TREA

Plated through-holes or plated blind vias filled with insulating material

Follow

Industry

  • CPC
  • H05K2201/0959
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0959Plated through-holes or plated blind vias filled with insulating material
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Wiring board
    • Patent number 12,101,894
    • Issue date Sep 24, 2024
    • Shinko Electric Industries Co., Ltd.
    • Junichi Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Through-hole electrode substrate
    • Patent number 12,080,637
    • Issue date Sep 3, 2024
    • Dai Nippon Printing Co., Ltd.
    • Satoru Kuramochi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit board having laminated build-up layers
    • Patent number 12,057,381
    • Issue date Aug 6, 2024
    • Unimicron Technology Corp.
    • Chih-Chiang Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Printed wiring board
    • Patent number 12,041,729
    • Issue date Jul 16, 2024
    • Ibiden Co., Ltd.
    • Satoru Kawai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for manufacturing multilayer printed circuit board
    • Patent number 12,016,119
    • Issue date Jun 18, 2024
    • HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    • Cheng-Jia Li
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board and method of manufacturing the same
    • Patent number 12,016,128
    • Issue date Jun 18, 2024
    • LG Innotek Co., Ltd
    • Min Young Hwang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Three-dimensional (3D) copper in printed circuit boards
    • Patent number 11,956,898
    • Issue date Apr 9, 2024
    • Apple Inc.
    • Anne M. Mason
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Multilayer circuit board and manufacturing method therefor
    • Patent number 11,956,904
    • Issue date Apr 9, 2024
    • STEMCO CO., LTD.
    • Jae Soo Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Inductor built-in substrate
    • Patent number 11,856,699
    • Issue date Dec 26, 2023
    • Ibiden Co., Ltd.
    • Satoru Kawai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed circuit board and vehicle including the same
    • Patent number 11,832,387
    • Issue date Nov 28, 2023
    • Hyundai Mobis Co., Ltd.
    • Myeong Je Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring board
    • Patent number 11,832,388
    • Issue date Nov 28, 2023
    • Shinko Electric Industries Co., Ltd.
    • Masahiro Murakami
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board structure
    • Patent number 11,818,833
    • Issue date Nov 14, 2023
    • Unimicron Technology Corp.
    • Shih-Lian Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Component carrier with through hole filled with extra plating struc...
    • Patent number 11,778,754
    • Issue date Oct 3, 2023
    • AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Robin Zhang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board structure
    • Patent number 11,737,206
    • Issue date Aug 22, 2023
    • Unimicron Technology Corp.
    • Shih-Lian Cheng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Interconnect structure having conductor extending along dielectric...
    • Patent number 11,737,205
    • Issue date Aug 22, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Jiun-Yi Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multilayer circuit board
    • Patent number 11,706,878
    • Issue date Jul 18, 2023
    • INNOGRIT TECHNOLOGIES CO., LTD.
    • Yanwen Bai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate and method of manufacturing the wiring substrate
    • Patent number 11,683,886
    • Issue date Jun 20, 2023
    • Shinko Electric Industries Co., Ltd.
    • Toshiki Shirotori
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic control device
    • Patent number 11,659,651
    • Issue date May 23, 2023
    • Hitachi Astemo, Ltd.
    • Kazuo Maruyama
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring board
    • Patent number 11,647,589
    • Issue date May 9, 2023
    • Shinko Electric Industries Co., Ltd.
    • Shuhei Momose
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring board
    • Patent number 11,632,862
    • Issue date Apr 18, 2023
    • Shinko Electric Industries Co., Ltd.
    • Junichi Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Interconnect structure having conductor extending along dielectric...
    • Patent number 11,457,525
    • Issue date Sep 27, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Jiun-Yi Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Printed circuit board
    • Patent number 11,452,214
    • Issue date Sep 20, 2022
    • HELLA GMBH & CO. KGAA
    • Ralf Stanzmann
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed circuit board
    • Patent number 11,439,026
    • Issue date Sep 6, 2022
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jung-Soo Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Through-hole electrode substrate
    • Patent number 11,362,028
    • Issue date Jun 14, 2022
    • Dai Nippon Printing Co., Ltd.
    • Satoru Kuramochi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Methods of manufacturing printed wire boards
    • Patent number 11,337,309
    • Issue date May 17, 2022
    • Rohm and Haas Electronic Materials LLC
    • Tina Aoude
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring board and manufacture method thereof
    • Patent number 11,289,413
    • Issue date Mar 29, 2022
    • Unimicron Technology Corp.
    • Shih-Liang Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Printed circuit board deformable in both length and width
    • Patent number 11,246,212
    • Issue date Feb 8, 2022
    • Avary Holding (Shenzhen) Co., Limited.
    • Wei-Xiang Li
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Multilayer printed circuit board and method for manufacturing the same
    • Patent number 11,234,331
    • Issue date Jan 25, 2022
    • HongQiSheng Precision Electronics (QingHuangDao) Co., Ltd.
    • Cheng-Jia Li
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed circuit board
    • Patent number 11,229,117
    • Issue date Jan 18, 2022
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jung Soo Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Inductor built-in substrate
    • Patent number 11,197,373
    • Issue date Dec 7, 2021
    • Ibiden Co., Ltd.
    • Satoru Kawai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    THROUGH-HOLE ELECTRODE SUBSTRATE
    • Publication number 20240404934
    • Publication date Dec 5, 2024
    • DAI NIPPON PRINTING CO., LTD.
    • Satoru KURAMOCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Three-Dimensional (3D) Copper in Printed Circuit Boards
    • Publication number 20240306297
    • Publication date Sep 12, 2024
    • Apple Inc.
    • Anne M. Mason
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240298410
    • Publication date Sep 5, 2024
    • LG Innotek Co., Ltd.
    • Min Young HWANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF CIRCUIT BOARD
    • Publication number 20240282687
    • Publication date Aug 22, 2024
    • Unimicron Technology Corp.
    • Chih-Chiang Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240224426
    • Publication date Jul 4, 2024
    • TOPPAN Holdings Inc.
    • Yuki UMEMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240098897
    • Publication date Mar 21, 2024
    • IBIDEN CO., LTD.
    • Yoshio MIZUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240008191
    • Publication date Jan 4, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE STRUCTURE
    • Publication number 20230422411
    • Publication date Dec 28, 2023
    • Subtron Technology Co., Ltd.
    • Chung Ying Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20230422407
    • Publication date Dec 28, 2023
    • Sumitomo Electric Industries, Ltd.
    • Kenji TAKAHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
    • Publication number 20230354503
    • Publication date Nov 2, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Jiun-Yi WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR IN A SUBSTRATE VIA
    • Publication number 20230319997
    • Publication date Oct 5, 2023
    • Intel Corporation
    • Aslam HASWAREY
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230284380
    • Publication date Sep 7, 2023
    • IBIDEN CO., LTD.
    • Kiyoteru OTOMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR AT LEAST PARTIALLY CLOSING A CHANNEL-SHAPED OPENING
    • Publication number 20230262904
    • Publication date Aug 17, 2023
    • Peters Research GmbH & Co. Kommanditgesellschaft
    • Ralf SCHWARTZ
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE, CHIP, CIRCUIT PACKAGE AND FABRICATION PROCESS
    • Publication number 20230262906
    • Publication date Aug 17, 2023
    • Alibaba (China) Co., Ltd.
    • Hui LIU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230232544
    • Publication date Jul 20, 2023
    • LG Innotek Co., Ltd.
    • Myung Jae KWON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20230209729
    • Publication date Jun 29, 2023
    • Shinko Electric Industries Co., Ltd.
    • Junichi NAKAMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE
    • Publication number 20230156908
    • Publication date May 18, 2023
    • Unimicron Technology Corp.
    • Shih-Lian Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE
    • Publication number 20230156909
    • Publication date May 18, 2023
    • Unimicron Technology Corp.
    • Shih-Lian Cheng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND VEHICLE INCLUDING THE SAME
    • Publication number 20230073345
    • Publication date Mar 9, 2023
    • HYUNDAI MOBIS CO., LTD.
    • Myeong Je KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COAXIAL VIA SHIELDED INTERPOSER
    • Publication number 20230063808
    • Publication date Mar 2, 2023
    • Apple Inc.
    • Nima Shahidi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20230063719
    • Publication date Mar 2, 2023
    • IBIDEN CO., LTD.
    • Michimasa TAKAHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    VIA STRUCTURE, METHOD FOR PREPARING SAME AND METHOD FOR REGULATING...
    • Publication number 20230028527
    • Publication date Jan 26, 2023
    • CHANGXIN MEMORY TECHNOLOGIES, INC
    • Yade FANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
    • Publication number 20230009751
    • Publication date Jan 12, 2023
    • Shinko Electric Industries Co., Ltd.
    • Toshiaki Aoki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
    • Publication number 20220386451
    • Publication date Dec 1, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Jiun-Yi WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC CONTROL DEVICE
    • Publication number 20220386454
    • Publication date Dec 1, 2022
    • HITACHI ASTEMO, LTD.
    • Kazuo Maruyama
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20220353990
    • Publication date Nov 3, 2022
    • Shinko Electric Industries Co., Ltd.
    • Masahiro MURAKAMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
    • Publication number 20220232695
    • Publication date Jul 21, 2022
    • Unimicron Technology Corp.
    • Jun-Rui Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE WIRING SUBSTRATE
    • Publication number 20220217844
    • Publication date Jul 7, 2022
    • Shinko Electric Industries Co., Ltd.
    • Toshiki Shirotori
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Multilayer Circuit Board
    • Publication number 20220217851
    • Publication date Jul 7, 2022
    • INNOGRIT TECHNOLOGIES CO., LTD
    • Yanwen BAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Three-Dimensional (3D) Copper in Printed Circuit Boards
    • Publication number 20220095455
    • Publication date Mar 24, 2022
    • Apple Inc.
    • Anne M. Mason
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR