Passive alignment, i.e. self alignment

Industry

CPC
H01L2224/82143

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82143Passive alignment, i.e. self alignment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device having plurality of light emitting elements between...
- Patent number 12,033,993
- Issue date Jul 9, 2024
- Samsung Display Co., Ltd.
- Yong Hoon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,830,885
- Issue date Nov 28, 2023
- Samsung Display Co., Ltd.
- Do Yeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with different electrodes and light emitting elements
- Patent number 11,552,063
- Issue date Jan 10, 2023
- Samsung Display Co., Ltd.
- Kyung Bae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 11,476,397
- Issue date Oct 18, 2022
- Samsung Display Co., Ltd.
- Eui Suk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic registration between circuit dies and interconnects
- Patent number 10,971,468
- Issue date Apr 6, 2021
- 3M Innovative Properties Company
- Ankit Mahajan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming complex electronic circuits by interconnecting g...
- Patent number 10,964,665
- Issue date Mar 30, 2021
- Nthdegree Technologies Worldwide, Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits using a printable solution def...
- Patent number 10,499,499
- Issue date Dec 3, 2019
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing complex electronic circuits using a patterned hydrophobic...
- Patent number 9,913,371
- Issue date Mar 6, 2018
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,418,979
- Issue date Aug 16, 2016
- Renssealer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,245,875
- Issue date Jan 26, 2016
- Rensselaer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting devices in substrate and device-mounting substra...
- Patent number 9,119,332
- Issue date Aug 25, 2015
- Sony Corporation
- Katsuhiro Tomoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip stack package and manufacturing method thereof
- Patent number 8,722,513
- Issue date May 13, 2014
- Korea Institute of Machinery & Materials
- Jae-Hak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a TSV for 3D packaging of semiconductor device
- Patent number 8,513,061
- Issue date Aug 20, 2013
- Korea Institute of Machinery & Materials
- Jae-Hak Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE DISPLAY DEVICE
- Publication number 20210143137
- Publication date May 13, 2021
- SAMSUNG DISPLAY CO., LTD.
- Kyung Bae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING COMPLEX ELECTRONIC CIRCUITS
- Publication number 20170125372
- Publication date May 4, 2017
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284795
- Publication date Sep 25, 2014
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACK PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20130256911
- Publication date Oct 3, 2013
- Korea Institute of Machinery and Materials
- Jae-Hak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV FOR 3D PACKAGING OF SEMICONDUCTOR DEVICE AND FABRICATION METHOD...
- Publication number 20120153496
- Publication date Jun 21, 2012
- KOREA INSTITUTE OF MACHINERY & MATERIALS
- Jae-Hak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...
- Publication number 20110266039
- Publication date Nov 3, 2011
- SONY CORPORATION
- Katsuhiro TOMODA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Passive alignment, i.e. self alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device having plurality of light emitting elements between...

Display device

Display device with different electrodes and light emitting elements

Display device and manufacturing method thereof

Automatic registration between circuit dies and interconnects

Method for forming complex electronic circuits by interconnecting g...

Printing complex electronic circuits using a printable solution def...

Printing complex electronic circuits using a patterned hydrophobic...

Light emitting diodes and a method of packaging the same

Light emitting diodes and a method of packaging the same

Method of mounting devices in substrate and device-mounting substra...

Semiconductor chip stack package and manufacturing method thereof

Method of fabricating a TSV for 3D packaging of semiconductor device

Patents Applicationslast 30 patents

DISPLAY DEVICE AND METHOD OF FABRICATING THE DISPLAY DEVICE

PRINTING COMPLEX ELECTRONIC CIRCUITS

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR CHIP STACK PACKAGE AND MANUFACTURING METHOD THEREOF

TSV FOR 3D PACKAGING OF SEMICONDUCTOR DEVICE AND FABRICATION METHOD...

METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...