Photolithography

Industry

CPC
H01L2224/11622

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11622Photolithography

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and preparation methods thereof
- Patent number 12,132,022
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 12,106,963
- Issue date Oct 1, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting backplane, manufacturing method therefor and backplane
- Patent number 12,087,892
- Issue date Sep 10, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive terminal for side facing packages
- Patent number 12,080,667
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking semiconductor assemblies with near zero...
- Patent number 12,027,498
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming solder bumps
- Patent number 11,990,437
- Issue date May 21, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip having stepped conductive pillars
- Patent number 11,955,447
- Issue date Apr 9, 2024
- Advanced Micro Devices, Inc.
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 11,894,299
- Issue date Feb 6, 2024
- TAIWAN SEMICONDUCTOR LTD
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including stress-resistant bonding structures and...
- Patent number 11,887,955
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,876,064
- Issue date Jan 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall wetting barrier for conductive pillars
- Patent number 11,694,982
- Issue date Jul 4, 2023
- QUALCOMM Incorporated
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 11,670,510
- Issue date Jun 6, 2023
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for forming self-healing solder joints and repair of same...
- Patent number 11,646,286
- Issue date May 9, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of a semiconductor chip and semiconductor...
- Patent number 11,626,370
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion beam lithography method based on ion beam lithography system
- Patent number 11,538,653
- Issue date Dec 27, 2022
- Beijing Normal University
- Bin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped interconnect bumps in semiconductor devices
- Patent number 11,444,048
- Issue date Sep 13, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking semiconductor assemblies with near zero...
- Patent number 11,393,791
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming vias using silicon on insulator substrate
- Patent number 11,257,744
- Issue date Feb 22, 2022
- Micron Technology, Inc.
- Toshiyuki Maenosono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 11,152,322
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bump planarity control
- Patent number 11,145,612
- Issue date Oct 12, 2021
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive micro pin
- Patent number 11,101,232
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Jui Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer level molded PPGA (pad post grid array) for low cost package
- Patent number 11,094,669
- Issue date Aug 17, 2021
- Dialog Semiconductor B.V.
- Shou Cheng Eric Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First layer interconnect first on carrier approach for EMIB patch
- Patent number 11,088,103
- Issue date Aug 10, 2021
- Intel Corporation
- Changhua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 11,018,007
- Issue date May 25, 2021
- Tessera, Inc.
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and systems for coupling semiconductor substrates
- Patent number 10,971,540
- Issue date Apr 6, 2021
- FLIR Systems, Inc.
- Richard E. Bornfreund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on package structure and method
- Patent number 10,964,666
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 10,957,666
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 10,937,734
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,930,609
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 10,818,583
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...
- Publication number 20240355783
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS
- Publication number 20240250051
- Publication date Jul 25, 2024
- ADVANCED MICRO DEVICES, INC.
- SUMING HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PA...
- Publication number 20240170431
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Chang-Kun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
- Publication number 20240128219
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20240096627
- Publication date Mar 21, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION METHOD
- Publication number 20240055382
- Publication date Feb 15, 2024
- Rohm and Haas Electronic Materials L.L.C.
- Mitsuru Haga
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...
- Publication number 20240006360
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION METHOD
- Publication number 20230420401
- Publication date Dec 28, 2023
- Rohm and Haas Electronic Materials L.L.C.
- Mitsuru Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20230268302
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND METHOD OF MAN...
- Publication number 20230253336
- Publication date Aug 10, 2023
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS
- Publication number 20230154878
- Publication date May 18, 2023
- ADVANCED MICRO DEVICES, INC.
- SUMING HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBERS WITH UNOBSTRUCTED INTERFACIAL AREA FOR DIE ATTAC...
- Publication number 20230137996
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE
- Publication number 20230131247
- Publication date Apr 27, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS
- Publication number 20230123307
- Publication date Apr 20, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES
- Publication number 20230082120
- Publication date Mar 16, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
- Publication number 20230065797
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF
- Publication number 20230054495
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH
- Publication number 20230027030
- Publication date Jan 26, 2023
- Intel Corporation
- Changhua LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES
- Publication number 20230012200
- Publication date Jan 12, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE AND WIRING SUBSTRATE
- Publication number 20220399297
- Publication date Dec 15, 2022
- Shinko Electric Industries Co., Ltd.
- Yoko NAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...
- Publication number 20220384204
- Publication date Dec 1, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220328443
- Publication date Oct 13, 2022
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- HAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...
- Publication number 20220293569
- Publication date Sep 15, 2022
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL WETTING BARRIER FOR CONDUCTIVE PILLARS
- Publication number 20220270995
- Publication date Aug 25, 2022
- QUALCOMM Incorporated
- Wei HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure And Manufacturing Method Thereof
- Publication number 20220148990
- Publication date May 12, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND SEMICONDUCTOR...
- Publication number 20220093521
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20220093550
- Publication date Mar 24, 2022
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK PLATE AND MANUFACTURING METHOD THEREOF, METHOD FOR BONDING CHI...
- Publication number 20220068873
- Publication date Mar 3, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Guangcai YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframes in Semiconductor Devices
- Publication number 20220037277
- Publication date Feb 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH
- Publication number 20210343673
- Publication date Nov 4, 2021
- Intel Corporation
- Changhua LIU
- H01 - BASIC ELECTRIC ELEMENTS

Photolithography

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and preparation methods thereof

Self aligned pattern formation post spacer etchback in tight pitch...

Supporting backplane, manufacturing method therefor and backplane

Conductive terminal for side facing packages

Three-dimensional stacking semiconductor assemblies with near zero...

System and method for forming solder bumps

Semiconductor chip having stepped conductive pillars

Conductive traces in semiconductor devices and methods of forming same

Semiconductor die including stress-resistant bonding structures and...

Semiconductor structure and manufacturing method thereof

Sidewall wetting barrier for conductive pillars

Self aligned pattern formation post spacer etchback in tight pitch...

Processes for forming self-healing solder joints and repair of same...

Interconnection structure of a semiconductor chip and semiconductor...

Ion beam lithography method based on ion beam lithography system

Shaped interconnect bumps in semiconductor devices

Three-dimensional stacking semiconductor assemblies with near zero...

Method of forming vias using silicon on insulator substrate

Leadframes in semiconductor devices

Methods for bump planarity control

Conductive micro pin

Wafer level molded PPGA (pad post grid array) for low cost package

First layer interconnect first on carrier approach for EMIB patch

Self aligned pattern formation post spacer etchback in tight pitch...

Method and systems for coupling semiconductor substrates

Chip on package structure and method

Pre-molded leadframes in semiconductor devices

Conductive traces in semiconductor devices and methods of forming same

Method of forming a solder bump structure

Semiconductor devices, methods of manufacture thereof, and semicond...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...

SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PA...

SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

METALLIZATION METHOD

SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...

METALLIZATION METHOD

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND METHOD OF MAN...

SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS

CONDUCTIVE MEMBERS WITH UNOBSTRUCTED INTERFACIAL AREA FOR DIE ATTAC...

SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE

ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES

SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...

SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF

FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH

SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES

TERMINAL STRUCTURE AND WIRING SUBSTRATE

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...

PACKAGE STRUCTURE AND FORMING METHOD THEREOF

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...

SIDEWALL WETTING BARRIER FOR CONDUCTIVE PILLARS

Semiconductor Structure And Manufacturing Method Thereof

INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND SEMICONDUCTOR...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

BACK PLATE AND MANUFACTURING METHOD THEREOF, METHOD FOR BONDING CHI...

Leadframes in Semiconductor Devices

FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH