Plasma cleaning

Industry

CPC
H01L2224/83013

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83013Plasma cleaning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Processed stacked dies
- Patent number 12,068,278
- Issue date Aug 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage layers for wafer bonding
- Patent number 11,942,447
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- De-Yang Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for processing devices
- Patent number 11,855,064
- Issue date Dec 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 11,652,083
- Issue date May 16, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device using range compensating mat...
- Patent number 11,626,392
- Issue date Apr 11, 2023
- Silicon Genesis Corporation
- Theodore E. Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 11,472,171
- Issue date Oct 18, 2022
- X Display Company Technology Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Techniques for processing devices
- Patent number 11,037,919
- Issue date Jun 15, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit
- Patent number 10,923,459
- Issue date Feb 16, 2021
- Silicon Genesis Corporation
- Theodore E. Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 10,879,212
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging method and integrated packaged circuit
- Patent number 10,867,959
- Issue date Dec 15, 2020
- Shenzhen Xiuyuan Electronic Technology Co., Ltd
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip wiring method and structure
- Patent number 10,847,496
- Issue date Nov 24, 2020
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die tray with channels
- Patent number 10,796,936
- Issue date Oct 6, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for processing devices
- Patent number 10,727,219
- Issue date Jul 28, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method for producing an optoelectronic...
- Patent number 10,686,099
- Issue date Jun 16, 2020
- OSRAM OLED GmbH
- Sophia Huppmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 10,252,514
- Issue date Apr 9, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method for permanently bonding wafers by a connecting layer by mean...
- Patent number 10,163,681
- Issue date Dec 25, 2018
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding substrates
- Patent number 9,673,167
- Issue date Jun 6, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for bonding metallic contact areas with solution of a sacrif...
- Patent number 9,640,510
- Issue date May 2, 2017
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,550,353
- Issue date Jan 24, 2017
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Mounting method
- Patent number 9,508,679
- Issue date Nov 29, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsuhiko Ueda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,434,150
- Issue date Sep 6, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,358,775
- Issue date Jun 7, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method for coating and bonding substrates
- Patent number 9,358,765
- Issue date Jun 7, 2016
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing formation of oxide on solder
- Patent number 9,132,496
- Issue date Sep 15, 2015
- Raytheon Company
- Buu Q. Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor composite apparatus, method for manufacturing the sem...
- Patent number 9,093,562
- Issue date Jul 28, 2015
- Oki Data Corporation
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Package structure and substrate bonding method
- Patent number 8,916,449
- Issue date Dec 23, 2014
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing formation of oxide on solder
- Patent number 8,844,793
- Issue date Sep 30, 2014
- Raytheon Company
- Buu Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a TSV for 3D packaging of semiconductor device
- Patent number 8,513,061
- Issue date Aug 20, 2013
- Korea Institute of Machinery & Materials
- Jae-Hak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic thermal joint for high power density chips
- Patent number 8,368,205
- Issue date Feb 5, 2013
- Oracle America, Inc.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TECHNIQUES FOR PROCESSING DEVICES
- Publication number 20240371850
- Publication date Nov 7, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Storage Layers For Wafer Bonding
- Publication number 20230387065
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- De-Yang CHIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20230282610
- Publication date Sep 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE LAYERS FOR WAFER BONDING
- Publication number 20230062412
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- De-Yang CHIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROCESSING DEVICES
- Publication number 20210375850
- Publication date Dec 2, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROCESSING DEVICES
- Publication number 20200365575
- Publication date Nov 19, 2020
- Invensas Bonding Technologies, Inc.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20200194409
- Publication date Jun 18, 2020
- Silicon Genesis Corporation
- Theodore E. FONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Wiring Method and Structure
- Publication number 20190295982
- Publication date Sep 26, 2019
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROCESSING DEVICES
- Publication number 20190252364
- Publication date Aug 15, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processed stacked dies
- Publication number 20180331066
- Publication date Nov 15, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die tray with channels
- Publication number 20180182654
- Publication date Jun 28, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20180001614
- Publication date Jan 4, 2018
- X-Celeprint Limited
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20170207193
- Publication date Jul 20, 2017
- X-Celeprint Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20170103964
- Publication date Apr 13, 2017
- X-Celeprint Limited
- Christopher Andrew Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...
- Publication number 20140154867
- Publication date Jun 5, 2014
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...
- Publication number 20140035167
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package Structure and Substrate Bonding Method
- Publication number 20130285248
- Publication date Oct 31, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND APPARATUS FOR APPLYING AN ADHESIVE TO A CIRCUIT BOARD
- Publication number 20120288996
- Publication date Nov 15, 2012
- Seah S. Too
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS
- Publication number 20120153453
- Publication date Jun 21, 2012
- ORACLE AMERICA, INC.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV FOR 3D PACKAGING OF SEMICONDUCTOR DEVICE AND FABRICATION METHOD...
- Publication number 20120153496
- Publication date Jun 21, 2012
- KOREA INSTITUTE OF MACHINERY & MATERIALS
- Jae-Hak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Formation Of Oxide On Solder
- Publication number 20120111925
- Publication date May 10, 2012
- Raytheon Company
- Buu Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
- Publication number 20110081738
- Publication date Apr 7, 2011
- Oki Data Corporation
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
HEAT RESISTANT MASKING TAPE AND USAGE THEREOF
- Publication number 20110045638
- Publication date Feb 24, 2011
- Yorinobu Takamatsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
- Publication number 20060097354
- Publication date May 11, 2006
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Plasma cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Processed stacked dies

Storage layers for wafer bonding

Techniques for processing devices

Processed stacked dies

Method of forming semiconductor device using range compensating mat...

Apparatus and methods for micro-transfer-printing

Techniques for processing devices

Three dimensional integrated circuit

Processed stacked dies

Integrated circuit packaging method and integrated packaged circuit

Chip wiring method and structure

Die tray with channels

Techniques for processing devices

Optoelectronic component and method for producing an optoelectronic...

Apparatus and methods for micro-transfer-printing

Method for permanently bonding wafers by a connecting layer by mean...

Method for bonding substrates

Method for bonding metallic contact areas with solution of a sacrif...

Apparatus and methods for micro-transfer-printing

Mounting method

Apparatus and methods for micro-transfer-printing

Apparatus and methods for micro-transfer-printing

Method for coating and bonding substrates

Chip-on-wafer bonding method and bonding device, and structure comp...

Reducing formation of oxide on solder

Semiconductor composite apparatus, method for manufacturing the sem...

Package structure and substrate bonding method

Reducing formation of oxide on solder

Method of fabricating a TSV for 3D packaging of semiconductor device

Metallic thermal joint for high power density chips

Patents Applicationslast 30 patents

TECHNIQUES FOR PROCESSING DEVICES

Storage Layers For Wafer Bonding

PROCESSED STACKED DIES

STORAGE LAYERS FOR WAFER BONDING

TECHNIQUES FOR PROCESSING DEVICES

TECHNIQUES FOR PROCESSING DEVICES

THREE DIMENSIONAL INTEGRATED CIRCUIT

Chip Wiring Method and Structure

TECHNIQUES FOR PROCESSING DEVICES

Processed stacked dies

Die tray with channels

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...

Package Structure and Substrate Bonding Method

METHODS AND APPARATUS FOR APPLYING AN ADHESIVE TO A CIRCUIT BOARD

METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS

TSV FOR 3D PACKAGING OF SEMICONDUCTOR DEVICE AND FABRICATION METHOD...

Reducing Formation Of Oxide On Solder

Semiconductor composite apparatus, method for manufacturing the sem...

HEAT RESISTANT MASKING TAPE AND USAGE THEREOF

Semiconductor composite apparatus, method for manufacturing the sem...