Plasma cleaning

Industry

CPC
H01L2224/85913

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85913Plasma cleaning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging
- Patent number 11,227,852
- Issue date Jan 18, 2022
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging
- Patent number 10,629,562
- Issue date Apr 21, 2020
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package in package
- Patent number 9,768,124
- Issue date Sep 19, 2017
- Amkor Technology, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless chip carrier having improved mountability
- Patent number 9,418,919
- Issue date Aug 16, 2016
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive molding compound and manufact...
- Patent number 7,374,969
- Issue date May 20, 2008
- Samsung Electronics Co., Ltd.
- Byeong-Yeon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device manufacturing method
- Patent number 7,364,941
- Issue date Apr 29, 2008
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit device manufacturing method
- Patent number 6,953,712
- Issue date Oct 11, 2005
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING
- Publication number 20200251440
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Honglin GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING
- Publication number 20190206828
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Honglin GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY
- Publication number 20120181678
- Publication date Jul 19, 2012
- NXP B.V.
- Roelf Anco Jacob GROENHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE THIN FILM COATING IN CHIP PACKAGING
- Publication number 20100164083
- Publication date Jul 1, 2010
- Numonyx B.V.
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AVOIDING ELECTRICAL SHORTS IN PACKAGING
- Publication number 20090165815
- Publication date Jul 2, 2009
- United Test & Assembly Center Ltd.
- Debbie Tuerca ALCALA
- B08 - CLEANING
Information Patent Application
Semiconductor package with conductive molding compound and manufact...
- Publication number 20060097404
- Publication date May 11, 2006
- Byeong-Yeon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit device manufacturing method
- Publication number 20060032049
- Publication date Feb 16, 2006
- SANYO ELECTRIC CO. LTD
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit device manufacturing method
- Publication number 20040152234
- Publication date Aug 5, 2004
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having exposed adhesive sheet and method for m...
- Publication number 20020079578
- Publication date Jun 27, 2002
- NEC Corporation
- Yoshihiro Matsuura
- H01 - BASIC ELECTRIC ELEMENTS

Plasma cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit packaging

Integrated circuit packaging

Semiconductor package in package

Leadless chip carrier having improved mountability

Semiconductor package with conductive molding compound and manufact...

Circuit device manufacturing method

Circuit device manufacturing method

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGING

INTEGRATED CIRCUIT PACKAGING

LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY

PROTECTIVE THIN FILM COATING IN CHIP PACKAGING

AVOIDING ELECTRICAL SHORTS IN PACKAGING

Semiconductor package with conductive molding compound and manufact...

Circuit device manufacturing method

Circuit device manufacturing method

Semiconductor device having exposed adhesive sheet and method for m...