TREA

Plated through-holes or plated blind vias filled with insulating material

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  • CPC
  • H05K2201/0959
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0959Plated through-holes or plated blind vias filled with insulating material
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240098897
    • Publication date Mar 21, 2024
    • IBIDEN CO., LTD.
    • Yoshio MIZUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240008191
    • Publication date Jan 4, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE STRUCTURE
    • Publication number 20230422411
    • Publication date Dec 28, 2023
    • Subtron Technology Co., Ltd.
    • Chung Ying Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20230422407
    • Publication date Dec 28, 2023
    • Sumitomo Electric Industries, Ltd.
    • Kenji TAKAHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
    • Publication number 20230354503
    • Publication date Nov 2, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Jiun-Yi WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR IN A SUBSTRATE VIA
    • Publication number 20230319997
    • Publication date Oct 5, 2023
    • Intel Corporation
    • Aslam HASWAREY
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230284380
    • Publication date Sep 7, 2023
    • IBIDEN CO., LTD.
    • Kiyoteru OTOMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR AT LEAST PARTIALLY CLOSING A CHANNEL-SHAPED OPENING
    • Publication number 20230262904
    • Publication date Aug 17, 2023
    • Peters Research GmbH & Co. Kommanditgesellschaft
    • Ralf SCHWARTZ
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE, CHIP, CIRCUIT PACKAGE AND FABRICATION PROCESS
    • Publication number 20230262906
    • Publication date Aug 17, 2023
    • Alibaba (China) Co., Ltd.
    • Hui LIU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230232544
    • Publication date Jul 20, 2023
    • LG Innotek Co., Ltd.
    • Myung Jae KWON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20230209729
    • Publication date Jun 29, 2023
    • Shinko Electric Industries Co., Ltd.
    • Junichi NAKAMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE
    • Publication number 20230156908
    • Publication date May 18, 2023
    • Unimicron Technology Corp.
    • Shih-Lian Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE
    • Publication number 20230156909
    • Publication date May 18, 2023
    • Unimicron Technology Corp.
    • Shih-Lian Cheng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND VEHICLE INCLUDING THE SAME
    • Publication number 20230073345
    • Publication date Mar 9, 2023
    • HYUNDAI MOBIS CO., LTD.
    • Myeong Je KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COAXIAL VIA SHIELDED INTERPOSER
    • Publication number 20230063808
    • Publication date Mar 2, 2023
    • Apple Inc.
    • Nima Shahidi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20230063719
    • Publication date Mar 2, 2023
    • IBIDEN CO., LTD.
    • Michimasa TAKAHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    VIA STRUCTURE, METHOD FOR PREPARING SAME AND METHOD FOR REGULATING...
    • Publication number 20230028527
    • Publication date Jan 26, 2023
    • CHANGXIN MEMORY TECHNOLOGIES, INC
    • Yade FANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
    • Publication number 20230009751
    • Publication date Jan 12, 2023
    • Shinko Electric Industries Co., Ltd.
    • Toshiaki Aoki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
    • Publication number 20220386451
    • Publication date Dec 1, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Jiun-Yi WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC CONTROL DEVICE
    • Publication number 20220386454
    • Publication date Dec 1, 2022
    • HITACHI ASTEMO, LTD.
    • Kazuo Maruyama
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20220353990
    • Publication date Nov 3, 2022
    • Shinko Electric Industries Co., Ltd.
    • Masahiro MURAKAMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
    • Publication number 20220232695
    • Publication date Jul 21, 2022
    • Unimicron Technology Corp.
    • Jun-Rui Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE WIRING SUBSTRATE
    • Publication number 20220217844
    • Publication date Jul 7, 2022
    • Shinko Electric Industries Co., Ltd.
    • Toshiki Shirotori
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Multilayer Circuit Board
    • Publication number 20220217851
    • Publication date Jul 7, 2022
    • INNOGRIT TECHNOLOGIES CO., LTD
    • Yanwen BAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Three-Dimensional (3D) Copper in Printed Circuit Boards
    • Publication number 20220095455
    • Publication date Mar 24, 2022
    • Apple Inc.
    • Anne M. Mason
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
    • Publication number 20220095451
    • Publication date Mar 24, 2022
    • HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
    • CHENG-JIA LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20220071016
    • Publication date Mar 3, 2022
    • LG INNOTEK CO., LTD
    • Min Young HWANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20220053648
    • Publication date Feb 17, 2022
    • Shinko Electric Industries Co., Ltd.
    • Junichi NAKAMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20220039260
    • Publication date Feb 3, 2022
    • Shinko Electric Industries Co., Ltd.
    • Shuhei MOMOSE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20210337665
    • Publication date Oct 28, 2021
    • HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
    • CHENG-JIA LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR