Plating of solder

Industry

CPC
H05K3/3473

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3473Plating of solder

Industries

Patents Grantslast 30 patents

Information Patent Grant
Pre-plating of solder layer on solderable elements for diffusion so...
- Patent number 12,069,802
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite solder balls metallised on the surface and calibrated for...
- Patent number 12,030,138
- Issue date Jul 9, 2024
- LIPCO INDUSTRIE
- Constantin Iacob
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method relating to electrochemical migration
- Patent number 11,470,727
- Issue date Oct 11, 2022
- Jaguar Land Rover Limited
- Thomas Liedtke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of transformer circuit board and transformer t...
- Patent number 11,367,564
- Issue date Jun 21, 2022
- Eric Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, circuit module, method of manufacturing circuit boar...
- Patent number 11,310,914
- Issue date Apr 19, 2022
- Murata Manufacturing Co., Ltd.
- Takafumi Kusuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,304,307
- Issue date Apr 12, 2022
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,246,224
- Issue date Feb 8, 2022
- Ibiden Co., Ltd.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and method for producing same
- Patent number 11,197,377
- Issue date Dec 7, 2021
- STEMCO CO., LTD.
- Hong Man Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-pinning metal pads for electronic components
- Patent number 11,166,381
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Yves Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solderable solder deposit on a contact pad
- Patent number 11,032,914
- Issue date Jun 8, 2021
- Atotech Deutschland GmbH
- Kai-Jens Matejat
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,019,732
- Issue date May 25, 2021
- Ibiden Co., Ltd.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrates with ultra fine pitch flip chip bumps
- Patent number 10,779,417
- Issue date Sep 15, 2020
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and production method therefor
- Patent number 10,123,415
- Issue date Nov 6, 2018
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via for electrical contact passing through layers of optical wavegu...
- Patent number 9,772,462
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Hirokazu Noma
- G02 - OPTICS
Information Patent Grant
Printed circuit board and method for manufacturing same
- Patent number 9,706,652
- Issue date Jul 11, 2017
- LG Innotek Co., Ltd
- Sung Wuk Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin-based solder composition with low void characteristic
- Patent number 9,604,316
- Issue date Mar 28, 2017
- GLOBALFOUNDRIES Inc.
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,578,745
- Issue date Feb 21, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,380,712
- Issue date Jun 28, 2016
- SHINKO ELECTRIC INDSTRIES CO., LTD.
- Teruaki Chino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via for electrical contact passing through layers of optical wavegu...
- Patent number 9,354,408
- Issue date May 31, 2016
- International Business Machines Corporation
- Hirokazu Noma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for etching a recessed structure filled with tin or a tin a...
- Patent number 9,332,652
- Issue date May 3, 2016
- Atotech Deutschland GmbH
- Neal Wood
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal surface treatment aqueous solution and method for inhibiting...
- Patent number 9,200,168
- Issue date Dec 1, 2015
- Rohm and Haas Electronic Materials LLC
- Yutaka Morii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board and semiconductor device
- Patent number 9,155,195
- Issue date Oct 6, 2015
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method of manufacturing the same, and method...
- Patent number 9,066,457
- Issue date Jun 23, 2015
- Sony Corporation
- Naoto Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board having buried solder...
- Patent number 9,021,690
- Issue date May 5, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing Sn alloy bump
- Patent number 8,822,326
- Issue date Sep 2, 2014
- Mitsubishi Materials Corporation
- Takeshi Hatta
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of manufacturing a printed wiring board
- Patent number 8,713,792
- Issue date May 6, 2014
- Fujitsu Limited
- Taiji Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin and tin alloy electroplating method with controlled internal st...
- Patent number 8,603,315
- Issue date Dec 10, 2013
- Faraday Technology, Inc.
- E. Jennings Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal surface treatment aqueous solution and method for inhibiting...
- Patent number 8,591,638
- Issue date Nov 26, 2013
- Rohm and Haas Electronic Materials LLC
- Yutaka Morii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to form solder deposits on substrates
- Patent number 8,507,376
- Issue date Aug 13, 2013
- Atotech Deutschland GmbH
- Ingo Ewert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device, and semiconductor de...
- Patent number 8,502,379
- Issue date Aug 6, 2013
- Seiko Epson Corporation
- Shigehisa Tajimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20240373548
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE SOLDER BALLS METALLISED ON THE SURFACE AND CALIBRATED FOR...
- Publication number 20220339742
- Publication date Oct 27, 2022
- LIFCO INDUSTRIE
- Constantin IACOB
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20220046792
- Publication date Feb 10, 2022
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD RELATING TO ELECTROCHEMICAL MIGRATION
- Publication number 20210289636
- Publication date Sep 16, 2021
- Jaguar Land Rover Limited
- Thomas LIEDTKE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210068265
- Publication date Mar 4, 2021
- IBIDEN CO., LTD.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210068264
- Publication date Mar 4, 2021
- IBIDEN CO., LTD.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210037660
- Publication date Feb 4, 2021
- IBIDEN CO., LTD.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF TRANSFORMER CIRCUIT BOARD AND TRANSFORMER T...
- Publication number 20200203065
- Publication date Jun 25, 2020
- Eric Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
- Publication number 20200196453
- Publication date Jun 18, 2020
- STEMCO CO., LTD.
- Hong Man KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, CIRCUIT MODULE, METHOD OF MANUFACTURING CIRCUIT BOAR...
- Publication number 20200120806
- Publication date Apr 16, 2020
- MURATA MANUFACTURING CO., LTD.
- Takafumi KUSUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder-Pinning Metal Pads for Electronic Components
- Publication number 20200100369
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Yves Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD
- Publication number 20190350088
- Publication date Nov 14, 2019
- Atotech Deutschland GmbH
- Kai-Jens MATEJAT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated...
- Publication number 20180255646
- Publication date Sep 6, 2018
- JX NIPPON MINING & METALS CORPORATION
- Terumasa Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrates with Ultra Fine Pitch Flip Chip Bumps
- Publication number 20170374747
- Publication date Dec 28, 2017
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF MANUFACTURING PACKAGE THEREOF
- Publication number 20160255726
- Publication date Sep 1, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jin O YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID IMMERSION TRANSFER OF ELECTRONICS
- Publication number 20160198577
- Publication date Jul 7, 2016
- Koninklijke Philips N.V.
- Esther Anna Wilhelmina Gerarda Janssen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TIN-BASED SOLDER COMPOSITION WITH LOW VOID CHARACTERISTIC
- Publication number 20160082551
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION
- Publication number 20140202739
- Publication date Jul 24, 2014
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20140146503
- Publication date May 29, 2014
- Shinko Electric Industries Co., Ltd.
- Teruaki Chino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR ETCHING A RECESSED STRUCTURE FILLED WITH TIN OR A TIN A...
- Publication number 20140000650
- Publication date Jan 2, 2014
- Atotech Deutschland GmbH
- Neal Wood
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140000947
- Publication date Jan 2, 2014
- LG Innotek Co., Ltd.
- Sung Wuk Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING Sn ALLOY BUMP
- Publication number 20130309862
- Publication date Nov 21, 2013
- Takeshi Hatta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL SURFACE TREATMENT AQUEOUS SOLUTION AND METHOD FOR INHIBITING...
- Publication number 20130284066
- Publication date Oct 31, 2013
- Yutaka MORII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20130235543
- Publication date Sep 12, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON S...
- Publication number 20130105329
- Publication date May 2, 2013
- Atotech Deutschland GmbH
- Kai-Jens Matejat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD...
- Publication number 20120241949
- Publication date Sep 27, 2012
- SONY CORPORATION
- Naoto Sasaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGING SUBSTRATE WITH CONDUCTIVE STRUCTURE
- Publication number 20120181688
- Publication date Jul 19, 2012
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120175265
- Publication date Jul 12, 2012
- Unimicron Technology Corp.
- Sao-Hsia Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120152598
- Publication date Jun 21, 2012
- NGK SPARK PLUG CO., LTD.
- Erina YAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120152597
- Publication date Jun 21, 2012
- NGK SPARK PLUG CO., LTD.
- Erina YAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Plating of solder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pre-plating of solder layer on solderable elements for diffusion so...

Composite solder balls metallised on the surface and calibrated for...

Apparatus and method relating to electrochemical migration

Manufacturing method of transformer circuit board and transformer t...

Circuit board, circuit module, method of manufacturing circuit boar...

Printed wiring board and method for manufacturing printed wiring board

Method for manufacturing printed wiring board

Flexible circuit board and method for producing same

Solder-pinning metal pads for electronic components

Method of forming a solderable solder deposit on a contact pad

Printed wiring board and method for manufacturing the same

Substrates with ultra fine pitch flip chip bumps

Wiring substrate and production method therefor

Via for electrical contact passing through layers of optical wavegu...

Printed circuit board and method for manufacturing same

Tin-based solder composition with low void characteristic

Printed wiring board, method for manufacturing printed wiring board...

Wiring substrate and semiconductor device

Via for electrical contact passing through layers of optical wavegu...

Process for etching a recessed structure filled with tin or a tin a...

Metal surface treatment aqueous solution and method for inhibiting...

Wiring board and semiconductor device

Semiconductor device, method of manufacturing the same, and method...

Method of manufacturing printed circuit board having buried solder...

Method for manufacturing Sn alloy bump

Method of manufacturing a printed wiring board

Tin and tin alloy electroplating method with controlled internal st...

Metal surface treatment aqueous solution and method for inhibiting...

Method to form solder deposits on substrates

Method for manufacturing semiconductor device, and semiconductor de...

Patents Applicationslast 30 patents

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

COMPOSITE SOLDER BALLS METALLISED ON THE SURFACE AND CALIBRATED FOR...

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

APPARATUS AND METHOD RELATING TO ELECTROCHEMICAL MIGRATION

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

MANUFACTURING METHOD OF TRANSFORMER CIRCUIT BOARD AND TRANSFORMER T...

FLEXIBLE CIRCUIT BOARD AND METHOD FOR PRODUCING SAME

CIRCUIT BOARD, CIRCUIT MODULE, METHOD OF MANUFACTURING CIRCUIT BOAR...

Solder-Pinning Metal Pads for Electronic Components

METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD

Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated...

Substrates with Ultra Fine Pitch Flip Chip Bumps

PACKAGE AND METHOD OF MANUFACTURING PACKAGE THEREOF

LIQUID IMMERSION TRANSFER OF ELECTRONICS

TIN-BASED SOLDER COMPOSITION WITH LOW VOID CHARACTERISTIC

PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

PROCESS FOR ETCHING A RECESSED STRUCTURE FILLED WITH TIN OR A TIN A...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING Sn ALLOY BUMP

METAL SURFACE TREATMENT AQUEOUS SOLUTION AND METHOD FOR INHIBITING...

WIRING BOARD AND SEMICONDUCTOR DEVICE

METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON S...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD...

PACKAGING SUBSTRATE WITH CONDUCTIVE STRUCTURE

CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME