Physical or chemical etching

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H01L2224/0361

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0361Physical or chemical etching

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure and method
- Patent number 12,154,876
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
OLED display panel and manufacturing method thereof
- Patent number 12,108,636
- Issue date Oct 1, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Jia Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor struct...
- Patent number 12,100,677
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 12,087,719
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method of manufacturing same
- Patent number 12,074,126
- Issue date Aug 27, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 12,068,287
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup element and electronic apparatus
- Patent number 12,051,713
- Issue date Jul 30, 2024
- Sony Group Corporation
- Keishi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor packages including the same
- Patent number 12,040,294
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for copper dishing control
- Patent number 12,033,964
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer and integrated circuit including redistributio...
- Patent number 12,021,046
- Issue date Jun 25, 2024
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 12,014,972
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 11,990,430
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with via openings and methods of making th...
- Patent number 11,990,431
- Issue date May 21, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including a terminal pad associated with a conductive tra...
- Patent number 11,967,572
- Issue date Apr 23, 2024
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,955,444
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Manikandan Arumugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including an airgap containing bonding-level dielec...
- Patent number 11,948,902
- Issue date Apr 2, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with slanted conductive...
- Patent number 11,935,850
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,923,326
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240413106
- Publication date Dec 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...
- Publication number 20240395745
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Jun Kyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Interconnect Structure and Method
- Publication number 20240395748
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
- Publication number 20240387419
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STRUCTURE FOR BOND PAD
- Publication number 20240387424
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379504
- Publication date Nov 14, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...
- Publication number 20240363564
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS
- Publication number 20240363570
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jose Daniel Carlos Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347510
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jeongil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...
- Publication number 20240332227
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240266277
- Publication date Aug 8, 2024
- AOI ELECTRONICS CO., LTD.
- Katsuhiro TAKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY INCLUDING TERMINAL PADS ASSOCIATED WITH CONDUCTIVE TRACES...
- Publication number 20240258256
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258257
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Manikandan ARUMUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20240258252
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240243152
- Publication date Jul 18, 2024
- SK HYNIX INC.
- Jeong Mook CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...
- Publication number 20240243081
- Publication date Jul 18, 2024
- SK HYNIX INC.
- Byung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHO...
- Publication number 20240222315
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED GRAIN GROWTH FOR BONDING AND BONDED STRUCTURE WITH CONTR...
- Publication number 20240213191
- Publication date Jun 27, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...
- Publication number 20240170350
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Integration of a First Substrate without Solder Bumps wit...
- Publication number 20240128209
- Publication date Apr 18, 2024
- Newport Fab, LLC dba Tower Semiconductor Newport Beach
- Edward Preisler
- H01 - BASIC ELECTRIC ELEMENTS

Physical or chemical etching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process flow for fabrication of cap metal over top metal with sinte...

Semiconductor interconnect structure and method

Method of fabricating a semiconductor device

Bonding structures of integrated circuit devices and method forming...

Patterned and planarized under-bump metallization

Method for fabricating semiconductor device with redistribution plugs

OLED display panel and manufacturing method thereof

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Semiconductor structure and method for forming semiconductor struct...

Bond pad with micro-protrusions for direct metallic bonding

Methods and devices for fabricating and assembling printable semico...

Semiconductor structure and method of manufacturing same

Stacked semiconductor structure and method

Solid-state image pickup element and electronic apparatus

Semiconductor devices and semiconductor packages including the same

Chemical mechanical polishing for copper dishing control

Redistribution layer and integrated circuit including redistributio...

Integration and bonding of micro-devices into system substrate

Semiconductor devices including through-silicon-vias and methods of...

Semiconductor device with composite conductive features and method...

Multiple plated via arrays of different wire heights on a same subs...

Fingerprint sensor and manufacturing method thereof

Bonding structures of integrated circuit devices and method forming...

Semiconductor structures with via openings and methods of making th...

Apparatus including a terminal pad associated with a conductive tra...

Semiconductor structure and manufacturing method thereof

Bonded assembly including an airgap containing bonding-level dielec...

Method for fabricating semiconductor device with slanted conductive...

Silicon photonic interposer with two metal redistribution layers

Bump structure and method of manufacturing bump structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...

Semiconductor Interconnect Structure and Method

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL

FILM STRUCTURE FOR BOND PAD

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...

INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ASSEMBLY INCLUDING TERMINAL PADS ASSOCIATED WITH CONDUCTIVE TRACES...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...

DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHO...

CONTROLLED GRAIN GROWTH FOR BONDING AND BONDED STRUCTURE WITH CONTR...

MULTI-METAL CONTACT STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...

Efficient Integration of a First Substrate without Solder Bumps wit...