Physical vapour deposition [PVD]

Industry

CPC
H01L2224/03826

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03826Physical vapour deposition [PVD]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package structure and manufacturing method thereof
- Patent number 11,955,443
- Issue date Apr 9, 2024
- Amazing Cool Technology Corp
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 11,913,107
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Yueh Sheng Ow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,456,264
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Yoshiaki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,450
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,451
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,978,414
- Issue date Apr 13, 2021
- ABLIC INC.
- Shinjiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,950,565
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,741,514
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,720,402
- Issue date Jul 21, 2020
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,607,954
- Issue date Mar 31, 2020
- ABLIC INC.
- Shinjiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,600,750
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,586,776
- Issue date Mar 10, 2020
- ABLIC INC.
- Yoichi Mimuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 10,497,853
- Issue date Dec 3, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 10,468,579
- Issue date Nov 5, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,297,562
- Issue date May 21, 2019
- ABLIC INC.
- Kaku Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 10,269,743
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and integrated circuit wafer with guard ring
- Patent number 10,026,699
- Issue date Jul 17, 2018
- Synaptics Japan GK
- Atsushi Obuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal routing architecture for integrated circuits
- Patent number 9,881,885
- Issue date Jan 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching agent for copper or copper alloy
- Patent number 9,790,600
- Issue date Oct 17, 2017
- Entegris, Inc.
- Tsutomu Kojima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming Cu pillar bump with non-metal sidewall spacer and...
- Patent number 9,685,372
- Issue date Jun 20, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Die substrate assembly and method
- Patent number 9,324,674
- Issue date Apr 26, 2016
- Ampleon Netherlands B.V.
- Johannes Wilhelmus van Rijckevorsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal routing architecture for integrated circuits
- Patent number 9,224,688
- Issue date Dec 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching agent for copper or copper alloy
- Patent number 9,175,404
- Issue date Nov 3, 2015
- Advanced Technology Materials, Inc.
- Tsutomu Kojima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cu pillar bump with non-metal sidewall spacer and metal top cap
- Patent number 9,018,758
- Issue date Apr 28, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...
- Publication number 20240332227
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF FLIP CHIP PACKAGE STRUCTURE
- Publication number 20240203914
- Publication date Jun 20, 2024
- Amazing Cool Technology Corp
- Shiann-Tsong TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260936
- Publication date Aug 17, 2023
- Amazing Cool Technology Corp
- Shiann-Tsong TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20210140029
- Publication date May 13, 2021
- Applied Materials, Inc.
- YUEH SHENG OW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...
- Publication number 20200203297
- Publication date Jun 25, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20200185343
- Publication date Jun 11, 2020
- ABLIC Inc.
- Shinjiro KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20200075522
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...
- Publication number 20200013749
- Publication date Jan 9, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING BUMP BONDS
- Publication number 20200006620
- Publication date Jan 2, 2020
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING BUMP BONDS
- Publication number 20200006621
- Publication date Jan 2, 2020
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20190244919
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING BUMP BONDS
- Publication number 20180366634
- Publication date Dec 20, 2018
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20170338169
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE SCALE INTEGRATED CIRCUIT CHIP AND LARGE SCALE INTEGRATED CIRC...
- Publication number 20170278805
- Publication date Sep 28, 2017
- Synaptics Japan GK
- Atsushi OBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20170221843
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING AGENT FOR COPPER OR COPPER ALLOY
- Publication number 20140238953
- Publication date Aug 28, 2014
- Tsutomu Kojima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrical Connecting Element and Method for Manufacturing the Same
- Publication number 20140217593
- Publication date Aug 7, 2014
- National Chiao Tung University
- Chih CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Routing Architecture for Integrated Circuits
- Publication number 20140191390
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnet Assisted Alignment Method for Wafer Bonding and Wafer Level...
- Publication number 20130252375
- Publication date Sep 26, 2013
- Ge Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH NON-METAL SIDEWALL SPACER AND METAL TOP CAP
- Publication number 20110298123
- Publication date Dec 8, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of low temperature wafer bonding through Au/Ag diffusion
- Publication number 20080194077
- Publication date Aug 14, 2008
- National Central University
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS

Physical vapour deposition [PVD]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Flip chip package structure and manufacturing method thereof

Methods and apparatus for processing a substrate

Bonding process with inhibited oxide formation

Bonding process with inhibited oxide formation

Method of manufacturing semiconductor device

Superconducting bump bonds

Superconducting bump bonds

Semiconductor device and method of manufacturing a semiconductor de...

Method of forming an electrical contact and method of forming a chi...

Interconnect structures for preventing solder bridging, and associa...

Bonding process with inhibited oxide formation

Fabrication of solder balls with injection molded solder

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing a semiconductor de...

Interconnect structures for preventing solder bridging, and associa...

Semiconductor device and method of manufacturing the same

Superconducting bump bonds

Superconducting bump bonds

Chip package and method of forming a chip package with a metal cont...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor devices and methods of manufacture thereof

Integrated circuit chip and integrated circuit wafer with guard ring

Metal routing architecture for integrated circuits

Etching agent for copper or copper alloy

Method of forming Cu pillar bump with non-metal sidewall spacer and...

Die substrate assembly and method

Metal routing architecture for integrated circuits

Etching agent for copper or copper alloy

Cu pillar bump with non-metal sidewall spacer and metal top cap

Patents Applicationslast 30 patents

SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...

MANUFACTURING METHOD OF FLIP CHIP PACKAGE STRUCTURE

FLIP CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...

SUPERCONDUCTING BUMP BONDS

SUPERCONDUCTING BUMP BONDS

Semiconductor Devices and Methods of Manufacture Thereof

SUPERCONDUCTING BUMP BONDS

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

LARGE SCALE INTEGRATED CIRCUIT CHIP AND LARGE SCALE INTEGRATED CIRC...

Semiconductor Devices and Methods of Manufacture Thereof

ETCHING AGENT FOR COPPER OR COPPER ALLOY

Electrical Connecting Element and Method for Manufacturing the Same

Metal Routing Architecture for Integrated Circuits

Magnet Assisted Alignment Method for Wafer Bonding and Wafer Level...

CU PILLAR BUMP WITH NON-METAL SIDEWALL SPACER AND METAL TOP CAP

Method of low temperature wafer bonding through Au/Ag diffusion