publication date Mar 27, 2025
- Shine Optics Technology Company Limited
- KUNG-AN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding Method and Apparatus
- Publication number 20250096195
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Stefan Tophinke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUC...
- Publication number 20250096184
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250087546
- Publication date Mar 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd
- Joon Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES
- Publication number 20250079401
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070063
- Publication date Feb 27, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Hironao NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20250070091
- Publication date Feb 27, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TAB FOR POWER SEMICONDUCTOR MODULE
- Publication number 20250062270
- Publication date Feb 20, 2025
- LITTELFUSE, INC.
- Thomas Lachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Release Layer for IR Laser Lift-Off Process
- Publication number 20250054904
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Panupong JAIPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED WCSP WITH THERMAL PAD FOR EFFICIENT HEAT DISSIPATION
- Publication number 20250046668
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Gail Edselle S. REYES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250046750
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Grain Structure Engineering for Metal Gapfill Materials
- Publication number 20250038137
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP
- Publication number 20250038143
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Chun-Chia Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL
- Publication number 20250022829
- Publication date Jan 16, 2025
- AJINOMOTO CO., INC.
- Ichiro OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES
- Publication number 20250006653
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...
- Publication number 20240413034
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor device and structure with metal layers

Power amplifier module with transistor dies for multiple amplifier...

Antenna substrate and electronic device including the same

Electronic package and manufacturing method thereof

Power module semiconductor device and inverter equipment, and fabri...

Die bonding pads and methods of forming the same

Microelectronic assemblies having conductive structures with differ...

Polyimide profile control

3D semiconductor device and structure with metal layers

Adhesive member, display device, and manufacturing method of displa...

Substrate bonding method

Wire bond wires for interference shielding

Semiconductor device and method of forming the same

Integrated circuit package having wirebonded multi-die stack

Reliable semiconductor packages

Low cost package warpage solution

Semiconductor device

Process flow for fabrication of cap metal over top metal with sinte...

Solder reflow apparatus and method of manufacturing an electronic d...

Low pressure sintering powder

Package structure with conductive patterns in a redistribution layer

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Bump structure having a side recess and semiconductor structure inc...

3D integrations and methods of making thereof

3D semiconductor device and structure with metal layers

Impedance controlled electrical interconnection employing meta-mate...

Method for fabricating hybrid bonded structure

Redistribution layer and integrated circuit including redistributio...

Packages with electrical fuses

High density organic bridge device and method

Patents Applicationslast 30 patents

DIE WITH BOND PAD

COPPER MICROPARTICLE DISPERSION

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

SEMICONDUCTOR DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING TH...

COPPER PASTE FOR PRESSURE BONDING, SEMICONDUCTOR DEVICE, METHOD FOR...

UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING...

LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES

RELIABLE SEMICONDUCTORS PACKAGES

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

PACKAGE STRUCTURE

CHIP PAD SURFACE LEVELING DEVICE

Wire Bonding Method and Apparatus

LOW COST PACKAGE WARPAGE SOLUTION

CHIP BONDING FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUC...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES

SEMICONDUCTOR DEVICE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

SEMICONDUCTOR DEVICE

METAL TAB FOR POWER SEMICONDUCTOR MODULE

Release Layer for IR Laser Lift-Off Process

ENCAPSULATED WCSP WITH THERMAL PAD FOR EFFICIENT HEAT DISSIPATION

SEMICONDUCTOR PACKAGE

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

Grain Structure Engineering for Metal Gapfill Materials

CHIP

UNDERFILL MATERIAL

FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES

LOW PRESSURE SINTERING POWDER

SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...