Plasma cleaning

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CPC
H01L2224/80013

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80013Plasma cleaning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Technologies for plasma oxidation protection during hybrid bonding...
- Patent number 12,125,818
- Issue date Oct 22, 2024
- Tokyo Electron Limited
- Jack Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for bonding chips
- Patent number 11,990,463
- Issue date May 21, 2024
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,978,719
- Issue date May 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,798,913
- Issue date Oct 24, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 11,791,241
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for bonding of chips
- Patent number 11,764,198
- Issue date Sep 19, 2023
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable hybrid bonded apparatus
- Patent number 11,742,314
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
- Patent number 11,742,315
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED arrays including optical elements configured to t...
- Patent number 11,715,730
- Issue date Aug 1, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared detector having a directly bonded silicon substrate presen...
- Patent number 11,587,971
- Issue date Feb 21, 2023
- L3HARRIS CINCINNATI ELECTRONICS CORPORATION
- Steven Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Left and right projectors for display device
- Patent number 11,508,700
- Issue date Nov 22, 2022
- Meta Platforms Technologies, LLC
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,495,569
- Issue date Nov 8, 2022
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,417,619
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-efficiency red micro-LED with localized current aperture
- Patent number 11,362,237
- Issue date Jun 14, 2022
- Facebook Technologies, LLC
- Berthold Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,335,656
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED structure contacts and substrate contacts
- Patent number 11,329,034
- Issue date May 10, 2022
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a MEMS device by first hybrid bonding a CM...
- Patent number 11,279,615
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die processing
- Patent number 10,985,133
- Issue date Apr 20, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,985,102
- Issue date Apr 20, 2021
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared detector having a directly bonded silicon substrate presen...
- Patent number 10,978,508
- Issue date Apr 13, 2021
- L3 CINCINNATI ELECTRONICS CORPORATION
- Steven Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...
- Patent number 10,910,782
- Issue date Feb 2, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Laurent Vandroux
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 10,847,443
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Plasma activation treatment for wafer bonding
- Patent number 10,790,260
- Issue date Sep 29, 2020
- Yangtze Memory Technologies Co., Ltd.
- Mengyong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 10,784,219
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package structure and wafer level packaging method
- Patent number 10,784,229
- Issue date Sep 22, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
- Patent number 10,714,449
- Issue date Jul 14, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20240304593
- Publication date Sep 12, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20240234154
- Publication date Jul 11, 2024
- Disco Corporation
- Kai MINAMIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures and Processes for Void-Free Hybrid Bonding
- Publication number 20240222313
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE
- Publication number 20240196530
- Publication date Jun 13, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Yukiko KITABATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PROCESS FLOWS FOR HYBRID BONDING
- Publication number 20240170443
- Publication date May 23, 2024
- Ruiping WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BONDING OF CHIPS
- Publication number 20240170474
- Publication date May 23, 2024
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20240136193
- Publication date Apr 25, 2024
- Disco Corporation
- Kai MINAMIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240107740
- Publication date Mar 28, 2024
- ChangXin Memory Technologies, Inc.
- Huihui GUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240030169
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Woon Chun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE HYBRID BONDED APPARATUS
- Publication number 20240021573
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PROCESSING
- Publication number 20240021572
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SURFACE TREATMENT APPARATUS AND DIE BONDING SYSTEM INCLUDING TH...
- Publication number 20230343740
- Publication date Oct 26, 2023
- SEMES CO., LTD.
- Min Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SHAPE CONTROL FOR W2W BONDING
- Publication number 20230326767
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR PLASMA OXIDATION PROTECTION DURING HYBRID BONDING...
- Publication number 20230253361
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Jack Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Etching of Metal
- Publication number 20230108117
- Publication date Apr 6, 2023
- TOKYO ELECTRON LIMITED
- Sergey Voronin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDING METHOD
- Publication number 20230100455
- Publication date Mar 30, 2023
- SEMES CO., LTD.
- Hang Lim LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEFT AND RIGHT PROJECTORS FOR DISPLAY DEVICE
- Publication number 20230034214
- Publication date Feb 2, 2023
- Meta Platforms Technologies, LLC
- Rajendra D. PENDSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20230005876
- Publication date Jan 5, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336395
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20220278063
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20220238479
- Publication date Jul 28, 2022
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...
- Publication number 20220204340
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHIC LIGHT SOURCE WITH INTEGRATED OPTICS BASED ON NONLINEAR F...
- Publication number 20210408761
- Publication date Dec 30, 2021
- Facebook Technologies, LLC
- Maik Andre Scheller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHITE THIN FILM/SILICON SUBSTRATE LAMINATED ASSEMBLY, PROCESS FO...
- Publication number 20210407883
- Publication date Dec 30, 2021
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masataka HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-EFFICIENCY RED MICRO-LED WITH LOCALIZED CURRENT APERTURE
- Publication number 20210376194
- Publication date Dec 2, 2021
- Facebook Technologies, LLC
- Berthold Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE HYBRID BONDED APPARATUS
- Publication number 20210305202
- Publication date Sep 30, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PROCESSING
- Publication number 20210233888
- Publication date Jul 29, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFRARED DETECTOR HAVING A DIRECTLY BONDED SILICON SUBSTRATE PRESEN...
- Publication number 20210217790
- Publication date Jul 15, 2021
- L3 Cincinnati Electronics Corporation
- Steven ALLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEFT AND RIGHT PROJECTORS FOR DISPLAY DEVICE
- Publication number 20210175216
- Publication date Jun 10, 2021
- Facebook Technologies, LLC
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BONDING OF CHIPS
- Publication number 20210134782
- Publication date May 6, 2021
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS

Plasma cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Technologies for plasma oxidation protection during hybrid bonding...

Device for bonding chips

Metal-dielectric bonding method and structure

MEMS device having a metallization structure embedded in a dielectr...

Semiconductor device and method of manufacturing

Metal-dielectric bonding method and structure

Front-to-back bonding with through-substrate via (TSV)

Method and device for bonding of chips

Reliable hybrid bonded apparatus

Die processing

Direct-bonded LED arrays including optical elements configured to t...

Infrared detector having a directly bonded silicon substrate presen...

Semiconductor device, fabrication method for a semiconductor device...

Left and right projectors for display device

Metal-dielectric bonding method and structure

Package and manufacturing method thereof

High-efficiency red micro-LED with localized current aperture

Semiconductor device and method of manufacturing

Direct-bonded LED structure contacts and substrate contacts

Method for manufacturing a MEMS device by first hybrid bonding a CM...

Die processing

Semiconductor device, fabrication method for a semiconductor device...

Infrared detector having a directly bonded silicon substrate presen...

Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...

Front-to-back bonding with through-substrate via (TSV)

Bonding system

Plasma activation treatment for wafer bonding

Semiconductor device and method of manufacturing

Wafer level package structure and wafer level packaging method

Die processing

Patents Applicationslast 30 patents

DIRECT BONDING METHODS AND STRUCTURES

METHOD OF PROCESSING WAFER

Structures and Processes for Void-Free Hybrid Bonding

MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE

INTEGRATED PROCESS FLOWS FOR HYBRID BONDING

METHOD AND DEVICE FOR BONDING OF CHIPS

METHOD OF PROCESSING WAFER

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

RELIABLE HYBRID BONDED APPARATUS

DIE PROCESSING

DIE SURFACE TREATMENT APPARATUS AND DIE BONDING SYSTEM INCLUDING TH...

WAFER SHAPE CONTROL FOR W2W BONDING

TECHNOLOGIES FOR PLASMA OXIDATION PROTECTION DURING HYBRID BONDING...

Method for Etching of Metal

BONDING METHOD

LEFT AND RIGHT PROJECTORS FOR DISPLAY DEVICE

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Manufacturing

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...

MONOLITHIC LIGHT SOURCE WITH INTEGRATED OPTICS BASED ON NONLINEAR F...

GRAPHITE THIN FILM/SILICON SUBSTRATE LAMINATED ASSEMBLY, PROCESS FO...

HIGH-EFFICIENCY RED MICRO-LED WITH LOCALIZED CURRENT APERTURE

RELIABLE HYBRID BONDED APPARATUS

DIE PROCESSING

INFRARED DETECTOR HAVING A DIRECTLY BONDED SILICON SUBSTRATE PRESEN...

LEFT AND RIGHT PROJECTORS FOR DISPLAY DEVICE

METHOD AND DEVICE FOR BONDING OF CHIPS