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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/12Passive devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,368,138
- Issue date Jul 22, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, and tiled display device including the display device
- Patent number 12,368,135
- Issue date Jul 22, 2025
- Samsung Display Co., Ltd.
- Hyun Joon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
IPD modules with flexible connection scheme in packaging
- Patent number 12,368,141
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module for removing misassembled semiconductor light-emitting eleme...
- Patent number 12,368,130
- Issue date Jul 22, 2025
- LG Electronics Inc.
- Juchan Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 12,368,145
- Issue date Jul 22, 2025
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method of making a fan-out semiconductor assembly with an intermedi...
- Patent number 12,362,322
- Issue date Jul 15, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic device
- Patent number 12,362,300
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and methods
- Patent number 12,364,074
- Issue date Jul 15, 2025
- CreeLED, Inc.
- Christopher P. Hussell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,356,716
- Issue date Jul 8, 2025
- Samsung Display Co., Ltd.
- Jong Hwan Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,347,813
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 12,347,731
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 12,341,135
- Issue date Jun 24, 2025
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment-free micro-display architecture
- Patent number 12,336,357
- Issue date Jun 17, 2025
- Meta Platforms Technologies, LLC
- Wei Sin Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 12,334,474
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method of making the same
- Patent number 12,336,201
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jian-Shiou Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 12,327,807
- Issue date Jun 10, 2025
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curved light-emitting substrate
- Patent number 12,328,941
- Issue date Jun 10, 2025
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Zhenhai Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, wearable device, and temperature detection m...
- Patent number 12,322,740
- Issue date Jun 3, 2025
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,316,307
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,315,854
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 12,315,855
- Issue date May 27, 2025
- Japan Display Inc.
- Kenichi Takemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 12,308,361
- Issue date May 20, 2025
- Nichia Corporation
- Takeshi Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 12,308,305
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,308,357
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Jong Chan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,300,624
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly with hybrid bonding
- Patent number 12,300,655
- Issue date May 13, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor structure with a deep trench capacitor structures and...
- Publication number 20250240985
- Publication date Jul 24, 2025
- UNITED MICROELECTRONICS CORP.
- Yi-Fan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250239534
- Publication date Jul 24, 2025
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20250239555
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250239215
- Publication date Jul 24, 2025
- SAMSUNG DISPLAY CO., LTD.
- Hyun Joon KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20250240006
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, ELECTRONI...
- Publication number 20250233059
- Publication date Jul 17, 2025
- Kyocera Corporation
- Akihiko FUNAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250226271
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PHOTONICS CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226369
- Publication date Jul 10, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- SangHwa YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250228082
- Publication date Jul 10, 2025
- SAMSUNG DISPLAY CO., LTD.
- KYUNG HYUN CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Shape-Memory Metallization
- Publication number 20250226338
- Publication date Jul 10, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE WITH IMPROVED LIGHT QUALITY
- Publication number 20250226362
- Publication date Jul 10, 2025
- Lumileds LLC
- Cheng Wei HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20250218989
- Publication date Jul 3, 2025
- INTELPRO INC.
- Lung-Kun Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURE AND DISPLAY PANEL
- Publication number 20250219033
- Publication date Jul 3, 2025
- Industrial Technology Research Institute
- Jui-Wen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250218904
- Publication date Jul 3, 2025
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE TRANSFORMER POWER MODULES
- Publication number 20250218908
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Giacomo CALABRESE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20250221011
- Publication date Jul 3, 2025
- BYD COMPANY LIMITED
- Rui HU
- B60 - VEHICLES IN GENERAL
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
- Publication number 20250218906
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR EMBEDDED COMPONENT IN CORE
- Publication number 20250218952
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin DUONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING OF ELECTRONIC PACKAGES
- Publication number 20250210444
- Publication date Jun 26, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Jorge MARTINEZ ARAIZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ELEMENT AND OPTICAL CONCENTRATION MEASURING APPARATUS
- Publication number 20250204125
- Publication date Jun 19, 2025
- ASAHI KASEI MICRODEVICES CORPORATION
- Daiki YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless Deposition Process for Semiconductor Devices
- Publication number 20250201740
- Publication date Jun 19, 2025
- Wolfspeed, Inc.
- Meagan Lenore Coleman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...
- Publication number 20250201646
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED COOLING PACKAGE FOR IMPROVED THERMAL MANAGEMENT FOR ELECTR...
- Publication number 20250201653
- Publication date Jun 19, 2025
- Vishay General Semiconductor LLC
- Huiying DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND PACKAGE INCLUDING INDUCTOR AND VERTICAL INTE...
- Publication number 20250201702
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sangwook HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250201753
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE
- Publication number 20250201690
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME
- Publication number 20250194118
- Publication date Jun 12, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layered Metal Frame Power Package
- Publication number 20250183130
- Publication date Jun 5, 2025
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS

Passive devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic devices with through-substrate interconnects and as...

3D semiconductor device and structure with metal layers

Display device, and tiled display device including the display device

IPD modules with flexible connection scheme in packaging

Module for removing misassembled semiconductor light-emitting eleme...

Display apparatus and manufacturing method thereof

Method of making a fan-out semiconductor assembly with an intermedi...

3D semiconductor memory device and structure

Electronic substrate and electronic device

Light emitting diodes and methods

Display device and method of manufacturing the same

Semiconductor package and related methods

Semiconductor components having conductive vias with aligned back s...

Semiconductor device comprising PN junction diode and Schottky barr...

Alignment-free micro-display architecture

Forming recesses in molding compound of wafer to reduce stress

Capacitor structure and method of making the same

High density substrate routing in package

Curved light-emitting substrate

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor package, wearable device, and temperature detection m...

Switching device and electronic circuit

Integrated circuit package and method

Display device and method for manufacturing the same

Light-emitting device

Power semiconductor device

Display device

Electronic device

Integrated circuit assembly with hybrid bonding

Solder material

Patents Applicationslast 30 patents

Semiconductor structure with a deep trench capacitor structures and...

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

DISPLAY DEVICE

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, ELECTRONI...

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SILICON PHOTONICS CHIP AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE

Power Semiconductor Devices Including Shape-Memory Metallization

LIGHT EMITTING DIODE PACKAGE WITH IMPROVED LIGHT QUALITY

Electronic Component

HYBRID BONDING STRUCTURE AND DISPLAY PANEL

TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...

MULTI-DIE TRANSFORMER POWER MODULES

SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

Technologies for Components Embedded in a Substrate Core

RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES

SPACER FOR EMBEDDED COMPONENT IN CORE

MONITORING OF ELECTRONIC PACKAGES

OPTICAL ELEMENT AND OPTICAL CONCENTRATION MEASURING APPARATUS

Electroless Deposition Process for Semiconductor Devices

SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...

ENHANCED COOLING PACKAGE FOR IMPROVED THERMAL MANAGEMENT FOR ELECTR...

INTEGRATED CIRCUIT AND PACKAGE INCLUDING INDUCTOR AND VERTICAL INTE...

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE

INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

Multi-Layered Metal Frame Power Package