Plasma being used continuously during the ALD cycle

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CPC
C23C16/45538

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CCHEMISTRY METALLURGY C23Surface treatment C23CCOATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating

Current Industry

C23C16/45538Plasma being used continuously during the ALD cycle

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Patents Grantslast 30 patents

Information Patent Grant
Deposition method and plasma processing apparatus
- Patent number 12,170,198
- Issue date Dec 17, 2024
- Tokyo Electron Limited
- Hiroyuki Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for forming patterned structures including silico...
- Patent number 12,100,597
- Issue date Sep 24, 2024
- ASM IP Holding B.V.
- Eiichiro Shiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vapor phase photoresists deposition
- Patent number 12,084,764
- Issue date Sep 10, 2024
- Applied Materials, Inc.
- Lakmal Charidu Kalutarage
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing silicon-containing films
- Patent number 11,851,756
- Issue date Dec 26, 2023
- VERSUM MATERIALS US, LLC
- Ming Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition method
- Patent number 11,837,465
- Issue date Dec 5, 2023
- Tokyo Electron Limited
- Jun Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method
- Patent number 11,718,911
- Issue date Aug 8, 2023
- Tokyo Electron Limited
- Takashi Chiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film forming apparatus and film forming method
- Patent number 11,658,008
- Issue date May 23, 2023
- Tokyo Electron Limited
- Munehito Kagaya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a silicon nitride film and film deposition ap...
- Patent number 11,519,067
- Issue date Dec 6, 2022
- Tokyo Electron Limited
- Hitoshi Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deuterium-containing films
- Patent number 11,508,584
- Issue date Nov 22, 2022
- Applied Materials, Inc.
- Sean M. Seutter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing system with tandem source activation for CVD
- Patent number 11,434,567
- Issue date Sep 6, 2022
- Lam Research Corporation
- Adrien LaVoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas supply unit and substrate processing apparatus including the ga...
- Patent number 11,396,702
- Issue date Jul 26, 2022
- ASM IP Holding B.V.
- Young Hoon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin oxide mandrels in patterning
- Patent number 11,355,353
- Issue date Jun 7, 2022
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-function equipment implementing fabrication of high-k dielect...
- Patent number 11,322,348
- Issue date May 3, 2022
- Miin-Jang Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition apparatus, film-forming method using atomic...
- Patent number 11,180,848
- Issue date Nov 23, 2021
- The Japan Steel Works, Ltd.
- Masamitsu Toramaru
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,056,345
- Issue date Jul 6, 2021
- ASM IP Holding B.V.
- Atsuki Fukazawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus including metallized-ceramic tubes for radio-frequency an...
- Patent number 10,964,545
- Issue date Mar 30, 2021
- Lam Research Corporation
- Ramkishan Rao Lingampalli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of metal silicide layers on substrates and chamber compo...
- Patent number 10,950,445
- Issue date Mar 16, 2021
- Applied Materials, Inc.
- Prashant Kumar Kulshreshtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas supply unit and substrate processing apparatus including the ga...
- Patent number 10,934,619
- Issue date Mar 2, 2021
- ASM IP Holding B.V.
- Young Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-k dielectric layer, fabricating method thereof and multi-funct...
- Patent number 10,923,343
- Issue date Feb 16, 2021
- Miin-Jang Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming conformal silicon carbide film by cyclic CVD
- Patent number 10,847,365
- Issue date Nov 24, 2020
- ASM IP Holding B.V.
- Atsuki Fukazawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of metal silicide layers on substrates and chamber compo...
- Patent number 10,734,232
- Issue date Aug 4, 2020
- Applied Materials, Inc.
- Prashant Kumar Kulshreshtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 10,633,739
- Issue date Apr 28, 2020
- Kokusai Electric Corporation
- Yukitomo Hirochi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tandem source activation for CVD of films
- Patent number 10,577,688
- Issue date Mar 3, 2020
- Lam Research Corporation
- Adrien LaVoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming oxynitride film
- Patent number 10,559,458
- Issue date Feb 11, 2020
- ASM IP Holding B.V.
- Hidemi Suemori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing semiconductor films
- Patent number 10,535,527
- Issue date Jan 14, 2020
- Applied Materials, Inc.
- Yi Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Piston ring and method for manufacturing same
- Patent number 10,458,548
- Issue date Oct 29, 2019
- Nippon ITF, Inc.
- Takehiko Ooshiro
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Module including metallized ceramic tubes for RF and gas delivery
- Patent number 10,431,467
- Issue date Oct 1, 2019
- Lam Research Corporation
- Ramkishan Rao Lingampalli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 10,370,763
- Issue date Aug 6, 2019
- Tokyo Electron Limited
- Takahiro Hirano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Techniques and systems for continuous-flow plasma enhanced atomic l...
- Patent number 10,366,898
- Issue date Jul 30, 2019
- Nano-Master, Inc.
- Birol Kuyel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Techniques and systems for continuous-flow plasma enhanced atomic l...
- Patent number 10,361,088
- Issue date Jul 23, 2019
- Nano-Master, Inc.
- Birol Kuyel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON...
- Publication number 20240332071
- Publication date Oct 3, 2024
- Intel Corporation
- Alireza Narimannezhad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING GROUP III-NITRIDE SEMICONDUCTOR
- Publication number 20240266168
- Publication date Aug 8, 2024
- SCREEN Holdings Co., Ltd.
- Masaki INABA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20240254626
- Publication date Aug 1, 2024
- Tokyo Electron Limited
- Hiroki YAMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING GAP-FILLING MATERIALS AND RELATED APPARATUS AND...
- Publication number 20240222190
- Publication date Jul 4, 2024
- ASM IP HOLDING B.V.
- Timothee Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND SYSTEM FOR DEPOSITING BORON NITRIDE
- Publication number 20240209499
- Publication date Jun 27, 2024
- ASM IP HOLDING B.V.
- Miguel Sérgio De Abreu Neto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION DEVICE USING MULTIPLE PULSES TO FILL GAP OF...
- Publication number 20240194448
- Publication date Jun 13, 2024
- Research & Business Foundation Sungkyunkwan University
- Geun Young YEOM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA-ENHANCED MOLYBDENUM DEPOSITION
- Publication number 20240102157
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- TUERXUN AILIHUMAER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITIONS AND METHODS FOR DEPOSITING SILICON-CONTAINING FILMS
- Publication number 20240093366
- Publication date Mar 21, 2024
- VERSUM MATERIALS US, LLC
- MING LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMALLY STABLE RUTHENIUM PRECURSOR COMPOSITION, AND METHOD FOR FO...
- Publication number 20230242560
- Publication date Aug 3, 2023
- UP CHEMICAL CO., LTD.
- Wonyong KOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITION FOR DEPOSITING ANTIMONY-CONTAINING THIN FILM AND METHOD...
- Publication number 20230203655
- Publication date Jun 29, 2023
- DNF CO., LTD.
- Yong Hee KWONE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING A LAYER OF ALUMINIUM NITRIDE (ALN) ON A STRUCT...
- Publication number 20230111123
- Publication date Apr 13, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Maxime LEGALLAIS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEUTERIUM-CONTAINING FILMS
- Publication number 20230037450
- Publication date Feb 9, 2023
- Applied Materials, Inc.
- Sean M. Seutter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR PROCESSING SURFACE OF A SEMICONDUCTOR SUBS...
- Publication number 20220356561
- Publication date Nov 10, 2022
- BENEQ OY
- Mikko SÖDERLUND
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AREA-SELECTIVE ETCHING
- Publication number 20220359215
- Publication date Nov 10, 2022
- ASM IP HOLDING B.V.
- René Henricus Jozef Vervuurt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND SYSTEM FOR FORMING PATTERNED STRUCTURES INCLUDING SILICO...
- Publication number 20220319858
- Publication date Oct 6, 2022
- ASM IP HOLDING B.V.
- Eiichiro Shiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEALING STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20220278298
- Publication date Sep 1, 2022
- IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
- Jin-Seong PARK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCED SUBSTRATE PROCESS CHAMBER CAVITY VOLUME
- Publication number 20220223367
- Publication date Jul 14, 2022
- Applied Materials, Inc.
- Kirankumar Neelasandra SAVANDAIAH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION METHOD
- Publication number 20220084811
- Publication date Mar 17, 2022
- TOKYO ELECTRON LIMITED
- Jun OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS SUPPLY UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE GA...
- Publication number 20220033968
- Publication date Feb 3, 2022
- ASM IP HOLDING B.V.
- Young Hoon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VAPOR PHASE PHOTORESISTS DEPOSITION
- Publication number 20220002869
- Publication date Jan 6, 2022
- Applied Materials, Inc.
- Lakmal Charidu Kalutarage
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THIN LAYER DEPOSITION WITH PLASMA PULSING
- Publication number 20210388497
- Publication date Dec 16, 2021
- Applied Materials, Inc.
- Cong Trinh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION AND VAPOR DEPOSITION REACTOR WITH IN-CHAMBE...
- Publication number 20210388498
- Publication date Dec 16, 2021
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- J. Gary Eden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING APPARATUS AND FILM FORMING METHOD
- Publication number 20210375589
- Publication date Dec 2, 2021
- TOKYO ELECTRON LIMITED
- Munehito KAGAYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TIN OXIDE MANDRELS IN PATTERNING
- Publication number 20210265173
- Publication date Aug 26, 2021
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A STRUCTURE INCLUDING CARBON MATERIAL, STRUCTURE...
- Publication number 20210238742
- Publication date Aug 5, 2021
- ASM IP HOLDING B.V.
- Yoshio Susa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITION, POLYMER, AND METHOD OF PRODUCING SUBSTRATE
- Publication number 20210189553
- Publication date Jun 24, 2021
- JSR Corporation
- Hiroyuki KOMATSU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING A STRUCTURE INCLUDING SILICON OXIDE
- Publication number 20210143003
- Publication date May 13, 2021
- ASM IP HOLDING B.V.
- Hideaki Fukuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-FUNCTION EQUIPMENT IMPLEMENTING FABRICATION OF HIGH-K DIELECT...
- Publication number 20210134587
- Publication date May 6, 2021
- Miin-Jang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS
- Publication number 20210005493
- Publication date Jan 7, 2021
- TOKYO ELECTRON LIMITED
- Toshiaki FUJISATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEUTERIUM-CONTAINING FILMS
- Publication number 20200395218
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- Sean M. Seutter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Plasma being used continuously during the ALD cycle

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Deposition method and plasma processing apparatus

Method and system for forming patterned structures including silico...

Vapor phase photoresists deposition

Methods for depositing silicon-containing films

Deposition method

Deposition method

Film forming apparatus and film forming method

Method for depositing a silicon nitride film and film deposition ap...

Deuterium-containing films

Substrate processing system with tandem source activation for CVD

Gas supply unit and substrate processing apparatus including the ga...

Tin oxide mandrels in patterning

Multi-function equipment implementing fabrication of high-k dielect...

Atomic layer deposition apparatus, film-forming method using atomic...

Method for manufacturing semiconductor device

Apparatus including metallized-ceramic tubes for radio-frequency an...

Deposition of metal silicide layers on substrates and chamber compo...

Gas supply unit and substrate processing apparatus including the ga...

High-k dielectric layer, fabricating method thereof and multi-funct...

Method of forming conformal silicon carbide film by cyclic CVD

Deposition of metal silicide layers on substrates and chamber compo...

Substrate processing apparatus

Tandem source activation for CVD of films

Method of forming oxynitride film

Methods for depositing semiconductor films

Piston ring and method for manufacturing same

Module including metallized ceramic tubes for RF and gas delivery

Plasma processing apparatus

Techniques and systems for continuous-flow plasma enhanced atomic l...

Techniques and systems for continuous-flow plasma enhanced atomic l...

Patents Applicationslast 30 patents

PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON...

METHOD OF MANUFACTURING GROUP III-NITRIDE SEMICONDUCTOR

FILM FORMING METHOD AND FILM FORMING APPARATUS

METHODS FOR FORMING GAP-FILLING MATERIALS AND RELATED APPARATUS AND...

METHOD AND SYSTEM FOR DEPOSITING BORON NITRIDE

ATOMIC LAYER DEPOSITION DEVICE USING MULTIPLE PULSES TO FILL GAP OF...

PLASMA-ENHANCED MOLYBDENUM DEPOSITION

COMPOSITIONS AND METHODS FOR DEPOSITING SILICON-CONTAINING FILMS

THERMALLY STABLE RUTHENIUM PRECURSOR COMPOSITION, AND METHOD FOR FO...

COMPOSITION FOR DEPOSITING ANTIMONY-CONTAINING THIN FILM AND METHOD...

METHOD FOR PRODUCING A LAYER OF ALUMINIUM NITRIDE (ALN) ON A STRUCT...

DEUTERIUM-CONTAINING FILMS

METHOD AND APPARATUS FOR PROCESSING SURFACE OF A SEMICONDUCTOR SUBS...

AREA-SELECTIVE ETCHING

METHOD AND SYSTEM FOR FORMING PATTERNED STRUCTURES INCLUDING SILICO...

SEALING STRUCTURE AND MANUFACTURING METHOD THEREFOR

REDUCED SUBSTRATE PROCESS CHAMBER CAVITY VOLUME

DEPOSITION METHOD

GAS SUPPLY UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE GA...

VAPOR PHASE PHOTORESISTS DEPOSITION

THIN LAYER DEPOSITION WITH PLASMA PULSING

ATOMIC LAYER DEPOSITION AND VAPOR DEPOSITION REACTOR WITH IN-CHAMBE...

FILM FORMING APPARATUS AND FILM FORMING METHOD

TIN OXIDE MANDRELS IN PATTERNING

METHOD OF FORMING A STRUCTURE INCLUDING CARBON MATERIAL, STRUCTURE...

COMPOSITION, POLYMER, AND METHOD OF PRODUCING SUBSTRATE

METHOD OF FORMING A STRUCTURE INCLUDING SILICON OXIDE

MULTI-FUNCTION EQUIPMENT IMPLEMENTING FABRICATION OF HIGH-K DIELECT...

PROCESSING APPARATUS

DEUTERIUM-CONTAINING FILMS